JPS5958848A - セラミツク配線基板の製造方法 - Google Patents

セラミツク配線基板の製造方法

Info

Publication number
JPS5958848A
JPS5958848A JP57168402A JP16840282A JPS5958848A JP S5958848 A JPS5958848 A JP S5958848A JP 57168402 A JP57168402 A JP 57168402A JP 16840282 A JP16840282 A JP 16840282A JP S5958848 A JPS5958848 A JP S5958848A
Authority
JP
Japan
Prior art keywords
gold
wiring board
electrodes
ceramic wiring
base metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57168402A
Other languages
English (en)
Japanese (ja)
Other versions
JPS641057B2 (enExample
Inventor
Mitsuru Nitta
満 新田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP57168402A priority Critical patent/JPS5958848A/ja
Publication of JPS5958848A publication Critical patent/JPS5958848A/ja
Publication of JPS641057B2 publication Critical patent/JPS641057B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/611—
    • H10W70/685—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions
    • H10W72/5449—
    • H10W72/5522—
    • H10W90/754—

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP57168402A 1982-09-29 1982-09-29 セラミツク配線基板の製造方法 Granted JPS5958848A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57168402A JPS5958848A (ja) 1982-09-29 1982-09-29 セラミツク配線基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57168402A JPS5958848A (ja) 1982-09-29 1982-09-29 セラミツク配線基板の製造方法

Publications (2)

Publication Number Publication Date
JPS5958848A true JPS5958848A (ja) 1984-04-04
JPS641057B2 JPS641057B2 (enExample) 1989-01-10

Family

ID=15867450

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57168402A Granted JPS5958848A (ja) 1982-09-29 1982-09-29 セラミツク配線基板の製造方法

Country Status (1)

Country Link
JP (1) JPS5958848A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6020048A (en) * 1996-10-02 2000-02-01 Denso Corporation Thick film circuit board and method of forming wire bonding electrode thereon

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4940867A (enExample) * 1972-08-25 1974-04-17
JPS56114361A (en) * 1980-02-13 1981-09-08 Mitsubishi Electric Corp Semiconductor container
JPS57130443A (en) * 1981-02-06 1982-08-12 Nec Corp Substrate for hybrid integrated circuit

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4940867A (enExample) * 1972-08-25 1974-04-17
JPS56114361A (en) * 1980-02-13 1981-09-08 Mitsubishi Electric Corp Semiconductor container
JPS57130443A (en) * 1981-02-06 1982-08-12 Nec Corp Substrate for hybrid integrated circuit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6020048A (en) * 1996-10-02 2000-02-01 Denso Corporation Thick film circuit board and method of forming wire bonding electrode thereon
DE19743737B4 (de) * 1996-10-02 2009-07-30 Denso Corporation, Kariya Verfahren zur Bildung einer Drahtbondelektrode auf einer Dickschichtleiterplatte

Also Published As

Publication number Publication date
JPS641057B2 (enExample) 1989-01-10

Similar Documents

Publication Publication Date Title
US5383093A (en) Hybrid integrated circuit apparatus
US5119272A (en) Circuit board and method of producing circuit board
JPS5958848A (ja) セラミツク配線基板の製造方法
JPH0210571B2 (enExample)
JPS6041236A (ja) 電子部品の接続方法
JPH0558678B2 (enExample)
JP3895020B2 (ja) 導電性バンプの形成方法
JPH0774445A (ja) 厚膜導体およびその製造方法
JPH0636601Y2 (ja) 回路基板
JPH03116797A (ja) 厚膜表面実装回路
JPH0653625A (ja) セラミック回路基板
JPH06244307A (ja) 低温焼成多層セラミック回路基板の製造方法
JPS6019680B2 (ja) 絶縁板に半田付けする方法
JP2002344137A (ja) 厚膜多層基板およびその製造方法
JPH0298187A (ja) 厚膜集積回路およびその製造方法
JPH0459778B2 (enExample)
KR19990003021A (ko) 파워 모듈용 기판
JPS62216348A (ja) 半導体素子用パツケ−ジ及びその製造法
JPH0344945A (ja) 半導体装置の実装体およびその実装方法
JPS6235553A (ja) 半導体搭載装置の製造方法
JPH03116846A (ja) 混成集積回路及びその製造方法
JPH04334083A (ja) 厚膜回路基板およびその製造方法
JPH0430199B2 (enExample)
JPH04364798A (ja) プリント配線板
JPS61147597A (ja) セラミック回路基板の製造方法