JPS5972145A - フリップチップボンディング装置及び方法 - Google Patents

フリップチップボンディング装置及び方法

Info

Publication number
JPS5972145A
JPS5972145A JP18211482A JP18211482A JPS5972145A JP S5972145 A JPS5972145 A JP S5972145A JP 18211482 A JP18211482 A JP 18211482A JP 18211482 A JP18211482 A JP 18211482A JP S5972145 A JPS5972145 A JP S5972145A
Authority
JP
Japan
Prior art keywords
chip
substrate
collet
bonding
camera
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18211482A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0212024B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Kazuo Sugiura
一夫 杉浦
Nobuhito Yamazaki
山崎　信人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP18211482A priority Critical patent/JPS5972145A/ja
Publication of JPS5972145A publication Critical patent/JPS5972145A/ja
Publication of JPH0212024B2 publication Critical patent/JPH0212024B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7565—Means for transporting the components to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75753—Means for optical alignment, e.g. sensors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP18211482A 1982-10-19 1982-10-19 フリップチップボンディング装置及び方法 Granted JPS5972145A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18211482A JPS5972145A (ja) 1982-10-19 1982-10-19 フリップチップボンディング装置及び方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18211482A JPS5972145A (ja) 1982-10-19 1982-10-19 フリップチップボンディング装置及び方法

Publications (2)

Publication Number Publication Date
JPS5972145A true JPS5972145A (ja) 1984-04-24
JPH0212024B2 JPH0212024B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1990-03-16

Family

ID=16112573

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18211482A Granted JPS5972145A (ja) 1982-10-19 1982-10-19 フリップチップボンディング装置及び方法

Country Status (1)

Country Link
JP (1) JPS5972145A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6169139A (ja) * 1984-09-13 1986-04-09 Toshiba Seiki Kk ペレツトボンデイング装置における認識装置
JPS61289638A (ja) * 1985-06-18 1986-12-19 Matsushita Electric Ind Co Ltd ボンデイング装置
JPS6224635A (ja) * 1985-07-24 1987-02-02 Matsushita Electric Ind Co Ltd フリツプチツプボンダ−
JPH0393244A (ja) * 1989-09-06 1991-04-18 Shinkawa Ltd ボンディング装置
EP0890989A4 (en) * 1997-01-24 2006-11-02 Rohm Co Ltd SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE DEVICE

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS574131A (en) * 1980-06-10 1982-01-09 Nippon Abionikusu Kk Device for mounting of semiconductor chips
JPS5715434A (en) * 1980-06-30 1982-01-26 Mitsubishi Electric Corp Bonding apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS574131A (en) * 1980-06-10 1982-01-09 Nippon Abionikusu Kk Device for mounting of semiconductor chips
JPS5715434A (en) * 1980-06-30 1982-01-26 Mitsubishi Electric Corp Bonding apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6169139A (ja) * 1984-09-13 1986-04-09 Toshiba Seiki Kk ペレツトボンデイング装置における認識装置
JPS61289638A (ja) * 1985-06-18 1986-12-19 Matsushita Electric Ind Co Ltd ボンデイング装置
JPS6224635A (ja) * 1985-07-24 1987-02-02 Matsushita Electric Ind Co Ltd フリツプチツプボンダ−
JPH0393244A (ja) * 1989-09-06 1991-04-18 Shinkawa Ltd ボンディング装置
EP0890989A4 (en) * 1997-01-24 2006-11-02 Rohm Co Ltd SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE DEVICE

Also Published As

Publication number Publication date
JPH0212024B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1990-03-16

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