JPH02263959A - Oxygen free copper rolled foil and flexible printing circuit board using it - Google Patents
Oxygen free copper rolled foil and flexible printing circuit board using itInfo
- Publication number
- JPH02263959A JPH02263959A JP8552989A JP8552989A JPH02263959A JP H02263959 A JPH02263959 A JP H02263959A JP 8552989 A JP8552989 A JP 8552989A JP 8552989 A JP8552989 A JP 8552989A JP H02263959 A JPH02263959 A JP H02263959A
- Authority
- JP
- Japan
- Prior art keywords
- oxygen
- fatigue life
- rolled foil
- circuit board
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 44
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 title claims abstract description 15
- 229910052760 oxygen Inorganic materials 0.000 title claims abstract description 15
- 239000001301 oxygen Substances 0.000 title claims abstract description 15
- 229910052802 copper Inorganic materials 0.000 title abstract description 19
- 239000010949 copper Substances 0.000 title abstract description 19
- 239000011888 foil Substances 0.000 title abstract description 13
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000011574 phosphorus Substances 0.000 claims abstract description 13
- 239000012535 impurity Substances 0.000 claims abstract description 12
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 12
- 238000005482 strain hardening Methods 0.000 claims abstract description 12
- 239000011889 copper foil Substances 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 238000005452 bending Methods 0.000 description 18
- 230000000052 comparative effect Effects 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 3
- 239000004840 adhesive resin Substances 0.000 description 3
- 229920006223 adhesive resin Polymers 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910001096 P alloy Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000009749 continuous casting Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Heat Treatment Of Articles (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野］
本発明は無酸素銅圧延箔およびそれを用いたフレキシブ
ルプリント基板に関し、特に、低温軟化性および高い屈
曲疲労寿命を有した無酸素銅圧延箔およびそれを用いた
フレキシブルプリント基板に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an oxygen-free rolled copper foil and a flexible printed circuit board using the same, and particularly to an oxygen-free rolled copper foil that has low-temperature softening properties and a high bending fatigue life. and a flexible printed circuit board using the same.
ＯＡ機器や電子機器類のプリンタおよびハードディスク
ドライブ装置等にフレキシブルプリント基板が使用され
ている。このフレキシブルプリント基板は、例えば、ポ
リイミド等から成る絶縁フィルム上にエポキシ等の接着
樹脂を介して銅箔を貼り合わせ、接着樹脂を１３０℃〜
１７０℃Ｘ１ｈｒ〜２４ｈｒの条件で加熱硬化させ、こ
の後、銅箔をエツチングして所定の配線パターンを形成
することによって製造される。Flexible printed circuit boards are used in printers, hard disk drives, etc. of office automation equipment and electronic equipment. This flexible printed circuit board is made by bonding copper foil onto an insulating film made of polyimide or the like via an adhesive resin such as epoxy, and then applying the adhesive resin at a temperature of 130°C to
It is manufactured by heating and curing at 170° C. for 1 to 24 hours, and then etching the copper foil to form a predetermined wiring pattern.
ところで、最近、装置の小型化等の目的から曲率５〜１
５ｍｍの範囲で１０’−１０９回の屈曲疲労寿命を有し
たフレキシブルプリント基板の開発が望まれており、こ
のため、それに耐える屈曲疲労寿命を有する銅箔が要求
されている。これは、ポリイミド等からなる絶縁フィル
ムの屈曲疲労寿命が銅箔に比較して著しく大きいことか
ら、フレキシブルプリント基板全体の屈曲疲労寿命は銅
箔によって決定されるためである。また、このｉ目箔と
して、絶縁フィルム上に貼り合わせる際、取り扱いが容
易なように硬質で、かつ、加熱硬化後に軟化し上記屈曲
疲労寿命が向上するように軟化温度の低いものが要求さ
れている。By the way, recently, for the purpose of downsizing the device, the curvature is 5 to 1.
It is desired to develop a flexible printed circuit board having a bending fatigue life of 10'-109 times in the range of 5 mm, and therefore a copper foil having a bending fatigue life of 10' to 109 times is required. This is because the bending fatigue life of an insulating film made of polyimide or the like is significantly longer than that of copper foil, and the bending fatigue life of the entire flexible printed circuit board is determined by the copper foil. In addition, the i-th foil is required to be hard so that it can be easily handled when laminated onto an insulating film, and to have a low softening temperature so that it softens after being heated and hardened to improve the above-mentioned flexural fatigue life. There is.
このような要求のなかで従来のフレキシブルプリント基
板は、酸素を２００〜３００ｐｐｍ含んだタフピッチ銅
箔を使用している。In response to these demands, conventional flexible printed circuit boards use tough pitch copper foil containing 200 to 300 ppm of oxygen.
しかし、従来のタフピッチ銅箔によると、屈曲疲労寿命
が必ずしも十分でない。これに対して酸素含有量が３ｐ
ｐｍ以下の無酸素銅は屈曲疲労特性が優れているものの
、５〜１５ ｆｆ１ｍという小さい曲率における屈曲疲
労特性が不十分であり、また、４軟化温度もタフピッチ
銅より高いという不都合がある。However, conventional tough pitch copper foils do not necessarily have a sufficient bending fatigue life. On the other hand, the oxygen content is 3p
Oxygen-free copper of pm or less has excellent bending fatigue properties, but has the disadvantage that the bending fatigue properties are insufficient at a small curvature of 5 to 15 ff1m, and its softening temperature is higher than that of tough pitch copper.
従って、本発明の目的は低温軟化性および高い屈曲疲労
寿命を有する無酸素銅圧延箔およびそれを用いたフレキ
シブルプリント基板を提供することである。Therefore, an object of the present invention is to provide an oxygen-free rolled copper foil having low-temperature softening properties and a high flexural fatigue life, and a flexible printed circuit board using the same.
［課題を解決するための手段〕
本発明は以上述べた目的を実現するため、無酸素銅中の
不純物である燐の含有量を重量比でｌｐｐｍ以下にし、
酸素等の不可避的不純物の含有量を５０ｐｐｍ以下にし
、９０％以−にの加工度の最終冷間加工により厚さ１０
０／７ｍ以下にした無酸素銅圧延箔およびそれを用いた
フレキシブルプリント基板を提供するものである。[Means for Solving the Problems] In order to achieve the above-mentioned objects, the present invention reduces the content of phosphorus, which is an impurity, in oxygen-free copper to 1 ppm or less by weight,
The content of unavoidable impurities such as oxygen is 50 ppm or less, and the thickness is 10% by final cold working with a working degree of 90% or more.
The present invention provides an oxygen-free copper rolled foil having a thickness of 0/7 m or less and a flexible printed circuit board using the foil.
即ち、本発明の無酸素銅圧延箔およびそれを用いたフレ
キシブルプリンＩｆ板は、以下の条件を有している。That is, the oxygen-free rolled copper foil of the present invention and the flexible printed If board using the same have the following conditions.
（１）燐の含有量
燐の含有量はその増加に伴って軟化温度も上昇するとい
う特性がある。従って、軟化温度の上界を抑えるため、
燐の含有量を１ ｐｐｍ以下にする。(1) Phosphorus content As the phosphorus content increases, the softening temperature also increases. Therefore, in order to suppress the upper limit of the softening temperature,
Reduce the phosphorus content to 1 ppm or less.
（２）不可避的不純物の含有量
不可避的不純物は酸素が主な成分であり、酸素含有量が
多いと軟化後の屈曲疲労ズト命が劣化する特性がある。(2) Content of unavoidable impurities The main component of unavoidable impurities is oxygen, and when the oxygen content is high, the bending fatigue life after softening deteriorates.
従って、不可避的不純物の含有量を５０ｐｐｍ以下にす
る。Therefore, the content of unavoidable impurities should be 50 ppm or less.
（３）最終冷間加工度 最終冷間加工度（％）は次式によって求められる。(3) Final cold working degree The final degree of cold work (%) is determined by the following formula.
最終冷間加工度を９０％以上にするのは、軟化後の銅箔
の屈曲疲労寿命が最終冷間加工度の増大とともに向上し
、特に、９０％以上において急激に向上するためである
。The reason why the final cold working degree is set to 90% or more is because the bending fatigue life of the copper foil after softening improves as the final cold working degree increases, and in particular, it improves rapidly at 90% or more.
これらの条件を有する無酸素銅圧延箔は軟化温度が低く
、かつ、屈曲疲労寿命が著しく向」二するため、フレキ
シブルプリント基板用箔として極めて良好なものとなる
。Oxygen-free rolled copper foil having these conditions has a low softening temperature and a significantly improved bending fatigue life, making it extremely suitable as a foil for flexible printed circuit boards.
以下、本発明の無酸素銅圧延箔およびぞれを用いたフレ
キシブルプリント基板を詳細に説明する。Hereinafter, the oxygen-free rolled copper foil of the present invention and the flexible printed circuit board using the foil will be explained in detail.
酸素等の不可避的不純物の含有量が５０ｐｐｍ Ｋノ丁
の無酸素銅を連続鋳造装置により溶解し、その溶湯中に
含有量がｔ ｐｐｍ以下となるように燐をｌす合金ある
いは銅と燐の複合材のかたちで添加し、１γさ約２００
ａｍ、幅約６５０ ａｍの鋳塊を得た。この鋳塊を約
１０ｍ１に熱間圧延し、更に、中間焼鈍、冷間圧延を繰
り返し行い厚さ２ ｍ、 ０．８ ａｍ、 ０．５ ｍ
ｉｏ、３５盲ｍ、 ０．１８ｍｍ、 ０．１０１■の生
地焼鈍材を得た。これを冷間圧延して最終的に厚さ０．
０３５ ｕにした。The content of unavoidable impurities such as oxygen is 50 ppm.K-notch oxygen-free copper is melted in a continuous casting machine, and phosphorus is added to the molten metal so that the content is 50 ppm or less, or an alloy of copper and phosphorus. Added in the form of a composite material, with a 1γ strength of approximately 200
An ingot with a width of about 650 am was obtained. This ingot was hot rolled to about 10 m1, and then intermediate annealing and cold rolling were repeated to obtain thicknesses of 2 m, 0.8 am, and 0.5 m.
io, 35 blind meters, 0.18 mm, and 0.101 square meters were obtained. This is cold rolled to a final thickness of 0.
035 u.
それぞれの最終冷間加工度は９８％、９６％、９３％９
０％、 ８１％、および６５％であり、また、比較材と
して燐を３ ｐｐｍ含有した通常の無酸素銅（サンプル
ＮＩＢ）および酸素を２５０ ｐｐｍ含有しているタフ
ピッチ銅（サンプルＴｈＡ）を厚さ０．０３５ ａｍ、
加工度９３％で製造した。The respective final cold working degrees are 98%, 96%, and 93%9
0%, 81%, and 65%, and as comparison materials, normal oxygen-free copper containing 3 ppm phosphorus (sample NIB) and tough pitch copper containing 250 ppm oxygen (sample ThA) were used. 0.035 am,
Manufactured with a degree of processing of 93%.
下表に示すように、以上の各種銅箔について、その主な
不純物を分析すると共に完全軟化（２５０℃ｘ ｌ ｈ
ｒ）後の屈曲疲労寿命を測定した。As shown in the table below, the main impurities of the various copper foils mentioned above were analyzed and completely softened (250°C
The flexural fatigue life after r) was measured.
屈曲疲労寿命の測定は、図に示すような試験装置を用い
て行った。ここで、簡単に試験装置を説明すると、発振
駆動体４にその振動を矢印方向に伝達する振動伝達部材
３が接続され、その先端には固定板２にねじ２ａを介し
て固定された試料銅箔１の端部が所定の曲率Ｒを有して
ヘアピン状に屈曲しながら固定している。このときの試
験条件は、サンプル幅；１０ｍｍ、曲率Ｒ；５ｍｍ、振
動ストロークＨ１０ｍｍ、振動周波数；２５Ｈｚ、同一
条件測定数（Ｎ）；６とした。表の結果から同一加工度
の場合、軟化温度は本発明の無酸素銅（サンプル隘Ｆ、
Ｇ、Ｈ） 、比較例のタフピッチ銅（サンプルＢ）、比
較例の無酸素銅（サンプル１１ｈＡ）の順に低く、屈曲
疲労寿命は本発明の無酸素銅（サンプルＮ［ＬＦ、Ｇ、
Ｈ） 、比較例のタフピッチ銅（サンプルＮａＢ） 、
比較例の無酸素銅（サンプルＮ［ｌＡ）の順に大きくな
っていることが判る。また、最終冷間加工度を９０％以
下にしたものにあっては燐の含有量が本発明と一致して
いても屈曲疲労寿命が向上しておらず、屈曲疲労寿命は
加工度を９０％以上にすることにより急激に向上してい
ることが判る。尚、以上の表に示されたデータは２５０
℃×１ｈｒ加熱後のものであるが、フレキシブルプリン
ト基板の加工時は、１３０℃〜１７０°ＣＸ １ ｈｒ
〜２４ｈｒという低温で加熱されるため、比較例の無酸
素銅（サンプル階２）は完全に軟化していないことにな
り、表に示した屈曲疲労寿命の数値より低くなるが、他
のサンプルにおいては、はぼ表に示した通りの寿命が得
られる。The bending fatigue life was measured using a testing device as shown in the figure. Here, to briefly explain the test apparatus, a vibration transmission member 3 that transmits the vibration in the direction of the arrow is connected to the oscillation drive body 4, and a sample copper plate fixed to the fixing plate 2 via screws 2a is connected to the tip of the vibration transmission member 3. The end of the foil 1 has a predetermined curvature R and is fixed while being bent into a hairpin shape. The test conditions at this time were: sample width: 10 mm, curvature R: 5 mm, vibration stroke H: 10 mm, vibration frequency: 25 Hz, and number of measurements under the same conditions (N): 6. From the results in the table, in the case of the same working degree, the softening temperature is
G, H), the tough pitch copper of the comparative example (sample B), and the oxygen-free copper of the comparative example (sample 11hA), the bending fatigue life was lower in the order of the oxygen-free copper of the present invention (sample N [LF, G,
H), Tough pitch copper of comparative example (sample NaB),
It can be seen that the values increase in the order of oxygen-free copper (sample N [lA) of the comparative example]. Furthermore, in the case where the final degree of cold working is 90% or less, the flexural fatigue life is not improved even if the phosphorus content is in accordance with the present invention, and the flexural fatigue life is 90% or less when the degree of cold working is 90% or less. It can be seen that by doing the above, there is a rapid improvement. Furthermore, the data shown in the table above is 250
This is after heating for 1 hour at 130°C to 170°C when processing flexible printed circuit boards.
Since it is heated at a low temperature of ~24 hr, the oxygen-free copper of the comparative example (sample floor 2) has not completely softened, and the flexural fatigue life value is lower than the value shown in the table, but compared to other samples. The lifespan shown in the table is obtained.
以上のようにして得られた本発明の無酸素銅圧延箔をポ
リイミド等から成る絶縁フィルム上にエポキシ等の接着
樹脂を介して貼り合わせ、これを１３０℃〜１７０°Ｃ
Ｘ ｌ ｈｒ〜２４ｈｒの条件で加熱して硬化させ、こ
の後、エツチングして所定の配線パターンを形成し二フ
レキシブルプリント基板を製造した。このようにして得
られたフレキシブルプリントｇ板の屈曲疲労寿命を調べ
たところ、表に示したのと同様な屈曲疲労特性が得られ
た。The oxygen-free rolled copper foil of the present invention obtained as described above is laminated onto an insulating film made of polyimide or the like via an adhesive resin such as epoxy, and heated at 130°C to 170°C.
The material was cured by heating under conditions of X1 hr to 24 hr, and then etched to form a predetermined wiring pattern to produce two flexible printed circuit boards. When the bending fatigue life of the thus obtained flexible printed G board was investigated, bending fatigue characteristics similar to those shown in the table were obtained.
本実施例では、０．０３５ 璽＊厚さの無酸素ｆｆ１ｔ
ｉｌ圧延箔について説明シたが、０．１１−以下の厚さ
ならば全て適用可能である。一般に、フレキシブルプリ
ント基板用銅箔としては、０．０３５■■の他に、０．
０７０５ｍ、 ０．０１８１ｍが使用されている。また
、本発明の無酸素銅圧延箔はフレキシブルプリント基板
用銅箔以外にも、高い屈曲疲労寿命の要求される他の用
途に有用であることは言うまでもない。In this example, an oxygen-free ff1t of 0.035 *thickness is used.
Although the il-rolled foil has been described, any thickness of 0.11- or less is applicable. In general, as copper foil for flexible printed circuit boards, in addition to 0.035■■, 0.035.
0705m and 0.0181m are used. Moreover, it goes without saying that the oxygen-free rolled copper foil of the present invention is useful not only as a copper foil for flexible printed circuit boards but also for other uses that require a high bending fatigue life.
以上説明した通り、本発明の無酸素銅圧延箔およびそれ
を用いたフレキシブルプリント基板によると、燐の含有
量を重量比でｌｐｐｍ以下にし、酸素等の不可避的不純
物の含有量を５０ｐｐｍ以下にし、９０％以上の加工度
の最終冷間加工により厚さ１００μｍ以下にしたため、
軟化温度を低くすることができ、かつ、軟化後の屈曲疲
労寿命を所定の値より高くすることができる。このため
、特に高い屈曲疲労寿命が要求されるフレキシブルプリ
ント基板用箔として最適な銅箔にすることができる。As explained above, according to the oxygen-free rolled copper foil of the present invention and the flexible printed circuit board using the same, the content of phosphorus is set to 1 ppm or less by weight, the content of inevitable impurities such as oxygen is set to 50 ppm or less, The thickness was reduced to less than 100 μm by final cold working with a processing degree of more than 90%.
The softening temperature can be lowered, and the flexural fatigue life after softening can be made higher than a predetermined value. Therefore, the copper foil can be made optimal as a foil for flexible printed circuit boards, which particularly requires a high bending fatigue life.
図は本考案の無酸素銅圧延箔の屈曲疲労寿命の試験方法
を示す概略図。
符号の説明
１−−−−−−−・−・−試料銅箔
２−−−−−−一固定板 ２ａ −一−−ねじ３
−−−−−・−−一−−−−−振動伝達部材４−−−−
−−・−発振駆動体The figure is a schematic diagram showing the test method for the bending fatigue life of the oxygen-free rolled copper foil of the present invention. Explanation of symbols 1 ------------Sample copper foil 2--Fixing plate 2a -1-Screw 3
-------・--1----Vibration transmission member 4----
−−・−Oscillation driver
Claims (2)
の不可避的不純物の含有量を５０ｐｐｍ以下にし、９０
％以上の加工度の最終冷間加工により厚さ１００μｍ以
下にしたことを特徴とする無酸素銅圧延箔。(1) The content of phosphorus is 1 ppm or less by weight, the content of unavoidable impurities such as oxygen is 50 ppm or less, and 90
An oxygen-free rolled copper foil characterized in that it has a thickness of 100 μm or less by final cold working with a working degree of 100 μm or more.
キシブル基板上に形成されたリードパターンより構成さ
れ、 このリードパターンは、燐の含有量を重量比で１ｐｐｍ
以下にし、酸素等の不可避的不純物の含有量を５０ｐｐ
ｍ以下にし、９０％以上の加工度の最終冷間加工により
厚さ１００μｍ以下にした無酸素銅圧延箔によって構成
されることを特徴とするフレキシブルプリント基板。(2) Consists of a flexible substrate such as plastic and a lead pattern formed on this flexible substrate, and this lead pattern has a phosphorus content of 1 ppm by weight.
or less, and the content of unavoidable impurities such as oxygen is 50pp.
A flexible printed circuit board comprising an oxygen-free rolled copper foil having a thickness of 100 μm or less by final cold working with a processing degree of 90% or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8552989A JPH02263959A (en) | 1989-04-04 | 1989-04-04 | Oxygen free copper rolled foil and flexible printing circuit board using it |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8552989A JPH02263959A (en) | 1989-04-04 | 1989-04-04 | Oxygen free copper rolled foil and flexible printing circuit board using it |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02263959A true JPH02263959A (en) | 1990-10-26 |
Family
ID=13861414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8552989A Pending JPH02263959A (en) | 1989-04-04 | 1989-04-04 | Oxygen free copper rolled foil and flexible printing circuit board using it |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02263959A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55145159A (en) * | 1979-04-12 | 1980-11-12 | Furukawa Kinzoku Kogyo Kk | Manufacture of copper foil with superior flexibility for printed wiring plate |
| JPS62112763A (en) * | 1985-11-12 | 1987-05-23 | Furukawa Electric Co Ltd:The | Manufacture of copper material for electric conduction softening at low temperature |
| JPS6411932A (en) * | 1987-07-06 | 1989-01-17 | Hitachi Cable | High pure oxygen-free copper and its use |
| JPH01212739A (en) * | 1988-02-22 | 1989-08-25 | Furukawa Electric Co Ltd:The | Manufacture of copper bar |
-
1989
- 1989-04-04 JP JP8552989A patent/JPH02263959A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55145159A (en) * | 1979-04-12 | 1980-11-12 | Furukawa Kinzoku Kogyo Kk | Manufacture of copper foil with superior flexibility for printed wiring plate |
| JPS62112763A (en) * | 1985-11-12 | 1987-05-23 | Furukawa Electric Co Ltd:The | Manufacture of copper material for electric conduction softening at low temperature |
| JPS6411932A (en) * | 1987-07-06 | 1989-01-17 | Hitachi Cable | High pure oxygen-free copper and its use |
| JPH01212739A (en) * | 1988-02-22 | 1989-08-25 | Furukawa Electric Co Ltd:The | Manufacture of copper bar |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR19990078447A (en) | Rolled copper foil and method of manufacturing the same | |
| KR100333567B1 (en) | Rolled Copper Foil for Flexible Printed Circuits and Process for Producing the Same | |
| KR101396214B1 (en) | Copper foil and copper-clad laminate plate using same | |
| KR100344859B1 (en) | rolled copper foil for flexible printed circuit board and method of manufacturing the same | |
| US6767643B2 (en) | Copper-alloy foil to be used for laminate sheet | |
| JP5514897B2 (en) | Laminate for flexible wiring | |
| WO2011052556A1 (en) | Copper or copper-alloy foil and method of manufacturing double-sided copper-clad laminate using same | |
| JP2009097075A (en) | Copper alloy foil, and flexible printed wiring board using it | |
| JP4162087B2 (en) | Highly flexible rolled copper foil and method for producing the same | |
| JP2001262296A (en) | Rolled copper foil and its manufacturing process | |
| JPH02263958A (en) | Oxygen free copper rolled foil and flexible printing circuit board using it | |
| JP3396465B2 (en) | Copper clad laminate | |
| JPH02263959A (en) | Oxygen free copper rolled foil and flexible printing circuit board using it | |
| JP3709109B2 (en) | Rolled copper foil for printed circuit board excellent in overhang processability and method for producing the same | |
| JPH0456754A (en) | Flexible oxygen-free copper rolled foil and flexible printed board and tab tape carrier using the foil | |
| JP2006335875A (en) | Polyimide film and method for producing the same | |
| JP4798894B2 (en) | Copper alloy foil for laminates | |
| JP4059150B2 (en) | Copper alloy foil for printed wiring and manufacturing method thereof | |
| JPH04228553A (en) | Bending resisting rolled copper foil | |
| JP3986707B2 (en) | Rolled copper foil for flexible printed circuit board and method for producing the same | |
| JPH01319641A (en) | Soft rolled copper foil and flexible printed board | |
| JP2002167632A (en) | Rolled copper foil for flexible printed circuit board and its production method | |
| JP2003041332A (en) | Copper alloy foil for laminate | |
| JP2000108150A (en) | Manufacture of metallic foil-applied laminate | |
| JPH02263957A (en) | Flexing-resistant oxygen free copper rolled foil and flexible printing circuit board using it |