JPS5979556A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5979556A
JPS5979556A JP19149182A JP19149182A JPS5979556A JP S5979556 A JPS5979556 A JP S5979556A JP 19149182 A JP19149182 A JP 19149182A JP 19149182 A JP19149182 A JP 19149182A JP S5979556 A JPS5979556 A JP S5979556A
Authority
JP
Japan
Prior art keywords
unit
module
power module
terminal
absorber unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19149182A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0129072B2 (enrdf_load_stackoverflow
Inventor
Yoshiyuki Hirai
平井　義行
Yoshisada Yoneda
米田　良忠
Seiichi Oshima
大島　征一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP19149182A priority Critical patent/JPS5979556A/ja
Publication of JPS5979556A publication Critical patent/JPS5979556A/ja
Publication of JPH0129072B2 publication Critical patent/JPH0129072B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/647—Resistive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP19149182A 1982-10-28 1982-10-28 半導体装置 Granted JPS5979556A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19149182A JPS5979556A (ja) 1982-10-28 1982-10-28 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19149182A JPS5979556A (ja) 1982-10-28 1982-10-28 半導体装置

Publications (2)

Publication Number Publication Date
JPS5979556A true JPS5979556A (ja) 1984-05-08
JPH0129072B2 JPH0129072B2 (enrdf_load_stackoverflow) 1989-06-07

Family

ID=16275521

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19149182A Granted JPS5979556A (ja) 1982-10-28 1982-10-28 半導体装置

Country Status (1)

Country Link
JP (1) JPS5979556A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006333588A (ja) * 2005-05-25 2006-12-07 Nippon Inter Electronics Corp 交流電力調整器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006333588A (ja) * 2005-05-25 2006-12-07 Nippon Inter Electronics Corp 交流電力調整器

Also Published As

Publication number Publication date
JPH0129072B2 (enrdf_load_stackoverflow) 1989-06-07

Similar Documents

Publication Publication Date Title
US5455740A (en) Bus communication system for stacked high density integrated circuit packages
US5541812A (en) Bus communication system for stacked high density integrated circuit packages having an intermediate lead frame
US4454529A (en) Integrated circuit device having internal dampening for a plurality of power supplies
US4600968A (en) Semiconductor device package having regions of different thermal properties
US5331200A (en) Lead-on-chip inner lead bonding lead frame method and apparatus
JP2003124383A5 (enrdf_load_stackoverflow)
JPS60239051A (ja) 半導体装置
US5892275A (en) High performance power and ground edge connect IC package
JPH1056093A (ja) 半導体装置およびその半導体装置を組み込んだ電子装置
JPS5979556A (ja) 半導体装置
JP3519227B2 (ja) 半導体装置
JPH03108749A (ja) 電力変換装置用トランジスタモジュール
JP2697547B2 (ja) 半導体集積回路装置
JPS58110063A (ja) 集積回路装置
JPS6028114Y2 (ja) 複合部品
JPH073434Y2 (ja) 高電圧用電子部品
US20230124931A1 (en) Configurable capacitor
JP2745932B2 (ja) 半導体装置
JPH0476211B2 (enrdf_load_stackoverflow)
JPH0644110Y2 (ja) 半導体装置
JP2624280B2 (ja) Ｉｉｌ素子
JPH01191433A (ja) 集積回路素子
JPS62237750A (ja) 半導体モジユ−ル素子
JPS61276240A (ja) 混成集積回路
JPS59124743A (ja) 半導体装置