JPS57147261A - Partly reinforcing method for metal - Google Patents
Partly reinforcing method for metalInfo
- Publication number
- JPS57147261A JPS57147261A JP56032768A JP3276881A JPS57147261A JP S57147261 A JPS57147261 A JP S57147261A JP 56032768 A JP56032768 A JP 56032768A JP 3276881 A JP3276881 A JP 3276881A JP S57147261 A JPS57147261 A JP S57147261A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- lead frame
- lead
- paste
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 title abstract 5
- 229910052751 metal Inorganic materials 0.000 title abstract 5
- 230000003014 reinforcing effect Effects 0.000 title abstract 2
- 239000000463 material Substances 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 238000005275 alloying Methods 0.000 abstract 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 238000009792 diffusion process Methods 0.000 abstract 1
- 239000011888 foil Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 239000003960 organic solvent Substances 0.000 abstract 1
- 229910052760 oxygen Inorganic materials 0.000 abstract 1
- 239000001301 oxygen Substances 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 230000000717 retained effect Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Heat Treatment Of Nonferrous Metals Or Alloys (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To reinforce the desired part of a substrate metal by disposing specific metallic powder, foil, plate or wire on the desired part of the metal, then heating and melting the specific metal by concentrating heat wire and alloying the metal by diffusion. CONSTITUTION:An oxygen free copper strip having, for example, 35mm. wide, 0.4mm. thick and 50% of working degree is prepared as the material of a lead frame, is punched by an automatic press, and is machined to a lead frame 1 for an integrated circuit. After an IC is assembled with the lead frame 1, an Sn paste is coated to a lead leg reinforced part 4 coated with black color of the lead. Then, the reinforced part 4 is heated by a laser to diffuse the Sn therein so as to alloy the reinforced part 4, thereby partly reinforcing the material. At this time, an organic solvent in the paste is evaporated, and only the Sn is retained on the surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56032768A JPS57147261A (en) | 1981-03-06 | 1981-03-06 | Partly reinforcing method for metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56032768A JPS57147261A (en) | 1981-03-06 | 1981-03-06 | Partly reinforcing method for metal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57147261A true JPS57147261A (en) | 1982-09-11 |
Family
ID=12368016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56032768A Pending JPS57147261A (en) | 1981-03-06 | 1981-03-06 | Partly reinforcing method for metal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57147261A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60105259A (en) * | 1983-11-11 | 1985-06-10 | Hitachi Cable Ltd | Lead frame material for semiconductor apparatus |
-
1981
- 1981-03-06 JP JP56032768A patent/JPS57147261A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60105259A (en) * | 1983-11-11 | 1985-06-10 | Hitachi Cable Ltd | Lead frame material for semiconductor apparatus |
| JPH0562467B2 (en) * | 1983-11-11 | 1993-09-08 | Hitachi Cable |
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