JPH02263958A - Oxygen free copper rolled foil and flexible printing circuit board using it - Google Patents
Oxygen free copper rolled foil and flexible printing circuit board using itInfo
- Publication number
- JPH02263958A JPH02263958A JP8552889A JP8552889A JPH02263958A JP H02263958 A JPH02263958 A JP H02263958A JP 8552889 A JP8552889 A JP 8552889A JP 8552889 A JP8552889 A JP 8552889A JP H02263958 A JPH02263958 A JP H02263958A
- Authority
- JP
- Japan
- Prior art keywords
- oxygen
- rolled foil
- circuit board
- free copper
- copper rolled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 45
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 20
- 239000010949 copper Substances 0.000 title claims abstract description 20
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 title claims abstract description 16
- 229910052760 oxygen Inorganic materials 0.000 title claims abstract description 16
- 239000001301 oxygen Substances 0.000 title claims abstract description 16
- 239000011888 foil Substances 0.000 title claims abstract description 12
- 238000005482 strain hardening Methods 0.000 claims abstract description 12
- 239000012535 impurity Substances 0.000 claims abstract description 11
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 7
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 7
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 7
- 229910052720 vanadium Inorganic materials 0.000 claims abstract description 7
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 7
- 229910052758 niobium Inorganic materials 0.000 claims abstract description 6
- 229910052715 tantalum Inorganic materials 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 239000011889 copper foil Substances 0.000 description 25
- 238000005452 bending Methods 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 239000004840 adhesive resin Substances 0.000 description 3
- 229920006223 adhesive resin Polymers 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000009749 continuous casting Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野〕
本発明は無酸素銅圧延箔およびそれを用いたフレキシブ
ルプリント基板に関し、特に、低温軟化性および高い屈
曲疲労寿命を有した無酸素銅圧延箔およびそれを用いた
フレキシブルプリント基板に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to an oxygen-free rolled copper foil and a flexible printed circuit board using the same, and in particular to an oxygen-free rolled copper foil that has low-temperature softening properties and a high flexural fatigue life. and a flexible printed circuit board using the same.
〔従来の技術］
ＯＡ機器や電子機器類のプリンタおよびハードディスク
ドライブ装置等にフレキシブルプリント２５４Ｈが使用
されている。このフレキシブルプリント基板は、例えば
、ポリイミド等から成る絶縁フィルム上にエポキシ等の
接着樹脂を介して銅箔を貼り合わせ、接着樹脂を１３０
°Ｃ〜１７０″ＣＸ１ｈｒ〜２４ｈｒの条件で加熱硬化
させ、この後、銅箔をエンチングして所定の配線パター
ンを形成することによって製造される。[Prior Art] Flexible print 254H is used in printers, hard disk drives, etc. of OA equipment and electronic equipment. For example, this flexible printed circuit board is made by bonding copper foil to an insulating film made of polyimide or the like via an adhesive resin such as epoxy, and then applying the adhesive resin to a 130%
It is manufactured by heating and curing under the conditions of °C to 170''CX 1 hr to 24 hr, and then etching the copper foil to form a predetermined wiring pattern.
ところで、最近、装置の小型化等の目的から曲率５〜１
５ｍｍの範囲で１０”〜１０９回の屈曲疲労寿命を有し
たフレキシブルプリンｌ−基板の開発が望まれており、
このため、それに耐える屈曲疲労寿命を有する銅箔が要
求されている。これは、ポリイミド等からなる絶縁フィ
ルムの屈曲疲労寿命が銅箔に比較して著しく大きいこと
から、フレキシブルプリント基板全体の屈曲疲労寿命は
銅箔によって決定されるためである。また、この銅箔と
して、絶縁フィルム上に貼り合わせる際、取り扱いが容
易なように硬質で、かつ、加熱硬化後に軟化し上記屈曲
疲労寿命が向上するように軟化温度の低いものが要求さ
れている。By the way, recently, for the purpose of downsizing the device, the curvature is 5 to 1.
It is desired to develop a flexible printed circuit board with a bending fatigue life of 10" to 109 times in the range of 5 mm.
Therefore, there is a need for a copper foil that has a flexural fatigue life that can withstand this. This is because the bending fatigue life of an insulating film made of polyimide or the like is significantly longer than that of copper foil, and the bending fatigue life of the entire flexible printed circuit board is determined by the copper foil. In addition, this copper foil is required to be hard so that it can be easily handled when laminated onto an insulating film, and to have a low softening temperature so that it softens after being heated and hardened to improve the above-mentioned flex fatigue life. .
このような要求のなかで従来のフレキンフルプリント基
板は、酸素を２００〜３００ｐｐｍ含んだタフピッチ銅
箔を使用している。In response to these demands, conventional flexible full printed circuit boards use tough pitch copper foil containing 200 to 300 ppm of oxygen.
しかし、従来のタフピッチ銅箔によると、屈曲疲労寿命
が必ずしも十分でない。これに対して酸素含有量が３ｐ
ｐｍ以下の無酸素銅は屈曲疲労特性が優れているものの
、５〜１５＋ｎｍという小さい曲率における屈曲疲労特
性が不十分であり、また、軟化温度もタフピッチ銅より
高いという不都合がある。However, conventional tough pitch copper foils do not necessarily have a sufficient bending fatigue life. On the other hand, the oxygen content is 3p
Although oxygen-free copper with a diameter of less than pm has excellent bending fatigue properties, it has insufficient bending fatigue properties at a small curvature of 5 to 15+ nm, and also has a disadvantage that its softening temperature is higher than that of tough pitch copper.
従って、本発明の目的は低温軟化性および高い屈曲疲労
寿命を有する無酸素銅圧延箔およびそれを用いたフレキ
シブルプリント基板を提供することである。Therefore, an object of the present invention is to provide an oxygen-free rolled copper foil having low-temperature softening properties and a high flexural fatigue life, and a flexible printed circuit board using the same.
本発明は以上述べた目的を実現するため、ＮｂＴｉ
Ｎｉ、 Ｚｒ、 Ｖ、 ＭｎおよびＴａ中の１種、も
しくは２種以上の元素の合計含有量を０．００１−０．
０５重量％の範囲内にし、酸素等の不可避的不純物の含
有量を５０ｐｐｍ以下にし、９０％以上の加工度の最終
冷間加工により厚さ１００μｍ以下にした無酸素銅圧延
箔およびそれを用いたフレキシブルプリント基板を提供
するものである。In order to achieve the above-mentioned objects, the present invention
The total content of one or more elements among Ni, Zr, V, Mn and Ta is 0.001-0.001.
05% by weight, the content of unavoidable impurities such as oxygen is 50ppm or less, and the oxygen-free rolled copper foil is made to have a thickness of 100μm or less by final cold working with a working degree of 90% or more, and the use thereof The present invention provides a flexible printed circuit board.
即ち、本発明の無酸素銅圧延箔およびそれを用いたフレ
キシブルプリント基板は、以下の条件を有している。That is, the oxygen-free rolled copper foil of the present invention and the flexible printed circuit board using the same have the following conditions.
（１）Ｎｂ、 Ｔｉ、 Ｎｉ、 Ｚｒ、 Ｖ、 Ｍｎ
およびＴａの含有量Ｎｂ、 Ｔｉ、 Ｎｉ、 Ｚｒ、
Ｖ、 ＭｎおよびＴａ中の１種、もしくは２種以上の
元素の合計含有量を０．００１〜０．０５重量％の範囲
内にする。その理由は、０．００１重量％未満では軟化
温度の低下が不十分やあり、０．０５重量％以上では添
加元素が多くなりすぎ、軟化温度がタフピッチ銅より高
くなってしまうと共に導電率の劣化が生じるためである
。(1) Nb, Ti, Ni, Zr, V, Mn
and Ta content Nb, Ti, Ni, Zr,
The total content of one or more elements among V, Mn and Ta is within the range of 0.001 to 0.05% by weight. The reason for this is that if it is less than 0.001% by weight, the softening temperature will not be lowered enough, and if it is more than 0.05% by weight, the amount of added elements will be too large, and the softening temperature will be higher than that of tough pitch copper, and the conductivity will deteriorate. This is because
（２）不可避的不純物の含有量
不可避的不純物は酸素が主な成分であり、酸素含有量が
多いと軟化後の屈曲疲労寿命が劣化する特性がある。従
って、不可避的不純物の含有量を５０ｐｐｍ以下にする
。(2) Content of unavoidable impurities The main component of unavoidable impurities is oxygen, and when the oxygen content is high, the flexural fatigue life after softening deteriorates. Therefore, the content of unavoidable impurities should be 50 ppm or less.
（３）最終冷間加工度 最終冷間加工度（％）は次式によって求められる。(3) Final cold working degree The final degree of cold work (%) is determined by the following formula.
最終冷間加工度を９０％以上にするのは、軟化後の銅箔
の屈曲疲労寿命が最終冷間加工度の増大とともに向上し
、特に、９０％以上において急激に向上するためである
。The reason why the final cold working degree is set to 90% or more is because the bending fatigue life of the copper foil after softening improves as the final cold working degree increases, and in particular, it improves rapidly at 90% or more.
これらの条件を有する無酸素銅圧延箔は軟化温度が低く
、かつ、屈曲疲労寿命が著しく向上するため、フレキシ
ブルプリンｌ−基板用箔として極めて良好なものとなる
。Oxygen-free rolled copper foil having these conditions has a low softening temperature and a significantly improved bending fatigue life, making it extremely suitable as a foil for flexible printed circuit boards.
以下、本発明の無酸素銅圧延箔およびそれを用いたフレ
キシブルプリント基板を詳細に説明する。Hereinafter, the oxygen-free rolled copper foil of the present invention and the flexible printed circuit board using the same will be explained in detail.
酸素等の不可避的不純物の含有量が５０ｐρｌ以下の無
酸素銅を連続鋳造装置により溶解し、その溶湯中にそれ
ぞれ次表に示す各元素をそれぞれ母合金あるいは銅と添
加元素の複合材のかたちで添加し、厚さ約２００ ｎｕ
ｎ、幅約６５０ ｍｍの無酸素銅ベースのインゴットと
した。この鋳塊を約１０ｍｍに熱間圧延し、更に、中間
焼鈍、冷間圧延を繰り返し行い厚さ２ ｍｍ、 ０．８
ｍｍ、 ０．５ ｍｍ、 Ｏ，１８ｍｍ、 ０．１０
ｍｍの生地焼鈍材を得た。これを冷間圧延して最終的に
厚さ０．０３５ ｍｍにした。それぞれの最終冷間加工
度は９８％、９６％、９３％、９０％、８１％、および
６５％であり、また、比較材としてＮｂ、Ｔｉ等を添加
していない通常の無酸素銅（サンプルＮｏ、 ２ ）お
よび酸素を２５０ ｐｐｍ含有しているタフピッチ銅（
サンプルＮα１）を厚さ０．０３５ ｍｍ、加工度９３
％で製造した。Oxygen-free copper with a content of unavoidable impurities such as oxygen of 50 pρl or less is melted using a continuous casting machine, and each element shown in the following table is added to the molten metal in the form of a master alloy or a composite material of copper and additive elements. Added to a thickness of about 200 nu
An oxygen-free copper-based ingot with a width of about 650 mm was prepared. This ingot was hot rolled to a thickness of about 10 mm, and then intermediate annealing and cold rolling were repeated to a thickness of 2 mm and 0.8 mm.
mm, 0.5 mm, O, 18 mm, 0.10
A dough annealed material of mm was obtained. This was cold rolled to a final thickness of 0.035 mm. The respective final cold working degrees are 98%, 96%, 93%, 90%, 81%, and 65%, and as a comparative material, ordinary oxygen-free copper (sample) without addition of Nb, Ti, etc. No. 2) and tough pitch copper containing 250 ppm oxygen (
Sample Nα1) with a thickness of 0.035 mm and a processing degree of 93
Produced in %.
下表に示すように、以上の各種銅箔について、その主な
不純物を分析すると共に完全軟化（２５０”Ｃ×１ｈｒ
）後の屈曲疲労寿命を測定した。As shown in the table below, the main impurities of the various copper foils mentioned above were analyzed and completely softened (250"C x 1hr).
) was measured.
屈曲疲労寿命の測定は、図に示すような試験装置を用い
て行った。ここで、簡単に試験装置を説明すると、発振
駆動体４にその振動を矢印方向に伝達する振動伝達部材
３が接続され、その先端には固定板２にねじ２ａを介し
て固定された試料銅箔１の端部が所定の曲率Ｒを有して
ヘアピン状に屈曲しながら固定している。このときの試
験条件は、サンプル幅１１０ｍｍ、曲率Ｒ；５ｍｍ、振
動ストローク；１０ｍｍ、振動周波数；２５１ｒｚ、同
一条件測定数（Ｎ）；６とした。The bending fatigue life was measured using a testing device as shown in the figure. Here, to briefly explain the test apparatus, a vibration transmission member 3 that transmits the vibration in the direction of the arrow is connected to the oscillation drive body 4, and a sample copper plate fixed to the fixing plate 2 via screws 2a is connected to the tip of the vibration transmission member 3. The end of the foil 1 has a predetermined curvature R and is fixed while being bent into a hairpin shape. The test conditions at this time were: sample width 110 mm, curvature R: 5 mm, vibration stroke: 10 mm, vibration frequency: 251 rz, and number of measurements under the same conditions (N): 6.
表の結果から同一加工度の場合、軟化温度は本発明の無
酸素銅（サンプルＮｏ、５． ６． ７． ８．１２１
４、１６．１８．２０．２２） 、比較例のタフピッチ
銅（サンプルＮｏ、１）、比較例の無酸素銅（サンプル
Ｎｏ、 ２ ）の順に低く、屈曲疲労寿命は本発明の無
酸素銅（サンプルＮｏ、６． ７． ８．１２．１４．
１６．１８２０、２２） 、比較例の無酸素銅（サンプ
ルＮｏ、 ２ ）、比較例のタフピッチ銅（サンプルＮ
ｏ、 １ ）の順に大きくなっていることが判る。また
、最終冷間加工度を９０％以下にしたものにあっては合
金組成が本発明と一致していても屈曲疲労寿命が向上し
ておらず、屈曲疲労寿命は加工度を９０％以上にするこ
とにより急激に向上していることが判る。尚、以上の表
に示されたデータは２５０°ＣＸ１ｈｒ加熱後のもので
あるが、フレキシブルプリント基板の加工時は、１３０
°Ｃ〜１７０°ＣＸ １ ｈｒ 〜２４ｈｒという低温
で加熱されるため、比較例の無酸素銅（サンプルＮα２
）は完全に軟化していないことになり、表に示した屈曲
疲労寿命の数値より低くなるが、他のサンプルにおいて
は略表に示した通りの寿命が得られる。From the results in the table, when the working degree is the same, the softening temperature is lower than that of the oxygen-free copper of the present invention (sample No. 5. 6. 7. 8.121).
4, 16, 18, 20, 22), Comparative Example Tough Pitch Copper (Sample No. 1), and Comparative Example Oxygen-Free Copper (Sample No. 2). Sample No. 6. 7. 8.12.14.
16.1820, 22), Comparative Example Oxygen-Free Copper (Sample No. 2), Comparative Example Tough Pitch Copper (Sample No.
It can be seen that the values increase in the order of o and 1). In addition, for those with a final degree of cold working of 90% or less, even if the alloy composition matches the present invention, the flexural fatigue life does not improve, and the flexural fatigue life does not improve when the degree of cold working is 90% or more. It can be seen that there is a rapid improvement. The data shown in the above table is after heating at 250°C for 1 hour, but when processing flexible printed circuit boards, heating at 130°C
Because it is heated at a low temperature of °C to 170 °C
) is not completely softened and the flexural fatigue life value is lower than the value shown in the table, but other samples can obtain the life as shown in the table.
以上のようにして得られた本発明の無酸素銅圧延箔をポ
リイミド等から成る絶縁フィルム上にエポキシ等の接着
樹脂を介して貼り合わせ、これを１３０°Ｃ〜１７０°
ＣＸ １ ｈｒ〜２４ｈｒの条件で加熱して硬化させ、
この後、工・ンチングしで所定の配線パターンを形成し
てフレキシブルプリント基板を製造した。このようにし
て得られたフレキシブルプリント基板の屈曲疲労寿命を
調べたところ、表に示したのと同様な屈曲疲労特性が得
られた。The oxygen-free rolled copper foil of the present invention obtained as described above is laminated onto an insulating film made of polyimide or the like via an adhesive resin such as epoxy, and the foil is heated at 130°C to 170°C.
Heating and curing under the conditions of CX 1 hr to 24 hr,
Thereafter, a predetermined wiring pattern was formed by machining and nitching to produce a flexible printed circuit board. When the bending fatigue life of the flexible printed circuit board thus obtained was investigated, bending fatigue characteristics similar to those shown in the table were obtained.
本実施例では、０．０３５ ｍｍ厚さの無酸素銅圧延箔
について説明したが、０．１ｍｍ以下の厚さならば全て
適用可能である。一般に、フレキシブルプリント基板用
銅箔としては、０．０３５ ｍｍの他に、０．０７０ｍ
ｍ、 ０．０１８ ｍｍが使用されている。また、本発
明の無酸素銅圧延箔はフレキシブルプリント基板用銅箔
以外にも、高い屈曲疲労寿命の要求される他の用途に有
用であることは言うまでもない。In this embodiment, an oxygen-free copper rolled foil having a thickness of 0.035 mm has been described, but any thickness of 0.1 mm or less is applicable. In general, copper foil for flexible printed circuit boards has a thickness of 0.070 mm in addition to 0.035 mm.
m, 0.018 mm is used. Moreover, it goes without saying that the oxygen-free rolled copper foil of the present invention is useful not only as a copper foil for flexible printed circuit boards but also for other uses that require a high bending fatigue life.
〔発明の効果］
以上説明した通り、本発明の無酸素銅圧延箔およびそれ
を用いたフレキシブルプリント基（反によると、Ｎｂ、
Ｔｉ、 Ｎｉ、 Ｚｒ、 Ｖ、 ＭｎおよびＴａ中
の１種、もしくは２種以上の元素の合計含有量をｏ、ｏ
ｏｔ〜０．０５重量％の範囲内にし、酸素等の不可避的
不純物の含有量を５０ｐｐｍ以下にし、９０％以上の加
工度の冷間加工により厚さｌ００１１ｍ以下にしたため
、軟化温度を低くすることができ、かつ、軟化後の屈曲
疲労寿命を所定の値より高くすることができる。このた
め、特に高い屈曲疲労寿命が要求されるフレキシブルプ
リント基板用箔として最適な銅箔にすることができる。[Effects of the Invention] As explained above, the oxygen-free rolled copper foil of the present invention and the flexible print base using the same (according to the material, Nb,
The total content of one or more elements among Ti, Ni, Zr, V, Mn and Ta is o, o
ot to 0.05% by weight, the content of unavoidable impurities such as oxygen is 50ppm or less, and the thickness is reduced to 10011m or less by cold working with a working degree of 90% or more, thereby lowering the softening temperature. and the flexural fatigue life after softening can be made higher than a predetermined value. Therefore, the copper foil can be made optimal as a foil for flexible printed circuit boards, which particularly requires a high bending fatigue life.
図は本考案の無酸素銅圧延箔の屈曲疲労寿命の試験方法
を示す概略図。
符号の説明
■−・・−−−一一−−−−試料銅箔
２−−−−−−〜−−−−固定板 ２ａ・−−−
−一−−−ねし３−・−一−−−−−−−−−振動伝達
部材４−・−・・−−−−−一発振駆動体The figure is a schematic diagram showing the test method for the bending fatigue life of the oxygen-free rolled copper foil of the present invention. Explanation of symbols■--・・--11-----Sample copper foil 2--------Fixing plate 2a・----
-1--Next 3--1--Vibration transmission member 4--1 oscillation driver
Claims (2)
の１種、もしくは２種以上の元素の合計含有量を０．０
０１〜０．０５重量％の範囲内にし、酸素等の不可避的
不純物の含有量を５０ｐｐｍ以下にし、９０％以上の加
工度の最終冷間加工により厚さ１００μｍ以下にしたこ
とを特徴とする無酸素銅圧延箔。(1) The total content of one or more elements among Nb, Ti, Ni, Zr, V, Mn and Ta is 0.0
01 to 0.05% by weight, the content of unavoidable impurities such as oxygen is 50 ppm or less, and the thickness is reduced to 100 μm or less by final cold working with a working degree of 90% or more. Oxygenated copper rolled foil.
キシブル基板上に形成されたリードパターンより構成さ
れ、 このリードパターンは、Ｎｂ，Ｔｉ，Ｎｉ，Ｚｒ，Ｖ，
ＭｎおよびＴａ中の１種、もしくは２種以上の元素の合
計含有量を０．００１〜０．０５重量％の範囲内にし、
酸素等の不可避的不純物の含有量を５０ｐｐｍ以下にし
、９０％以上の加工度の最終冷間加工により厚さ１００
μｍ以下にした無酸素銅圧延箔によって構成されること
を特徴とするフレキシブルプリント基板。(2) Consists of a flexible substrate made of plastic or the like and a lead pattern formed on this flexible substrate, and this lead pattern includes Nb, Ti, Ni, Zr, V,
The total content of one or more elements in Mn and Ta is within the range of 0.001 to 0.05% by weight,
The content of unavoidable impurities such as oxygen is 50 ppm or less, and the thickness is 100% by final cold working with a processing degree of 90% or more.
A flexible printed circuit board characterized in that it is constructed of oxygen-free copper rolled foil with a thickness of micrometer or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8552889A JPH02263958A (en) | 1989-04-04 | 1989-04-04 | Oxygen free copper rolled foil and flexible printing circuit board using it |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8552889A JPH02263958A (en) | 1989-04-04 | 1989-04-04 | Oxygen free copper rolled foil and flexible printing circuit board using it |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02263958A true JPH02263958A (en) | 1990-10-26 |
Family
ID=13861389
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8552889A Pending JPH02263958A (en) | 1989-04-04 | 1989-04-04 | Oxygen free copper rolled foil and flexible printing circuit board using it |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02263958A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006274384A (en) * | 2005-03-30 | 2006-10-12 | Hitachi Cable Ltd | Method for producing copper material and the copper material |
| JP2010150598A (en) * | 2008-12-25 | 2010-07-08 | Hitachi Cable Ltd | Rolled copper foil |
| JP2012214894A (en) * | 2011-03-31 | 2012-11-08 | Nippon Steel Chem Co Ltd | Copper foil, copper-clad laminate, flexible circuit board, and manufacturing method for copper-clad laminate |
| CN103415635A (en) * | 2011-03-31 | 2013-11-27 | 新日铁住金化学株式会社 | Copper foil, copper-clad laminate, flexible circuit board, and manufacturing method for copper-clad laminate |
-
1989
- 1989-04-04 JP JP8552889A patent/JPH02263958A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006274384A (en) * | 2005-03-30 | 2006-10-12 | Hitachi Cable Ltd | Method for producing copper material and the copper material |
| JP4674483B2 (en) * | 2005-03-30 | 2011-04-20 | 日立電線株式会社 | Copper material manufacturing method and copper material |
| JP2010150598A (en) * | 2008-12-25 | 2010-07-08 | Hitachi Cable Ltd | Rolled copper foil |
| JP2012214894A (en) * | 2011-03-31 | 2012-11-08 | Nippon Steel Chem Co Ltd | Copper foil, copper-clad laminate, flexible circuit board, and manufacturing method for copper-clad laminate |
| CN103415635A (en) * | 2011-03-31 | 2013-11-27 | 新日铁住金化学株式会社 | Copper foil, copper-clad laminate, flexible circuit board, and manufacturing method for copper-clad laminate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100333567B1 (en) | Rolled Copper Foil for Flexible Printed Circuits and Process for Producing the Same | |
| KR19990078447A (en) | Rolled copper foil and method of manufacturing the same | |
| JP2000212660A (en) | Rolled copper foil for flexible printed circuit board and its production | |
| KR101632515B1 (en) | Rolled copper foil | |
| JP5235080B2 (en) | Copper alloy foil and flexible printed circuit board using the same | |
| EP1180917B1 (en) | Laminate sheet of copper-alloy foil and liquid crystal polymer | |
| JP3824593B2 (en) | Rolled copper foil with high elongation | |
| JP2006063431A (en) | Copper alloy and its production method | |
| KR20200141427A (en) | Copper foil for flexible printed circuit, and copper clad laminate, flexible printed circuit and electronic device using copper foil | |
| JP2001262296A (en) | Rolled copper foil and its manufacturing process | |
| JPH02263958A (en) | Oxygen free copper rolled foil and flexible printing circuit board using it | |
| KR20030014168A (en) | Copper alloy foil for laminated sheet | |
| JP5933943B2 (en) | Rolled copper foil for flexible printed wiring boards, copper-clad laminates, flexible printed wiring boards, and electronic equipment | |
| JP2003041334A (en) | Copper alloy foil for laminate | |
| JPH0456754A (en) | Flexible oxygen-free copper rolled foil and flexible printed board and tab tape carrier using the foil | |
| JP4798894B2 (en) | Copper alloy foil for laminates | |
| JP4550263B2 (en) | Copper alloy foil for laminates | |
| JP4059150B2 (en) | Copper alloy foil for printed wiring and manufacturing method thereof | |
| JPH02263959A (en) | Oxygen free copper rolled foil and flexible printing circuit board using it | |
| JPH01319641A (en) | Soft rolled copper foil and flexible printed board | |
| JP4798890B2 (en) | Copper alloy foil for laminates | |
| JPH04228553A (en) | Bending resisting rolled copper foil | |
| JP2005029826A (en) | Method for manufacturing copper alloy foil for electronic component | |
| JP2002167632A (en) | Rolled copper foil for flexible printed circuit board and its production method | |
| JP2003041332A (en) | Copper alloy foil for laminate |