JPS5979539A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5979539A
JPS5979539A JP57189012A JP18901282A JPS5979539A JP S5979539 A JPS5979539 A JP S5979539A JP 57189012 A JP57189012 A JP 57189012A JP 18901282 A JP18901282 A JP 18901282A JP S5979539 A JPS5979539 A JP S5979539A
Authority
JP
Japan
Prior art keywords
wire
pellet
bonding
nickel
aluminum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57189012A
Other languages
English (en)
Inventor
Susumu Okikawa
進 沖川
Hiromichi Suzuki
博通 鈴木
Hiroshi Mikino
三木野　博
Wahei Kitamura
北村　和平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57189012A priority Critical patent/JPS5979539A/ja
Publication of JPS5979539A publication Critical patent/JPS5979539A/ja
Pending legal-status Critical Current

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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 本発明（よと１５導体装置、特に、コストの低減を図イ
）ことのできろ半導体装置に関する。
従】｛（、たとえばモジュール等において用いられてい
ろペレノ｝　］ｉ’に付捕板では、第１図に示すように
、ガラスエポキシＩ１（板１の上に銅箔よりなる劇配綿
２が設けられ、この銅配線２の上に下地ニッケル２！）
つぎ３な介して金めっぎ４が施こされていＺ）　Ｏ　一
方、ベレット５はエポキシ系接着剤６によりガラスエボ
ギシ占１；板１に取り付ゆられる。そして、ペレット５
のボンディングパッドは金（Ａｕ）のワイヤ７により金
めつき３とボンディングされ、エボギシ樹脂８のポツテ
ィングにより封止されろ。
ところが、この従来技術では、ペレット取付へ板側に金
めつき４を施こす上に、ワイヤ７も金な用いているので
、コストが相当高価になるという問題がある。
本発明の目的は、前記従来技術の問題点を解決し、金の
使用の排除により半導体装１■のコストを低減すること
にある。
以下、本発明を図面に示す実施例にしたがって詳細に説
明する。
第２図は本発明による半導体装置の一実施例タ示す断面
図である。
本実施例の半導体装置はいわゆるモジュール１７．１７
造を有するもので、第１図の従来例と対応する部分には
同一符号を付して示されていろ。
この半導体装置の場合、ガラスエポキシ柄版１上のｆｆ
ｌ配線−２の上には、ニッケル（Ｎｉ）めっきまたは０
．１％以上のリン（Ｐ）入りのニッケルめっきよりなる
ニッケル系めっき９が施こされてい７、）。
また、本実施例のワイヤとしては、アルミニウノ、（Ａ
、／Ｊ）またはアルミニウム合金、たとえば１．０％の
シリコン−人りアルミニウム合金よりなるワイヤ１０が
用いられている。このワイヤ１０のベレット５側は該ベ
レ用・５のアルミニウムよりなるポンディングパツドと
ボールボンディングによってボ／ディ／グ訳続されてい
る。一方、ワイヤ１゜の１１１−板側（リード側）はい
わゆるウェノジボンディンダ方式によりニッケル系めっ
ぎ９どボンディング接イ、−Ｙされている。
ワイヤボンディング後のベレット５．ワイヤ９等はエポ
キシ樹脂８をポツティングすることにより封止されてい
る。
を−たがって、本実施例においては、金材料が全＜　（
９ｊ用されていないので、半導体装置のコストを大ｒｌ
ＪＫ低減できる。
また、ワイヤＩＯの材質としてアルミニウムまたはアル
ミニウム合金を用いていることにより、ワイヤＩＯとエ
ポキシ樹脂８との接着性が良く、ワイヤ１０とエポキシ
樹脂８との間からの水分の浸入を防止でき、ひいてはベ
レット５のポンディングパツドのアルばニウム材料の腐
食も防止できるっしかも、アルミニウムのワイヤ１０と
アルミニウムのポンディングパツドとはボンディング性
が良い上に、局部Ｔ匡池作用が起こら／」いので、電気
化学的腐食を防止することができるっさらに、アルミニ
ウムのワイヤ１０とニッケル系めっぎ９どのボンディン
グ性も良好で、また電気化学的腐食をも抑制することが
できるつ特に、ニッケル糸めっぎ９の材質として、０．
１％のり／入りのニノクル材料を用いれば、アルミニウ
ムまたはアルミニウノ、合金のワイヤ１０のボンディン
グ性がより良好となる。
このようなアルミニウムまたはアルミニウム合金のワイ
ヤとニッケル系金属との組合せは前記した如きモジュー
ル等のガラスエポキシ基板信造の池、リードフレームを
ベレット取付甚仮として用いる場合にも適用できろ。
第３図はこのようなリードフレームを用いた半導体装置
の断面図であるっこの場合には、リードフレーム１１の
タブ１２上には、ベレット５が接合材１３で取りＮけら
れると共に、リードフレーム１１のインナーリード部上
にはニッケルまたは０．１％のリン入りのニッケルより
なるニッケル系めっき９が施こされている。そして、ベ
レット５のボンデずンダパノドとニッケル系めっぎ９と
は、アルミニウムまたはアルミニウム合金たとえば１．
０％のシリコン入りアルミニウム合金よりなるワイヤ］
０でボンディングされている。この場合にも、ワイ〜ヤ
１０のベレット５側はポールボンディング方式、ニッケ
ル糸めっき９側はウエリジボンディング方式でボンディ
ングされている。さらに、ベレット５、ワイヤ１０等は
エポキシ樹脂８のモールド型パッケージ内に封止されて
いるっ本実施例の場合においても、ワイヤ１０の材質が
金材料ではな（、またリードフレーム１１のワイヤボン
ディング部にも金めつきを用いていないので、コストの
低減を図ることができ、さらに、ボンディング性の向上
、水分の浸入防止、電気化学的腐食の防止等を実現する
こともできろ。
なお、本発ＩＴ）Ｊは前記実施例に限定されるものでは
なく、他の（第々な変形がｕＪ能であろう以上１１チ５
明したように、本発明にょｇば、金利料の排除または節
減によりコストを低減させることがでさる上に、ボンデ
ィング性の向上、ワイヤの腐食防■ヒ等を図ることがで
きろっ
【図面の簡単な説明】
第１図は従来例の部分＋ｇ「面図、 第２図は本発明による半導体装置の一実だ１１例の部分
断面図、 第３図は本発明の他の実施例の１（〕「面図である。 ｌ・・・ガラスエポキシ基板％５・・・ベレット、８・
・・エポキシ（り１脂、９・・・ニッケル系めっき、１
ｏ・・・ワイヤ、１１・・・リードフレーム。 代ｊｌｉ人　弁理士　　ｌシ　ｌＪ、Ｉ　　利　幸第　
　１　　図 第　　２　　図 第　　３　　図

Claims (1)

    【特許請求の範囲】
  1. １、アルミニウムまたはアルミニウム合金よりなるワイ
    ヤの一端をペレットのポ／デ、ｆングパッドにボールボ
    ンディングすると共に、ベレット取付Ｊｉｌ、板」二に
    ニッケルまたはニッケル系金属のめっきを＃ｉごユし、
    このめっき上にワイヤのｆ席端をボンディングずイ、こ
    とを特徴とする半導体装置１１゜
JP57189012A 1982-10-29 1982-10-29 半導体装置 Pending JPS5979539A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57189012A JPS5979539A (ja) 1982-10-29 1982-10-29 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57189012A JPS5979539A (ja) 1982-10-29 1982-10-29 半導体装置

Publications (1)

Publication Number Publication Date
JPS5979539A true JPS5979539A (ja) 1984-05-08

Family

ID=16233817

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57189012A Pending JPS5979539A (ja) 1982-10-29 1982-10-29 半導体装置

Country Status (1)

Country Link
JP (1) JPS5979539A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009530872A (ja) * 2006-03-20 2009-08-27 フェアチャイルド・セミコンダクター・コーポレーション 細いアルミニウムワイヤのためのアルミニウムバンプボンディング

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009530872A (ja) * 2006-03-20 2009-08-27 フェアチャイルド・セミコンダクター・コーポレーション 細いアルミニウムワイヤのためのアルミニウムバンプボンディング

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