JPS6474749A - Manufacture of conductive material for electronic component - Google Patents
Manufacture of conductive material for electronic componentInfo
- Publication number
- JPS6474749A JPS6474749A JP23308087A JP23308087A JPS6474749A JP S6474749 A JPS6474749 A JP S6474749A JP 23308087 A JP23308087 A JP 23308087A JP 23308087 A JP23308087 A JP 23308087A JP S6474749 A JPS6474749 A JP S6474749A
- Authority
- JP
- Japan
- Prior art keywords
- base material
- layer
- alloy
- plated layer
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Non-Insulated Conductors (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
PURPOSE:To improve remarkedly the adherence of a base material with an Ni-plated layer on the surface of the base material and to enhance the stability and the reliability of conduction characteristics by a method wherein a steel sheet is used as the base material and moreover, a diffused layer cosisting of an Ni-Fe alloy is formed between this base material and the Ni-plate layer. CONSTITUTION:A steel sheet to be used as a base material is previously subjected to cold rolling at the final reduction ratio of 20-80% in a desired thickness before a plating is applied. A plated layer consisting of Ni or an alloy of Ni and other metal is formed on the suface of the sheet. A diffused layer consisting of an Fe-Ni alloy is formed between the Ni plated layer and the sheet. As this heat treatment, a continuous annealing or a batch annealing is performed within a temperature range of 450-800 deg.C. It is desirable that the layer thickness of the diffused layer is 0.05-1mum or thereabouts. Then, a tempering rolling is performed at the reduction ratio of 5% or less. Successively, a plated layer consisting of Sn or such an Sn alloy as a solder can be formed on the surface of the Ni plated layer as well.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23308087A JPS6474749A (en) | 1987-09-17 | 1987-09-17 | Manufacture of conductive material for electronic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23308087A JPS6474749A (en) | 1987-09-17 | 1987-09-17 | Manufacture of conductive material for electronic component |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6474749A true JPS6474749A (en) | 1989-03-20 |
Family
ID=16949487
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23308087A Pending JPS6474749A (en) | 1987-09-17 | 1987-09-17 | Manufacture of conductive material for electronic component |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6474749A (en) |
-
1987
- 1987-09-17 JP JP23308087A patent/JPS6474749A/en active Pending
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