JPS6456841A - Copper alloy foil for flexible circuit board - Google Patents
Copper alloy foil for flexible circuit boardInfo
- Publication number
- JPS6456841A JPS6456841A JP21129287A JP21129287A JPS6456841A JP S6456841 A JPS6456841 A JP S6456841A JP 21129287 A JP21129287 A JP 21129287A JP 21129287 A JP21129287 A JP 21129287A JP S6456841 A JPS6456841 A JP S6456841A
- Authority
- JP
- Japan
- Prior art keywords
- foil
- copper alloy
- contg
- alloy foil
- thin plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Wire Bonding (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
PURPOSE:To obtain the titled alloy foil having excellent heat resistance, heat shock resistance, peeling resistance, deformation resistance, workability and furthermore having excellent flexibility by subjecting an oxygen-free copper alloy ingot having specific compsn. to hot rolling and cold rolling into a copper alloy foil and thereafter subjecting said foil to stress relief annealing. CONSTITUTION:The Cu alloy contg. 0.005-1.5% total of one or more kinds of groups selected from 0.005-0.05% P and Cu, each 0.01-0.5% Al, As, Cd, Co, Fe, In, Mg, Mn, Ni, Si, Sn and Te and each 0.01-1% Ag, Cr, Hf, Zn and Zr and contg. <0.0015% Bi, <0.002% Se and <0.01% Pb is melted in an inert gas atm. by a high-frequency electric furnace and is cast into the Cu alloy ingot contg. <50ppm O2. Said ingot is hot rolled and cold rolled into a thin plate having 1mm thickness; it is then annealed for an hour at 500 deg.C into a thin plate of 0.2mm. The thin plate is again annealed for an hour at 500 deg.C and is finished into a copper alloy foil having 0.035mm thickness by final cold rolling. Said foil is thereafter subjected to stress relief annealing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62211292A JP2505480B2 (en) | 1987-08-27 | 1987-08-27 | Copper alloy foil for flexible circuit boards |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62211292A JP2505480B2 (en) | 1987-08-27 | 1987-08-27 | Copper alloy foil for flexible circuit boards |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6456841A true JPS6456841A (en) | 1989-03-03 |
JP2505480B2 JP2505480B2 (en) | 1996-06-12 |
Family
ID=16603517
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62211292A Expired - Fee Related JP2505480B2 (en) | 1987-08-27 | 1987-08-27 | Copper alloy foil for flexible circuit boards |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2505480B2 (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002306981A (en) * | 2001-04-17 | 2002-10-22 | Toshiba Mach Co Ltd | Grinder |
KR20030014168A (en) * | 2001-08-10 | 2003-02-15 | 닛코 킨조쿠 가부시키가이샤 | Copper alloy foil for laminated sheet |
KR100491385B1 (en) * | 2001-07-04 | 2005-05-24 | 닛꼬 긴조꾸 가꼬 가부시키가이샤 | Copper alloy foil for laminated sheet |
KR100504518B1 (en) * | 2001-07-13 | 2005-08-03 | 닛꼬 긴조꾸 가꼬 가부시키가이샤 | Copper alloy foil for laminated sheet |
JP2007125795A (en) * | 2005-11-04 | 2007-05-24 | Komatsu Zenoah Co | Foliage crushing machine |
CN108012406A (en) * | 2017-12-06 | 2018-05-08 | 广州兴森快捷电路科技有限公司 | Stretchable FPC plates and preparation method thereof |
JP2019029606A (en) * | 2017-08-03 | 2019-02-21 | Jx金属株式会社 | Copper foil for flexible printed board, copper-clad laminate arranged by use thereof, flexible printed board, and electronic device |
CN110252972A (en) * | 2019-07-06 | 2019-09-20 | 湖北精益高精铜板带有限公司 | High-strength highly-conductive microalloy copper foil and its processing method |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104593618B (en) * | 2015-01-06 | 2016-08-24 | 湖南金龙国际铜业有限公司 | Height leads ultra micro alloy regeneration copper bar and method of refining thereof |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52131925A (en) * | 1976-04-27 | 1977-11-05 | Sumitomo Electric Ind Ltd | Heat resisting tough pitch copper for electric wire |
JPS575838A (en) * | 1980-04-09 | 1982-01-12 | Amax Inc | Cold-worked copper base alloy |
JPS58147142A (en) * | 1982-02-26 | 1983-09-01 | Furukawa Electric Co Ltd:The | Cu alloy for lead wire material of semiconductor device |
JPS5978592A (en) * | 1982-10-27 | 1984-05-07 | 株式会社フジクラ | Flexible printed board |
JPS6017040A (en) * | 1983-07-08 | 1985-01-28 | Sumitomo Metal Mining Co Ltd | Copper alloy for high electric conduction having low softening temperature |
JPS6164837A (en) * | 1984-09-06 | 1986-04-03 | Kobe Steel Ltd | Copper alloy for flexible print |
JPS61259555A (en) * | 1985-05-14 | 1986-11-17 | Mitsubishi Metal Corp | Cu alloy bonding wire for semiconductor device |
-
1987
- 1987-08-27 JP JP62211292A patent/JP2505480B2/en not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52131925A (en) * | 1976-04-27 | 1977-11-05 | Sumitomo Electric Ind Ltd | Heat resisting tough pitch copper for electric wire |
JPS575838A (en) * | 1980-04-09 | 1982-01-12 | Amax Inc | Cold-worked copper base alloy |
JPS58147142A (en) * | 1982-02-26 | 1983-09-01 | Furukawa Electric Co Ltd:The | Cu alloy for lead wire material of semiconductor device |
JPS5978592A (en) * | 1982-10-27 | 1984-05-07 | 株式会社フジクラ | Flexible printed board |
JPS6017040A (en) * | 1983-07-08 | 1985-01-28 | Sumitomo Metal Mining Co Ltd | Copper alloy for high electric conduction having low softening temperature |
JPS6164837A (en) * | 1984-09-06 | 1986-04-03 | Kobe Steel Ltd | Copper alloy for flexible print |
JPS61259555A (en) * | 1985-05-14 | 1986-11-17 | Mitsubishi Metal Corp | Cu alloy bonding wire for semiconductor device |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002306981A (en) * | 2001-04-17 | 2002-10-22 | Toshiba Mach Co Ltd | Grinder |
KR100491385B1 (en) * | 2001-07-04 | 2005-05-24 | 닛꼬 긴조꾸 가꼬 가부시키가이샤 | Copper alloy foil for laminated sheet |
KR100504518B1 (en) * | 2001-07-13 | 2005-08-03 | 닛꼬 긴조꾸 가꼬 가부시키가이샤 | Copper alloy foil for laminated sheet |
KR20030014168A (en) * | 2001-08-10 | 2003-02-15 | 닛코 킨조쿠 가부시키가이샤 | Copper alloy foil for laminated sheet |
JP2007125795A (en) * | 2005-11-04 | 2007-05-24 | Komatsu Zenoah Co | Foliage crushing machine |
JP2019029606A (en) * | 2017-08-03 | 2019-02-21 | Jx金属株式会社 | Copper foil for flexible printed board, copper-clad laminate arranged by use thereof, flexible printed board, and electronic device |
CN108012406A (en) * | 2017-12-06 | 2018-05-08 | 广州兴森快捷电路科技有限公司 | Stretchable FPC plates and preparation method thereof |
CN110252972A (en) * | 2019-07-06 | 2019-09-20 | 湖北精益高精铜板带有限公司 | High-strength highly-conductive microalloy copper foil and its processing method |
CN110252972B (en) * | 2019-07-06 | 2021-11-30 | 湖北精益高精铜板带有限公司 | High-strength high-conductivity microalloy copper foil and processing method thereof |
Also Published As
Publication number | Publication date |
---|---|
JP2505480B2 (en) | 1996-06-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
LAPS | Cancellation because of no payment of annual fees |