JPS5953526A - エポキシ樹脂用潜在性硬化剤 - Google Patents
エポキシ樹脂用潜在性硬化剤Info
- Publication number
- JPS5953526A JPS5953526A JP16455782A JP16455782A JPS5953526A JP S5953526 A JPS5953526 A JP S5953526A JP 16455782 A JP16455782 A JP 16455782A JP 16455782 A JP16455782 A JP 16455782A JP S5953526 A JPS5953526 A JP S5953526A
- Authority
- JP
- Japan
- Prior art keywords
- component
- phenol
- epoxy
- curing agent
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003795 chemical substances by application Substances 0.000 title claims abstract description 23
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 12
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 12
- 239000004593 Epoxy Substances 0.000 claims abstract description 18
- 150000001875 compounds Chemical class 0.000 claims abstract description 14
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 12
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 7
- 125000001302 tertiary amino group Chemical group 0.000 claims abstract description 5
- 239000000203 mixture Substances 0.000 claims description 7
- -1 phenol compound Chemical class 0.000 claims description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract description 15
- 238000003860 storage Methods 0.000 abstract description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract description 2
- 238000007259 addition reaction Methods 0.000 abstract 2
- 239000007795 chemical reaction product Substances 0.000 abstract 1
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 12
- 239000000047 product Substances 0.000 description 10
- 238000007792 addition Methods 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000003786 synthesis reaction Methods 0.000 description 7
- 229930185605 Bisphenol Natural products 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 150000003512 tertiary amines Chemical class 0.000 description 3
- BFSVOASYOCHEOV-UHFFFAOYSA-N 2-diethylaminoethanol Chemical compound CCN(CC)CCO BFSVOASYOCHEOV-UHFFFAOYSA-N 0.000 description 2
- CWLKGDAVCFYWJK-UHFFFAOYSA-N 3-aminophenol Chemical compound NC1=CC=CC(O)=C1 CWLKGDAVCFYWJK-UHFFFAOYSA-N 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 229940079877 pyrogallol Drugs 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- IMJCKVKBXYZZGJ-UHFFFAOYSA-N 1-(dimethylamino)-3-phenoxypropan-2-ol Chemical compound CN(C)CC(O)COC1=CC=CC=C1 IMJCKVKBXYZZGJ-UHFFFAOYSA-N 0.000 description 1
- NCXUNZWLEYGQAH-UHFFFAOYSA-N 1-(dimethylamino)propan-2-ol Chemical compound CC(O)CN(C)C NCXUNZWLEYGQAH-UHFFFAOYSA-N 0.000 description 1
- FUIQBJHUESBZNU-UHFFFAOYSA-N 2-[(dimethylazaniumyl)methyl]phenolate Chemical compound CN(C)CC1=CC=CC=C1O FUIQBJHUESBZNU-UHFFFAOYSA-N 0.000 description 1
- 229940013085 2-diethylaminoethanol Drugs 0.000 description 1
- 229940018563 3-aminophenol Drugs 0.000 description 1
- SSZWWUDQMAHNAQ-UHFFFAOYSA-N 3-chloropropane-1,2-diol Chemical compound OCC(O)CCl SSZWWUDQMAHNAQ-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- NFVPEIKDMMISQO-UHFFFAOYSA-N 4-[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC=C(O)C=C1 NFVPEIKDMMISQO-UHFFFAOYSA-N 0.000 description 1
- 241000239290 Araneae Species 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 241001235128 Doto Species 0.000 description 1
- 229910000760 Hardened steel Inorganic materials 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- 241000282376 Panthera tigris Species 0.000 description 1
- 240000002834 Paulownia tomentosa Species 0.000 description 1
- 241001474791 Proboscis Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 230000003373 anti-fouling effect Effects 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 230000036760 body temperature Effects 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 230000000366 juvenile effect Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical class NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 125000005498 phthalate group Chemical class 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 210000001187 pylorus Anatomy 0.000 description 1
- 150000003856 quaternary ammonium compounds Chemical class 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000021 stimulant Substances 0.000 description 1
- 239000011232 storage material Substances 0.000 description 1
- 150000003504 terephthalic acids Chemical class 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 238000002076 thermal analysis method Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16455782A JPS5953526A (ja) | 1982-09-21 | 1982-09-21 | エポキシ樹脂用潜在性硬化剤 |
| DE3382819T DE3382819T2 (de) | 1982-09-21 | 1983-09-15 | Latente Härter für Epoxyharze |
| DE3382736T DE3382736T2 (de) | 1982-09-21 | 1983-09-15 | Latente Härter für Epoxyharze. |
| EP83305398A EP0104837B1 (en) | 1982-09-21 | 1983-09-15 | Latent curing agents for epoxy resins |
| EP93109367A EP0569044B1 (en) | 1982-09-21 | 1983-09-15 | Latent curing agents for epoxy resins |
| US06/532,901 US4542202A (en) | 1982-09-21 | 1983-09-16 | Latent curing agents for epoxy resins |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16455782A JPS5953526A (ja) | 1982-09-21 | 1982-09-21 | エポキシ樹脂用潜在性硬化剤 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5953526A true JPS5953526A (ja) | 1984-03-28 |
| JPH0160164B2 JPH0160164B2 (en, 2012) | 1989-12-21 |
Family
ID=15795422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16455782A Granted JPS5953526A (ja) | 1982-09-21 | 1982-09-21 | エポキシ樹脂用潜在性硬化剤 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5953526A (en, 2012) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0197458A2 (en) | 1985-04-01 | 1986-10-15 | Asahi Denka Kogyo Kabushiki Kaisha | Curable epoxy resin composition |
| JPS63183920A (ja) * | 1987-01-27 | 1988-07-29 | Somar Corp | 液状エポキシ樹脂組成物およびその製造方法 |
| JPS6436672A (en) * | 1987-07-31 | 1989-02-07 | Somar Corp | Epoxy polymer composition for bonding chip part |
| US6451931B1 (en) | 2000-12-29 | 2002-09-17 | Asahi Denki Kogyo Kabushiki Kaisha | Reaction product of primary and tertiary amine-containing compound, dihydrazide an polyisocyanate |
| US7226976B2 (en) | 2001-05-16 | 2007-06-05 | Ajinomoto Co., Inc. | Latent curing agent for epoxy resin, and curable epoxy resin composition |
| JP2007297493A (ja) * | 2006-04-28 | 2007-11-15 | Adeka Corp | エポキシ樹脂用硬化剤組成物およびそれを含有してなる硬化性エポキシ樹脂組成物 |
| US8288447B2 (en) | 2006-06-07 | 2012-10-16 | Henkel Ag & Co. Kgaa | Foamable compositions based on epoxy resins and polyesters |
| WO2020110493A1 (ja) | 2018-11-27 | 2020-06-04 | 住友化学株式会社 | エポキシ樹脂組成物及びその硬化物 |
| WO2021201060A1 (ja) | 2020-03-31 | 2021-10-07 | ナミックス株式会社 | エポキシアミンアダクト、硬化触媒、樹脂組成物、封止材、接着剤、及び硬化物 |
| WO2021199450A1 (ja) | 2020-03-31 | 2021-10-07 | ナミックス株式会社 | 硬化触媒、樹脂組成物、封止材、接着剤、及び硬化物 |
| WO2021241286A1 (ja) | 2020-05-27 | 2021-12-02 | 住友化学株式会社 | エポキシ樹脂組成物及びその硬化物 |
| WO2022239797A1 (ja) | 2021-05-14 | 2022-11-17 | 住友化学株式会社 | エポキシ樹脂組成物及びその硬化物 |
-
1982
- 1982-09-21 JP JP16455782A patent/JPS5953526A/ja active Granted
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0197458A2 (en) | 1985-04-01 | 1986-10-15 | Asahi Denka Kogyo Kabushiki Kaisha | Curable epoxy resin composition |
| JPS63183920A (ja) * | 1987-01-27 | 1988-07-29 | Somar Corp | 液状エポキシ樹脂組成物およびその製造方法 |
| JPS6436672A (en) * | 1987-07-31 | 1989-02-07 | Somar Corp | Epoxy polymer composition for bonding chip part |
| US6451931B1 (en) | 2000-12-29 | 2002-09-17 | Asahi Denki Kogyo Kabushiki Kaisha | Reaction product of primary and tertiary amine-containing compound, dihydrazide an polyisocyanate |
| US7226976B2 (en) | 2001-05-16 | 2007-06-05 | Ajinomoto Co., Inc. | Latent curing agent for epoxy resin, and curable epoxy resin composition |
| JP2007297493A (ja) * | 2006-04-28 | 2007-11-15 | Adeka Corp | エポキシ樹脂用硬化剤組成物およびそれを含有してなる硬化性エポキシ樹脂組成物 |
| US8288447B2 (en) | 2006-06-07 | 2012-10-16 | Henkel Ag & Co. Kgaa | Foamable compositions based on epoxy resins and polyesters |
| WO2020110493A1 (ja) | 2018-11-27 | 2020-06-04 | 住友化学株式会社 | エポキシ樹脂組成物及びその硬化物 |
| WO2021201060A1 (ja) | 2020-03-31 | 2021-10-07 | ナミックス株式会社 | エポキシアミンアダクト、硬化触媒、樹脂組成物、封止材、接着剤、及び硬化物 |
| WO2021199450A1 (ja) | 2020-03-31 | 2021-10-07 | ナミックス株式会社 | 硬化触媒、樹脂組成物、封止材、接着剤、及び硬化物 |
| US12384874B2 (en) | 2020-03-31 | 2025-08-12 | Namics Corporation | Curing catalyst, resin composition, sealing material, adhesive and cured product |
| WO2021241286A1 (ja) | 2020-05-27 | 2021-12-02 | 住友化学株式会社 | エポキシ樹脂組成物及びその硬化物 |
| WO2022239797A1 (ja) | 2021-05-14 | 2022-11-17 | 住友化学株式会社 | エポキシ樹脂組成物及びその硬化物 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0160164B2 (en, 2012) | 1989-12-21 |
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