JPS55145159A - Manufacture of copper foil with superior flexibility for printed wiring plate - Google Patents

Manufacture of copper foil with superior flexibility for printed wiring plate

Info

Publication number
JPS55145159A
JPS55145159A JP4451979A JP4451979A JPS55145159A JP S55145159 A JPS55145159 A JP S55145159A JP 4451979 A JP4451979 A JP 4451979A JP 4451979 A JP4451979 A JP 4451979A JP S55145159 A JPS55145159 A JP S55145159A
Authority
JP
Japan
Prior art keywords
foil
manufacture
copper foil
printed wiring
wiring plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4451979A
Other languages
Japanese (ja)
Other versions
JPS5735267B2 (en
Inventor
Yasuo Yamane
Shigeo Shinozaki
Taku Kuroyanagi
Kiichi Akasaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FURUKAWA KINZOKU KOGYO KK
Furukawa Metals Co Ltd
Original Assignee
FURUKAWA KINZOKU KOGYO KK
Furukawa Metals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FURUKAWA KINZOKU KOGYO KK, Furukawa Metals Co Ltd filed Critical FURUKAWA KINZOKU KOGYO KK
Priority to JP4451979A priority Critical patent/JPS55145159A/en
Publication of JPS55145159A publication Critical patent/JPS55145159A/en
Publication of JPS5735267B2 publication Critical patent/JPS5735267B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Heat Treatment Of Nonferrous Metals Or Alloys (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Metal Rolling (AREA)

Abstract

PURPOSE: To manufacture the title Cu foil by heat treating Cu foil, at a low temp., subjected to final cold rolling at a specified reduction ratio or more.
CONSTITUTION: Cu foil subjected to final cold rolling at a reduction ratio of 90% or more is provided with sufficient cubic structure by heating even at such a low temp. as 100°C or above, preferably about 100W200°C independently of its working history, and it has remarkably enhanced flexibility. On the other hand, a solvent removing process by evaporation after coating an adhesive onto the foil is carried out at 100W200°C. Accordingly, after the final rolling, by coating the adhesive without heating and then drying it heat treatment is performed at the same time to simplify the manufacturing process.
COPYRIGHT: (C)1980,JPO&Japio
JP4451979A 1979-04-12 1979-04-12 Manufacture of copper foil with superior flexibility for printed wiring plate Granted JPS55145159A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4451979A JPS55145159A (en) 1979-04-12 1979-04-12 Manufacture of copper foil with superior flexibility for printed wiring plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4451979A JPS55145159A (en) 1979-04-12 1979-04-12 Manufacture of copper foil with superior flexibility for printed wiring plate

Publications (2)

Publication Number Publication Date
JPS55145159A true JPS55145159A (en) 1980-11-12
JPS5735267B2 JPS5735267B2 (en) 1982-07-28

Family

ID=12693779

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4451979A Granted JPS55145159A (en) 1979-04-12 1979-04-12 Manufacture of copper foil with superior flexibility for printed wiring plate

Country Status (1)

Country Link
JP (1) JPS55145159A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5954298A (en) * 1982-09-21 1984-03-29 日立化成工業株式会社 Method of producing copper-lined laminated board for printedcircuit
JPS5978592A (en) * 1982-10-27 1984-05-07 株式会社フジクラ Flexible printed board
JPS6015002A (en) * 1983-07-07 1985-01-25 Hitachi Cable Ltd Rolled copper foil
JPS63112003A (en) * 1986-10-30 1988-05-17 Furukawa Electric Co Ltd:The Production of copper lead material for semiconductor
JPH02263959A (en) * 1989-04-04 1990-10-26 Hitachi Cable Ltd Oxygen free copper rolled foil and flexible printing circuit board using it
KR20200066263A (en) 2017-10-12 2020-06-09 후쿠다 킨조쿠 하쿠훈 코교 가부시키가이샤 Hard rolled copper foil and manufacturing method of hard rolled copper foil

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5954298A (en) * 1982-09-21 1984-03-29 日立化成工業株式会社 Method of producing copper-lined laminated board for printedcircuit
JPS639760B2 (en) * 1982-09-21 1988-03-01 Hitachi Chemical Co Ltd
JPS5978592A (en) * 1982-10-27 1984-05-07 株式会社フジクラ Flexible printed board
JPH0254675B2 (en) * 1982-10-27 1990-11-22 Fujikura Ltd
JPS6015002A (en) * 1983-07-07 1985-01-25 Hitachi Cable Ltd Rolled copper foil
JPH046443B2 (en) * 1983-07-07 1992-02-05 Hitachi Cable
JPS63112003A (en) * 1986-10-30 1988-05-17 Furukawa Electric Co Ltd:The Production of copper lead material for semiconductor
JPH0418027B2 (en) * 1986-10-30 1992-03-26 Furukawa Electric Co Ltd
JPH02263959A (en) * 1989-04-04 1990-10-26 Hitachi Cable Ltd Oxygen free copper rolled foil and flexible printing circuit board using it
KR20200066263A (en) 2017-10-12 2020-06-09 후쿠다 킨조쿠 하쿠훈 코교 가부시키가이샤 Hard rolled copper foil and manufacturing method of hard rolled copper foil
US10882088B2 (en) 2017-10-12 2021-01-05 Fukuda Metal Foil & Powder Co., Ltd. Hard rolled-copper foil and method of manufacturing the hard rolled-copper foil

Also Published As

Publication number Publication date
JPS5735267B2 (en) 1982-07-28

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