JPS6456841A - Copper alloy foil for flexible circuit board - Google Patents

Copper alloy foil for flexible circuit board

Info

Publication number
JPS6456841A
JPS6456841A JP21129287A JP21129287A JPS6456841A JP S6456841 A JPS6456841 A JP S6456841A JP 21129287 A JP21129287 A JP 21129287A JP 21129287 A JP21129287 A JP 21129287A JP S6456841 A JPS6456841 A JP S6456841A
Authority
JP
Japan
Prior art keywords
foil
copper alloy
contg
alloy foil
thin plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21129287A
Other languages
Japanese (ja)
Other versions
JP2505480B2 (en
Inventor
Masahiro Tsuji
Susumu Kawauchi
Hiroshi Nakayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eneos Corp
Original Assignee
Nippon Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co Ltd filed Critical Nippon Mining Co Ltd
Priority to JP62211292A priority Critical patent/JP2505480B2/en
Publication of JPS6456841A publication Critical patent/JPS6456841A/en
Application granted granted Critical
Publication of JP2505480B2 publication Critical patent/JP2505480B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To obtain the titled alloy foil having excellent heat resistance, heat shock resistance, peeling resistance, deformation resistance, workability and furthermore having excellent flexibility by subjecting an oxygen-free copper alloy ingot having specific compsn. to hot rolling and cold rolling into a copper alloy foil and thereafter subjecting said foil to stress relief annealing. CONSTITUTION:The Cu alloy contg. 0.005-1.5% total of one or more kinds of groups selected from 0.005-0.05% P and Cu, each 0.01-0.5% Al, As, Cd, Co, Fe, In, Mg, Mn, Ni, Si, Sn and Te and each 0.01-1% Ag, Cr, Hf, Zn and Zr and contg. <0.0015% Bi, <0.002% Se and <0.01% Pb is melted in an inert gas atm. by a high-frequency electric furnace and is cast into the Cu alloy ingot contg. <50ppm O2. Said ingot is hot rolled and cold rolled into a thin plate having 1mm thickness; it is then annealed for an hour at 500 deg.C into a thin plate of 0.2mm. The thin plate is again annealed for an hour at 500 deg.C and is finished into a copper alloy foil having 0.035mm thickness by final cold rolling. Said foil is thereafter subjected to stress relief annealing.
JP62211292A 1987-08-27 1987-08-27 Copper alloy foil for flexible circuit boards Expired - Fee Related JP2505480B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62211292A JP2505480B2 (en) 1987-08-27 1987-08-27 Copper alloy foil for flexible circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62211292A JP2505480B2 (en) 1987-08-27 1987-08-27 Copper alloy foil for flexible circuit boards

Publications (2)

Publication Number Publication Date
JPS6456841A true JPS6456841A (en) 1989-03-03
JP2505480B2 JP2505480B2 (en) 1996-06-12

Family

ID=16603517

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62211292A Expired - Fee Related JP2505480B2 (en) 1987-08-27 1987-08-27 Copper alloy foil for flexible circuit boards

Country Status (1)

Country Link
JP (1) JP2505480B2 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002306981A (en) * 2001-04-17 2002-10-22 Toshiba Mach Co Ltd Grinder
KR20030014168A (en) * 2001-08-10 2003-02-15 닛코 킨조쿠 가부시키가이샤 Copper alloy foil for laminated sheet
KR100491385B1 (en) * 2001-07-04 2005-05-24 닛꼬 긴조꾸 가꼬 가부시키가이샤 Copper alloy foil for laminated sheet
KR100504518B1 (en) * 2001-07-13 2005-08-03 닛꼬 긴조꾸 가꼬 가부시키가이샤 Copper alloy foil for laminated sheet
JP2007125795A (en) * 2005-11-04 2007-05-24 Komatsu Zenoah Co Foliage crushing machine
CN108012406A (en) * 2017-12-06 2018-05-08 广州兴森快捷电路科技有限公司 Stretchable FPC plates and preparation method thereof
JP2019029606A (en) * 2017-08-03 2019-02-21 Ｊｘ金属株式会社 Copper foil for flexible printed board, copper-clad laminate arranged by use thereof, flexible printed board, and electronic device
CN110252972A (en) * 2019-07-06 2019-09-20 湖北精益高精铜板带有限公司 High-strength highly-conductive microalloy copper foil and its processing method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104593618B (en) * 2015-01-06 2016-08-24 湖南金龙国际铜业有限公司 Height leads ultra micro alloy regeneration copper bar and method of refining thereof

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52131925A (en) * 1976-04-27 1977-11-05 Sumitomo Electric Ind Ltd Heat resisting tough pitch copper for electric wire
JPS575838A (en) * 1980-04-09 1982-01-12 Amax Inc Cold-worked copper base alloy
JPS58147142A (en) * 1982-02-26 1983-09-01 Furukawa Electric Co Ltd:The Cu alloy for lead wire material of semiconductor device
JPS5978592A (en) * 1982-10-27 1984-05-07 株式会社フジクラ Flexible printed board
JPS6017040A (en) * 1983-07-08 1985-01-28 Sumitomo Metal Mining Co Ltd Copper alloy for high electric conduction having low softening temperature
JPS6164837A (en) * 1984-09-06 1986-04-03 Kobe Steel Ltd Copper alloy for flexible print
JPS61259555A (en) * 1985-05-14 1986-11-17 Mitsubishi Metal Corp Cu alloy bonding wire for semiconductor device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52131925A (en) * 1976-04-27 1977-11-05 Sumitomo Electric Ind Ltd Heat resisting tough pitch copper for electric wire
JPS575838A (en) * 1980-04-09 1982-01-12 Amax Inc Cold-worked copper base alloy
JPS58147142A (en) * 1982-02-26 1983-09-01 Furukawa Electric Co Ltd:The Cu alloy for lead wire material of semiconductor device
JPS5978592A (en) * 1982-10-27 1984-05-07 株式会社フジクラ Flexible printed board
JPS6017040A (en) * 1983-07-08 1985-01-28 Sumitomo Metal Mining Co Ltd Copper alloy for high electric conduction having low softening temperature
JPS6164837A (en) * 1984-09-06 1986-04-03 Kobe Steel Ltd Copper alloy for flexible print
JPS61259555A (en) * 1985-05-14 1986-11-17 Mitsubishi Metal Corp Cu alloy bonding wire for semiconductor device

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002306981A (en) * 2001-04-17 2002-10-22 Toshiba Mach Co Ltd Grinder
KR100491385B1 (en) * 2001-07-04 2005-05-24 닛꼬 긴조꾸 가꼬 가부시키가이샤 Copper alloy foil for laminated sheet
KR100504518B1 (en) * 2001-07-13 2005-08-03 닛꼬 긴조꾸 가꼬 가부시키가이샤 Copper alloy foil for laminated sheet
KR20030014168A (en) * 2001-08-10 2003-02-15 닛코 킨조쿠 가부시키가이샤 Copper alloy foil for laminated sheet
JP2007125795A (en) * 2005-11-04 2007-05-24 Komatsu Zenoah Co Foliage crushing machine
JP2019029606A (en) * 2017-08-03 2019-02-21 Ｊｘ金属株式会社 Copper foil for flexible printed board, copper-clad laminate arranged by use thereof, flexible printed board, and electronic device
CN108012406A (en) * 2017-12-06 2018-05-08 广州兴森快捷电路科技有限公司 Stretchable FPC plates and preparation method thereof
CN110252972A (en) * 2019-07-06 2019-09-20 湖北精益高精铜板带有限公司 High-strength highly-conductive microalloy copper foil and its processing method
CN110252972B (en) * 2019-07-06 2021-11-30 湖北精益高精铜板带有限公司 High-strength high-conductivity microalloy copper foil and processing method thereof

Also Published As

Publication number Publication date
JP2505480B2 (en) 1996-06-12

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