JPS5978592A - フレキシブルプリント板 - Google Patents
フレキシブルプリント板Info
- Publication number
- JPS5978592A JPS5978592A JP18739582A JP18739582A JPS5978592A JP S5978592 A JPS5978592 A JP S5978592A JP 18739582 A JP18739582 A JP 18739582A JP 18739582 A JP18739582 A JP 18739582A JP S5978592 A JPS5978592 A JP S5978592A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- less
- flexible printed
- printed board
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18739582A JPS5978592A (ja) | 1982-10-27 | 1982-10-27 | フレキシブルプリント板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18739582A JPS5978592A (ja) | 1982-10-27 | 1982-10-27 | フレキシブルプリント板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5978592A true JPS5978592A (ja) | 1984-05-07 |
| JPH0254675B2 JPH0254675B2 (OSRAM) | 1990-11-22 |
Family
ID=16205273
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18739582A Granted JPS5978592A (ja) | 1982-10-27 | 1982-10-27 | フレキシブルプリント板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5978592A (OSRAM) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63310931A (ja) * | 1987-06-10 | 1988-12-19 | Furukawa Electric Co Ltd:The | フレキシブルプリント用銅合金 |
| JPS6456842A (en) * | 1987-08-27 | 1989-03-03 | Nippon Mining Co | Copper alloy foil for flexible circuit board |
| JPS6456841A (en) * | 1987-08-27 | 1989-03-03 | Nippon Mining Co | Copper alloy foil for flexible circuit board |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5027715A (OSRAM) * | 1973-07-13 | 1975-03-22 | ||
| JPS5216422A (en) * | 1975-07-29 | 1977-02-07 | Sumitomo Electric Ind Ltd | High strength copper alloy for electric conductor |
| JPS5389662A (en) * | 1977-01-19 | 1978-08-07 | Sumitomo Electric Ind Ltd | Material for lead frame of semiconductor device |
| JPS54110466A (en) * | 1978-02-17 | 1979-08-29 | Kanegafuchi Chemical Ind | Flexible printed circuit board with improved bend proofing strength |
| JPS5526649A (en) * | 1978-08-16 | 1980-02-26 | Tamagawa Kikai Kinzoku Kk | Lead material for semiconductor |
| JPS55145159A (en) * | 1979-04-12 | 1980-11-12 | Furukawa Kinzoku Kogyo Kk | Manufacture of copper foil with superior flexibility for printed wiring plate |
| JPS5620136A (en) * | 1979-07-30 | 1981-02-25 | Toshiba Corp | Copper alloy member |
| JPS56167357A (en) * | 1980-05-27 | 1981-12-23 | Sharp Corp | Tape carrier substrate for semiconductor device |
| JPS5735267A (en) * | 1980-08-11 | 1982-02-25 | Hitachi Ltd | Refrigerating plant |
| JPS57154310A (en) * | 1981-03-18 | 1982-09-24 | Furukawa Electric Co Ltd:The | Manufacture of small-gauge conductive copper-wire having high strength and excellent flexibility |
-
1982
- 1982-10-27 JP JP18739582A patent/JPS5978592A/ja active Granted
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5027715A (OSRAM) * | 1973-07-13 | 1975-03-22 | ||
| JPS5216422A (en) * | 1975-07-29 | 1977-02-07 | Sumitomo Electric Ind Ltd | High strength copper alloy for electric conductor |
| JPS5389662A (en) * | 1977-01-19 | 1978-08-07 | Sumitomo Electric Ind Ltd | Material for lead frame of semiconductor device |
| JPS54110466A (en) * | 1978-02-17 | 1979-08-29 | Kanegafuchi Chemical Ind | Flexible printed circuit board with improved bend proofing strength |
| JPS5526649A (en) * | 1978-08-16 | 1980-02-26 | Tamagawa Kikai Kinzoku Kk | Lead material for semiconductor |
| JPS55145159A (en) * | 1979-04-12 | 1980-11-12 | Furukawa Kinzoku Kogyo Kk | Manufacture of copper foil with superior flexibility for printed wiring plate |
| JPS5620136A (en) * | 1979-07-30 | 1981-02-25 | Toshiba Corp | Copper alloy member |
| JPS56167357A (en) * | 1980-05-27 | 1981-12-23 | Sharp Corp | Tape carrier substrate for semiconductor device |
| JPS5735267A (en) * | 1980-08-11 | 1982-02-25 | Hitachi Ltd | Refrigerating plant |
| JPS57154310A (en) * | 1981-03-18 | 1982-09-24 | Furukawa Electric Co Ltd:The | Manufacture of small-gauge conductive copper-wire having high strength and excellent flexibility |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63310931A (ja) * | 1987-06-10 | 1988-12-19 | Furukawa Electric Co Ltd:The | フレキシブルプリント用銅合金 |
| JPS6456842A (en) * | 1987-08-27 | 1989-03-03 | Nippon Mining Co | Copper alloy foil for flexible circuit board |
| JPS6456841A (en) * | 1987-08-27 | 1989-03-03 | Nippon Mining Co | Copper alloy foil for flexible circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0254675B2 (OSRAM) | 1990-11-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3062435B2 (ja) | フレキシブル基板並びにそれに用いるBe−Cu合金箔およびその製造方法 | |
| US5681662A (en) | Copper alloy foils for flexible circuits | |
| JPS5978592A (ja) | フレキシブルプリント板 | |
| JP2022095855A (ja) | フレキシブルプリント基板用銅箔 | |
| JP2809673B2 (ja) | フレキシブルプリント用銅合金圧延箔 | |
| US4912284A (en) | Electrical circuits | |
| JPS61295691A (ja) | フレキシブル基板 | |
| JP3136173B2 (ja) | 薄物多層銅張積層板 | |
| JPH0316799B2 (OSRAM) | ||
| JPH04290286A (ja) | 電磁波遮蔽付きフレキシブルプリント板 | |
| JPH04267393A (ja) | フレキシブルプリント板 | |
| JPS61226994A (ja) | 可撓性金属ベ−ス回路基板 | |
| JP2705015B2 (ja) | フレキシブルプリント配線板 | |
| JPS6039883A (ja) | 可撓性配線基板 | |
| JPH04290283A (ja) | 電磁波遮蔽付きフレキシブルプリント板 | |
| JPS63107189A (ja) | 電気回路用箔材 | |
| JPH04299887A (ja) | フレキシブルプリント板 | |
| JPH04215494A (ja) | 金属ベース印刷回路用積層板 | |
| JPH02270301A (ja) | チップ抵抗器 | |
| JPS5894715A (ja) | キ−ボ−ドスイツチ用プリント回路板の製造方法 | |
| JPS6398437A (ja) | 金属ベ−ス基板 | |
| JPH02177492A (ja) | プリント配線板 | |
| JPS62243385A (ja) | ハイブリツド基板 | |
| Whitfield | Selective plating of etched circuits without removing previous plating Patent | |
| JPS60177697A (ja) | ホ−ロ−基板 |