JPS5971333A - 樹脂含浸紙積層板 - Google Patents

樹脂含浸紙積層板

Info

Publication number
JPS5971333A
JPS5971333A JP18035982A JP18035982A JPS5971333A JP S5971333 A JPS5971333 A JP S5971333A JP 18035982 A JP18035982 A JP 18035982A JP 18035982 A JP18035982 A JP 18035982A JP S5971333 A JPS5971333 A JP S5971333A
Authority
JP
Japan
Prior art keywords
weight
laminate
paper
aluminum hydroxide
pulp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18035982A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6221814B2 (enrdf_load_stackoverflow
Inventor
Shunsaku Mino
三野　俊作
Saisei Miyao
宮尾　再青
Tomoyuki Goto
後藤　知行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nittetsu Mining Co Ltd
Toyo Pulp Co Ltd
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Nittetsu Mining Co Ltd
Toyo Pulp Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK, Nittetsu Mining Co Ltd, Toyo Pulp Co Ltd filed Critical Showa Denko KK
Priority to JP18035982A priority Critical patent/JPS5971333A/ja
Publication of JPS5971333A publication Critical patent/JPS5971333A/ja
Publication of JPS6221814B2 publication Critical patent/JPS6221814B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Laminated Bodies (AREA)
  • Insulating Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
JP18035982A 1982-10-14 1982-10-14 樹脂含浸紙積層板 Granted JPS5971333A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18035982A JPS5971333A (ja) 1982-10-14 1982-10-14 樹脂含浸紙積層板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18035982A JPS5971333A (ja) 1982-10-14 1982-10-14 樹脂含浸紙積層板

Publications (2)

Publication Number Publication Date
JPS5971333A true JPS5971333A (ja) 1984-04-23
JPS6221814B2 JPS6221814B2 (enrdf_load_stackoverflow) 1987-05-14

Family

ID=16081861

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18035982A Granted JPS5971333A (ja) 1982-10-14 1982-10-14 樹脂含浸紙積層板

Country Status (1)

Country Link
JP (1) JPS5971333A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5302441A (en) * 1991-11-15 1994-04-12 The Mead Corporation Postformable decorative laminating paper
KR20030024350A (ko) * 2001-09-18 2003-03-26 (주)신광보드텍 난연성 표면 가공된 불연성 판재 및 이의 제조 방법
JP2009221271A (ja) * 2008-03-14 2009-10-01 Du Pont Toray Co Ltd 繊維及び微粒子からなる組成物、樹脂組成物及び成形品

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5302441A (en) * 1991-11-15 1994-04-12 The Mead Corporation Postformable decorative laminating paper
KR20030024350A (ko) * 2001-09-18 2003-03-26 (주)신광보드텍 난연성 표면 가공된 불연성 판재 및 이의 제조 방법
JP2009221271A (ja) * 2008-03-14 2009-10-01 Du Pont Toray Co Ltd 繊維及び微粒子からなる組成物、樹脂組成物及び成形品

Also Published As

Publication number Publication date
JPS6221814B2 (enrdf_load_stackoverflow) 1987-05-14

Similar Documents

Publication Publication Date Title
JP3119577B2 (ja) 積層板
JPS5971333A (ja) 樹脂含浸紙積層板
JPH0127100B2 (enrdf_load_stackoverflow)
JPS6011742B2 (ja) 樹脂積層板の製造法
JPS636577B2 (enrdf_load_stackoverflow)
KR880001906B1 (ko) 난연성 페놀수지 적층판의 제법
JP2002309257A (ja) 表面架橋型ポリリン酸メラミン難燃剤
JPS60248740A (ja) 積層板の製造法
JP3211382B2 (ja) プリプレグの製造方法および電気用積層板
JP3179145B2 (ja) フェノール樹脂組成物
JPS59166533A (ja) 寸法安定性の良好な熱硬化性樹脂積層板
JPH06287329A (ja) プリプレグの製造方法及びこのプリプレグを用いた電気用積層板の製造方法
JPH07310300A (ja) 難燃性積層板用原紙及び難燃性積層板
JPH05339468A (ja) フェノール樹脂組成物
JPS58224742A (ja) 積層板の製造方法
JP2009073997A (ja) エポキシ樹脂組成物、そのエポキシ樹脂組成物を用いたプリプレグ及び金属張積層板
JPS58224747A (ja) 積層板の製造方法
JPH0381141A (ja) 金属箔張り積層板の製造法
JPS58224743A (ja) 積層板の製造方法
JPH0438770B2 (enrdf_load_stackoverflow)
JPS63186745A (ja) 難燃性フエノ−ル樹脂積層板
JPH06220225A (ja) プリプレグの製造方法および電気用積層板
JPH11286861A (ja) 電気絶縁性不織布用バインダーおよび電気絶縁性不織布
JPS63230743A (ja) 紙基材フエノ−ル樹脂積層板の製造方法
JP2003064158A (ja) ガラス繊維基材含浸用エポキシ樹脂組成物ならびにそれを用いたプリプレグ、積層板及びプリント配線板