JPS60105241A - 半導体素子用パツケ−ジ - Google Patents

半導体素子用パツケ−ジ

Info

Publication number
JPS60105241A
JPS60105241A JP58212174A JP21217483A JPS60105241A JP S60105241 A JPS60105241 A JP S60105241A JP 58212174 A JP58212174 A JP 58212174A JP 21217483 A JP21217483 A JP 21217483A JP S60105241 A JPS60105241 A JP S60105241A
Authority
JP
Japan
Prior art keywords
solder
chip
package
package base
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58212174A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0446448B2 (enExample
Inventor
Hideaki Nishizawa
秀明 西沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP58212174A priority Critical patent/JPS60105241A/ja
Publication of JPS60105241A publication Critical patent/JPS60105241A/ja
Publication of JPH0446448B2 publication Critical patent/JPH0446448B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01308—Manufacture or treatment of die-attach connectors using permanent auxiliary members, e.g. using alignment marks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07311—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07321—Aligning
    • H10W72/07327—Aligning involving guiding structures, e.g. spacers or supporting members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07353—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H10W72/334—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads

Landscapes

  • Die Bonding (AREA)
  • Led Device Packages (AREA)
JP58212174A 1983-11-11 1983-11-11 半導体素子用パツケ−ジ Granted JPS60105241A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58212174A JPS60105241A (ja) 1983-11-11 1983-11-11 半導体素子用パツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58212174A JPS60105241A (ja) 1983-11-11 1983-11-11 半導体素子用パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS60105241A true JPS60105241A (ja) 1985-06-10
JPH0446448B2 JPH0446448B2 (enExample) 1992-07-30

Family

ID=16618127

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58212174A Granted JPS60105241A (ja) 1983-11-11 1983-11-11 半導体素子用パツケ−ジ

Country Status (1)

Country Link
JP (1) JPS60105241A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120074566A1 (en) * 2010-09-29 2012-03-29 Samsung Electronics Co., Ltd. Package For Semiconductor Device Including Guide Rings And Manufacturing Method Of The Same
JP2012511814A (ja) * 2008-12-13 2012-05-24 ミュールバウアー アーゲー 電子アセンブリ製造の方法および装置ならびにその電子アセンブリ
JP2015109294A (ja) * 2013-12-03 2015-06-11 三菱電機株式会社 電力用半導体装置およびその製造方法
JP2018060932A (ja) * 2016-10-06 2018-04-12 ローム株式会社 Ｌｅｄパッケージ

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012511814A (ja) * 2008-12-13 2012-05-24 ミュールバウアー アーゲー 電子アセンブリ製造の方法および装置ならびにその電子アセンブリ
US20120074566A1 (en) * 2010-09-29 2012-03-29 Samsung Electronics Co., Ltd. Package For Semiconductor Device Including Guide Rings And Manufacturing Method Of The Same
US8587108B2 (en) * 2010-09-29 2013-11-19 Samsung Electronics Co., Ltd. Package for semiconductor device including guide rings and manufacturing method of the same
US20140051243A1 (en) * 2010-09-29 2014-02-20 Samsung Electronics Co., Ltd. Package for semiconductor device including guide rings and manufacturing method of the same
US9018041B2 (en) 2010-09-29 2015-04-28 Samsung Electronics Co., Ltd. Package for semiconductor device including guide rings and manufacturing method of the same
JP2015109294A (ja) * 2013-12-03 2015-06-11 三菱電機株式会社 電力用半導体装置およびその製造方法
JP2018060932A (ja) * 2016-10-06 2018-04-12 ローム株式会社 Ｌｅｄパッケージ

Also Published As

Publication number Publication date
JPH0446448B2 (enExample) 1992-07-30

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