JPS6480056A - Manufacture of conductive material for electronic component - Google Patents
Manufacture of conductive material for electronic componentInfo
- Publication number
- JPS6480056A JPS6480056A JP23680387A JP23680387A JPS6480056A JP S6480056 A JPS6480056 A JP S6480056A JP 23680387 A JP23680387 A JP 23680387A JP 23680387 A JP23680387 A JP 23680387A JP S6480056 A JPS6480056 A JP S6480056A
- Authority
- JP
- Japan
- Prior art keywords
- plating layer
- sheet
- alloy
- basic material
- diffusion layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Non-Insulated Conductors (AREA)
Abstract
PURPOSE:To improve adhesion between the surface of a basic material and a nickel based plating layer and contrive the stability of conductive characteristics, by making use of a copper based metallic sheet as the basic material and forming a diffusion layer consisting of Ni-Cu alloys between the basic material and the Ni based plating layer. CONSTITUTION:A plating layer consisting of Ni or a nickel alloy is formed at the surface of a basic material sheet consisting of copper or a copper alloy. A diffusion layer consisting of a Cu-Ni alloy is formed between the basic mate rial sheet and the plating layer by heating at a temperature of 250-500 deg.C the above sheet where the plating layer is formed. After forming the diffusion layer, the above sheet where the diffusion layer is formed is processed by quenched and tempered rolling. Further, after performing a quenched and tem pered rolling process, it may be as well to conduct a process where the plating layer consisting of Sn or an Sn alloy is formed further at the surface of the above plating layer. This approach improves adhesion between the surface and the Ni based plating layer and contrives the stability of conductive characteristics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23680387A JPS6480056A (en) | 1987-09-21 | 1987-09-21 | Manufacture of conductive material for electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23680387A JPS6480056A (en) | 1987-09-21 | 1987-09-21 | Manufacture of conductive material for electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6480056A true JPS6480056A (en) | 1989-03-24 |
Family
ID=17006016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23680387A Pending JPS6480056A (en) | 1987-09-21 | 1987-09-21 | Manufacture of conductive material for electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6480056A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01180951A (en) * | 1988-01-11 | 1989-07-18 | Kobe Steel Ltd | Manufacture of nickel-plated copper alloy bar for terminal and connector |
| JPH03219064A (en) * | 1990-01-24 | 1991-09-26 | Mitsubishi Electric Corp | Electronic equipment parts |
| JP2006161127A (en) * | 2004-12-09 | 2006-06-22 | Takamatsu Mekki:Kk | Electronic material suitable for insertion type connection terminal and method for producing the same |
| WO2009157456A1 (en) * | 2008-06-24 | 2009-12-30 | 古河電気工業株式会社 | Composite material for electrical/electronic component and electrical/electronic component using the same |
| JP2018129226A (en) * | 2017-02-09 | 2018-08-16 | 三菱マテリアル株式会社 | Copper terminal material and method for manufacturing the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60105259A (en) * | 1983-11-11 | 1985-06-10 | Hitachi Cable Ltd | Lead frame material for semiconductor apparatus |
| JPS60153152A (en) * | 1984-01-20 | 1985-08-12 | Hitachi Cable Ltd | Manufacture of lead frame member for semiconductor apparatus |
-
1987
- 1987-09-21 JP JP23680387A patent/JPS6480056A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60105259A (en) * | 1983-11-11 | 1985-06-10 | Hitachi Cable Ltd | Lead frame material for semiconductor apparatus |
| JPS60153152A (en) * | 1984-01-20 | 1985-08-12 | Hitachi Cable Ltd | Manufacture of lead frame member for semiconductor apparatus |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01180951A (en) * | 1988-01-11 | 1989-07-18 | Kobe Steel Ltd | Manufacture of nickel-plated copper alloy bar for terminal and connector |
| JPH03219064A (en) * | 1990-01-24 | 1991-09-26 | Mitsubishi Electric Corp | Electronic equipment parts |
| JP2006161127A (en) * | 2004-12-09 | 2006-06-22 | Takamatsu Mekki:Kk | Electronic material suitable for insertion type connection terminal and method for producing the same |
| WO2009157456A1 (en) * | 2008-06-24 | 2009-12-30 | 古河電気工業株式会社 | Composite material for electrical/electronic component and electrical/electronic component using the same |
| US8337997B2 (en) | 2008-06-24 | 2012-12-25 | The Furukawa Electric Co., Ltd. | Composite material for electrical/electronic part and electrical/electronic part using the same |
| JP2018129226A (en) * | 2017-02-09 | 2018-08-16 | 三菱マテリアル株式会社 | Copper terminal material and method for manufacturing the same |
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