JPS6474749A - Manufacture of conductive material for electronic component - Google Patents

Manufacture of conductive material for electronic component

Info

Publication number
JPS6474749A
JPS6474749A JP23308087A JP23308087A JPS6474749A JP S6474749 A JPS6474749 A JP S6474749A JP 23308087 A JP23308087 A JP 23308087A JP 23308087 A JP23308087 A JP 23308087A JP S6474749 A JPS6474749 A JP S6474749A
Authority
JP
Japan
Prior art keywords
base material
layer
alloy
plated layer
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23308087A
Other languages
Japanese (ja)
Inventor
Tsunenori Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP23308087A priority Critical patent/JPS6474749A/en
Publication of JPS6474749A publication Critical patent/JPS6474749A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

PURPOSE:To improve remarkedly the adherence of a base material with an Ni-plated layer on the surface of the base material and to enhance the stability and the reliability of conduction characteristics by a method wherein a steel sheet is used as the base material and moreover, a diffused layer cosisting of an Ni-Fe alloy is formed between this base material and the Ni-plate layer. CONSTITUTION:A steel sheet to be used as a base material is previously subjected to cold rolling at the final reduction ratio of 20-80% in a desired thickness before a plating is applied. A plated layer consisting of Ni or an alloy of Ni and other metal is formed on the suface of the sheet. A diffused layer consisting of an Fe-Ni alloy is formed between the Ni plated layer and the sheet. As this heat treatment, a continuous annealing or a batch annealing is performed within a temperature range of 450-800 deg.C. It is desirable that the layer thickness of the diffused layer is 0.05-1mum or thereabouts. Then, a tempering rolling is performed at the reduction ratio of 5% or less. Successively, a plated layer consisting of Sn or such an Sn alloy as a solder can be formed on the surface of the Ni plated layer as well.
JP23308087A 1987-09-17 1987-09-17 Manufacture of conductive material for electronic component Pending JPS6474749A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23308087A JPS6474749A (en) 1987-09-17 1987-09-17 Manufacture of conductive material for electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23308087A JPS6474749A (en) 1987-09-17 1987-09-17 Manufacture of conductive material for electronic component

Publications (1)

Publication Number Publication Date
JPS6474749A true JPS6474749A (en) 1989-03-20

Family

ID=16949487

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23308087A Pending JPS6474749A (en) 1987-09-17 1987-09-17 Manufacture of conductive material for electronic component

Country Status (1)

Country Link
JP (1) JPS6474749A (en)

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