JPS55145159A - Manufacture of copper foil with superior flexibility for printed wiring plate - Google Patents
Manufacture of copper foil with superior flexibility for printed wiring plateInfo
- Publication number
- JPS55145159A JPS55145159A JP4451979A JP4451979A JPS55145159A JP S55145159 A JPS55145159 A JP S55145159A JP 4451979 A JP4451979 A JP 4451979A JP 4451979 A JP4451979 A JP 4451979A JP S55145159 A JPS55145159 A JP S55145159A
- Authority
- JP
- Japan
- Prior art keywords
- foil
- manufacture
- copper foil
- printed wiring
- wiring plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Heat Treatment Of Nonferrous Metals Or Alloys (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Metal Rolling (AREA)
Abstract
PURPOSE: To manufacture the title Cu foil by heat treating Cu foil, at a low temp., subjected to final cold rolling at a specified reduction ratio or more.
CONSTITUTION: Cu foil subjected to final cold rolling at a reduction ratio of 90% or more is provided with sufficient cubic structure by heating even at such a low temp. as 100°C or above, preferably about 100W200°C independently of its working history, and it has remarkably enhanced flexibility. On the other hand, a solvent removing process by evaporation after coating an adhesive onto the foil is carried out at 100W200°C. Accordingly, after the final rolling, by coating the adhesive without heating and then drying it heat treatment is performed at the same time to simplify the manufacturing process.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4451979A JPS55145159A (en) | 1979-04-12 | 1979-04-12 | Manufacture of copper foil with superior flexibility for printed wiring plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4451979A JPS55145159A (en) | 1979-04-12 | 1979-04-12 | Manufacture of copper foil with superior flexibility for printed wiring plate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55145159A true JPS55145159A (en) | 1980-11-12 |
JPS5735267B2 JPS5735267B2 (en) | 1982-07-28 |
Family
ID=12693779
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4451979A Granted JPS55145159A (en) | 1979-04-12 | 1979-04-12 | Manufacture of copper foil with superior flexibility for printed wiring plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55145159A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5954298A (en) * | 1982-09-21 | 1984-03-29 | 日立化成工業株式会社 | Method of producing copper-lined laminated board for printedcircuit |
JPS5978592A (en) * | 1982-10-27 | 1984-05-07 | 株式会社フジクラ | Flexible printed board |
JPS6015002A (en) * | 1983-07-07 | 1985-01-25 | Hitachi Cable Ltd | Rolled copper foil |
JPS63112003A (en) * | 1986-10-30 | 1988-05-17 | Furukawa Electric Co Ltd:The | Production of copper lead material for semiconductor |
JPH02263959A (en) * | 1989-04-04 | 1990-10-26 | Hitachi Cable Ltd | Oxygen free copper rolled foil and flexible printing circuit board using it |
KR20200066263A (en) | 2017-10-12 | 2020-06-09 | 후쿠다 킨조쿠 하쿠훈 코교 가부시키가이샤 | Hard rolled copper foil and manufacturing method of hard rolled copper foil |
-
1979
- 1979-04-12 JP JP4451979A patent/JPS55145159A/en active Granted
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5954298A (en) * | 1982-09-21 | 1984-03-29 | 日立化成工業株式会社 | Method of producing copper-lined laminated board for printedcircuit |
JPS639760B2 (en) * | 1982-09-21 | 1988-03-01 | Hitachi Chemical Co Ltd | |
JPS5978592A (en) * | 1982-10-27 | 1984-05-07 | 株式会社フジクラ | Flexible printed board |
JPH0254675B2 (en) * | 1982-10-27 | 1990-11-22 | Fujikura Ltd | |
JPS6015002A (en) * | 1983-07-07 | 1985-01-25 | Hitachi Cable Ltd | Rolled copper foil |
JPH046443B2 (en) * | 1983-07-07 | 1992-02-05 | Hitachi Cable | |
JPS63112003A (en) * | 1986-10-30 | 1988-05-17 | Furukawa Electric Co Ltd:The | Production of copper lead material for semiconductor |
JPH0418027B2 (en) * | 1986-10-30 | 1992-03-26 | Furukawa Electric Co Ltd | |
JPH02263959A (en) * | 1989-04-04 | 1990-10-26 | Hitachi Cable Ltd | Oxygen free copper rolled foil and flexible printing circuit board using it |
KR20200066263A (en) | 2017-10-12 | 2020-06-09 | 후쿠다 킨조쿠 하쿠훈 코교 가부시키가이샤 | Hard rolled copper foil and manufacturing method of hard rolled copper foil |
US10882088B2 (en) | 2017-10-12 | 2021-01-05 | Fukuda Metal Foil & Powder Co., Ltd. | Hard rolled-copper foil and method of manufacturing the hard rolled-copper foil |
Also Published As
Publication number | Publication date |
---|---|
JPS5735267B2 (en) | 1982-07-28 |
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