JPS5986292A - セラミツク多層配線基板の製造方法 - Google Patents

セラミツク多層配線基板の製造方法

Info

Publication number
JPS5986292A
JPS5986292A JP19624582A JP19624582A JPS5986292A JP S5986292 A JPS5986292 A JP S5986292A JP 19624582 A JP19624582 A JP 19624582A JP 19624582 A JP19624582 A JP 19624582A JP S5986292 A JPS5986292 A JP S5986292A
Authority
JP
Japan
Prior art keywords
paste
insulating
conductive paste
photocurable
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19624582A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6364920B2 (enExample
Inventor
銅谷　明裕
芳嗣 岡田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP19624582A priority Critical patent/JPS5986292A/ja
Publication of JPS5986292A publication Critical patent/JPS5986292A/ja
Publication of JPS6364920B2 publication Critical patent/JPS6364920B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP19624582A 1982-11-09 1982-11-09 セラミツク多層配線基板の製造方法 Granted JPS5986292A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19624582A JPS5986292A (ja) 1982-11-09 1982-11-09 セラミツク多層配線基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19624582A JPS5986292A (ja) 1982-11-09 1982-11-09 セラミツク多層配線基板の製造方法

Publications (2)

Publication Number Publication Date
JPS5986292A true JPS5986292A (ja) 1984-05-18
JPS6364920B2 JPS6364920B2 (enExample) 1988-12-14

Family

ID=16354598

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19624582A Granted JPS5986292A (ja) 1982-11-09 1982-11-09 セラミツク多層配線基板の製造方法

Country Status (1)

Country Link
JP (1) JPS5986292A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS611237A (ja) * 1984-06-13 1986-01-07 Canon Electronics Inc シ−トコイルの製造方法
JPH04283946A (ja) * 1991-03-12 1992-10-08 Nec Corp セラミックグリーンシート上での微細配線パターンの形成方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5785293A (en) * 1980-11-17 1982-05-27 Nippon Electric Co Method of producing hihg density multilayer circuit board
JPS57196244A (en) * 1981-05-28 1982-12-02 Ricoh Co Ltd Electrophotographic receptor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5785293A (en) * 1980-11-17 1982-05-27 Nippon Electric Co Method of producing hihg density multilayer circuit board
JPS57196244A (en) * 1981-05-28 1982-12-02 Ricoh Co Ltd Electrophotographic receptor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS611237A (ja) * 1984-06-13 1986-01-07 Canon Electronics Inc シ−トコイルの製造方法
JPH04283946A (ja) * 1991-03-12 1992-10-08 Nec Corp セラミックグリーンシート上での微細配線パターンの形成方法

Also Published As

Publication number Publication date
JPS6364920B2 (enExample) 1988-12-14

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