JPS56156769A - Contact material - Google Patents

Contact material

Info

Publication number
JPS56156769A
JPS56156769A JP5951480A JP5951480A JPS56156769A JP S56156769 A JPS56156769 A JP S56156769A JP 5951480 A JP5951480 A JP 5951480A JP 5951480 A JP5951480 A JP 5951480A JP S56156769 A JPS56156769 A JP S56156769A
Authority
JP
Japan
Prior art keywords
tin
copper
plating
heating
contact material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5951480A
Other languages
Japanese (ja)
Other versions
JPS604266B2 (en
Inventor
Susumu Kawauchi
Mitsuo Gunji
Masato Shigyo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eneos Corp
Original Assignee
Nippon Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co Ltd filed Critical Nippon Mining Co Ltd
Priority to JP5951480A priority Critical patent/JPS604266B2/en
Publication of JPS56156769A publication Critical patent/JPS56156769A/en
Publication of JPS604266B2 publication Critical patent/JPS604266B2/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
    • C23C10/28—Solid state diffusion of only metal elements or silicon into metallic material surfaces using solids, e.g. powders, pastes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Manufacture Of Switches (AREA)
  • Conductive Materials (AREA)

Abstract

PURPOSE:To prevent occurrence of cold weldings by hardening the surface by forming a diffusion layer consisting of tin and copper by plating tin or tin alloy on copper alloy for contact material, then, by heating. CONSTITUTION:On the copper alloy for contact material, plating of tin or an alloy containing tin, Pb, In, Sb, etc., is performed directly or after copper foundation plating is performed. Then, a diffusion layer substantially consisting of tin and copper is formed by heating and melting this plated layer or by heating this plated layer to an adequate temperature which is lower than the melting point of plating material. By this heat treatment, the surface of contact material becomes hard and an excellent wear resistance is obtained. Since said material has a hard surface, it has advantages, such as stable contact resistance value, less generation of noise, etc.
JP5951480A 1980-05-07 1980-05-07 Copper alloy for contact materials and its manufacturing method Expired JPS604266B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5951480A JPS604266B2 (en) 1980-05-07 1980-05-07 Copper alloy for contact materials and its manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5951480A JPS604266B2 (en) 1980-05-07 1980-05-07 Copper alloy for contact materials and its manufacturing method

Publications (2)

Publication Number Publication Date
JPS56156769A true JPS56156769A (en) 1981-12-03
JPS604266B2 JPS604266B2 (en) 1985-02-02

Family

ID=13115439

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5951480A Expired JPS604266B2 (en) 1980-05-07 1980-05-07 Copper alloy for contact materials and its manufacturing method

Country Status (1)

Country Link
JP (1) JPS604266B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS595583A (en) * 1982-06-30 1984-01-12 田中貴金属工業株式会社 Contact piece material for commutator
JPS6417344A (en) * 1987-07-10 1989-01-20 Toshiba Corp Contact for vacuum valve and its manufacture
JPS6430123A (en) * 1987-07-24 1989-02-01 Nippon Mining Co Manufacture of contactor
JPS6430122A (en) * 1987-07-24 1989-02-01 Nippon Mining Co Manufacture of contactor

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS595583A (en) * 1982-06-30 1984-01-12 田中貴金属工業株式会社 Contact piece material for commutator
JPH0357193B2 (en) * 1982-06-30 1991-08-30
JPS6417344A (en) * 1987-07-10 1989-01-20 Toshiba Corp Contact for vacuum valve and its manufacture
JPS6430123A (en) * 1987-07-24 1989-02-01 Nippon Mining Co Manufacture of contactor
JPS6430122A (en) * 1987-07-24 1989-02-01 Nippon Mining Co Manufacture of contactor

Also Published As

Publication number Publication date
JPS604266B2 (en) 1985-02-02

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