JPS5979556A - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS5979556A JPS5979556A JP19149182A JP19149182A JPS5979556A JP S5979556 A JPS5979556 A JP S5979556A JP 19149182 A JP19149182 A JP 19149182A JP 19149182 A JP19149182 A JP 19149182A JP S5979556 A JPS5979556 A JP S5979556A
- Authority
- JP
- Japan
- Prior art keywords
- module
- terminal
- unit
- power module
- absorber unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/647—Resistive arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19149182A JPS5979556A (ja) | 1982-10-28 | 1982-10-28 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19149182A JPS5979556A (ja) | 1982-10-28 | 1982-10-28 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5979556A true JPS5979556A (ja) | 1984-05-08 |
| JPH0129072B2 JPH0129072B2 (enrdf_load_stackoverflow) | 1989-06-07 |
Family
ID=16275521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19149182A Granted JPS5979556A (ja) | 1982-10-28 | 1982-10-28 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5979556A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006333588A (ja) * | 2005-05-25 | 2006-12-07 | Nippon Inter Electronics Corp | 交流電力調整器 |
-
1982
- 1982-10-28 JP JP19149182A patent/JPS5979556A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006333588A (ja) * | 2005-05-25 | 2006-12-07 | Nippon Inter Electronics Corp | 交流電力調整器 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0129072B2 (enrdf_load_stackoverflow) | 1989-06-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5455740A (en) | Bus communication system for stacked high density integrated circuit packages | |
| US5541812A (en) | Bus communication system for stacked high density integrated circuit packages having an intermediate lead frame | |
| US5038194A (en) | Semiconductor device | |
| US4600968A (en) | Semiconductor device package having regions of different thermal properties | |
| US5331200A (en) | Lead-on-chip inner lead bonding lead frame method and apparatus | |
| US5892275A (en) | High performance power and ground edge connect IC package | |
| JPS5979556A (ja) | 半導体装置 | |
| JPH0476211B2 (enrdf_load_stackoverflow) | ||
| JPS6028114Y2 (ja) | 複合部品 | |
| JPH0342685Y2 (enrdf_load_stackoverflow) | ||
| JPS62237750A (ja) | 半導体モジユ−ル素子 | |
| JPH03145756A (ja) | 電力変換装置用トランジスタモジュール | |
| JPH073434Y2 (ja) | 高電圧用電子部品 | |
| JP2578743Y2 (ja) | 複合半導体装置 | |
| JPS6352457A (ja) | 半導体装置 | |
| JPS59124743A (ja) | 半導体装置 | |
| JPS6132558A (ja) | 半導体装置 | |
| JPS6245159A (ja) | 半導体装置 | |
| JPH03132066A (ja) | 電力変換装置用トランジスタモジュール | |
| JPS60144253U (ja) | 半導体装置 | |
| JPH05102390A (ja) | ハイブリツドic | |
| JPS60206673A (ja) | サ−マルヘツド | |
| JPS6298631A (ja) | 半導体装置 | |
| JPS592156U (ja) | 半導体装置 | |
| JPH0297053A (ja) | 半導体回路 |