JPS6257098B2 - - Google Patents
Info
- Publication number
- JPS6257098B2 JPS6257098B2 JP7721780A JP7721780A JPS6257098B2 JP S6257098 B2 JPS6257098 B2 JP S6257098B2 JP 7721780 A JP7721780 A JP 7721780A JP 7721780 A JP7721780 A JP 7721780A JP S6257098 B2 JPS6257098 B2 JP S6257098B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- semiconductor chip
- camera
- positioning device
- tray
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7721780A JPS574131A (en) | 1980-06-10 | 1980-06-10 | Device for mounting of semiconductor chips |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7721780A JPS574131A (en) | 1980-06-10 | 1980-06-10 | Device for mounting of semiconductor chips |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS574131A JPS574131A (en) | 1982-01-09 |
| JPS6257098B2 true JPS6257098B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-11-30 |
Family
ID=13627670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7721780A Granted JPS574131A (en) | 1980-06-10 | 1980-06-10 | Device for mounting of semiconductor chips |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS574131A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5972145A (ja) * | 1982-10-19 | 1984-04-24 | Shinkawa Ltd | フリップチップボンディング装置及び方法 |
| JPS59117225A (ja) * | 1982-12-24 | 1984-07-06 | Hitachi Tokyo Electronics Co Ltd | フエイスダウンボンダ |
| JPS601900A (ja) * | 1983-06-17 | 1985-01-08 | 松下電器産業株式会社 | 認識付電子部品実装装置 |
-
1980
- 1980-06-10 JP JP7721780A patent/JPS574131A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS574131A (en) | 1982-01-09 |