JPS5950534A - 半導体の樹脂封止方法 - Google Patents

半導体の樹脂封止方法

Info

Publication number
JPS5950534A
JPS5950534A JP16097382A JP16097382A JPS5950534A JP S5950534 A JPS5950534 A JP S5950534A JP 16097382 A JP16097382 A JP 16097382A JP 16097382 A JP16097382 A JP 16097382A JP S5950534 A JPS5950534 A JP S5950534A
Authority
JP
Japan
Prior art keywords
resin
thickness
mold
semiconductor
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16097382A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6258655B2 (enrdf_load_stackoverflow
Inventor
Shozo Nakamura
省三 中村
Susumu Tsujiku
都竹　進
Masao Goto
後藤　昌生
Ataru Yokono
中 横野
Hajime Murakami
元 村上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP16097382A priority Critical patent/JPS5950534A/ja
Publication of JPS5950534A publication Critical patent/JPS5950534A/ja
Publication of JPS6258655B2 publication Critical patent/JPS6258655B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/0055—Moulds or cores; Details thereof or accessories therefor with incorporated overflow cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP16097382A 1982-09-17 1982-09-17 半導体の樹脂封止方法 Granted JPS5950534A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16097382A JPS5950534A (ja) 1982-09-17 1982-09-17 半導体の樹脂封止方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16097382A JPS5950534A (ja) 1982-09-17 1982-09-17 半導体の樹脂封止方法

Publications (2)

Publication Number Publication Date
JPS5950534A true JPS5950534A (ja) 1984-03-23
JPS6258655B2 JPS6258655B2 (enrdf_load_stackoverflow) 1987-12-07

Family

ID=15726152

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16097382A Granted JPS5950534A (ja) 1982-09-17 1982-09-17 半導体の樹脂封止方法

Country Status (1)

Country Link
JP (1) JPS5950534A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0635347A1 (en) * 1993-07-21 1995-01-25 Ciba-Geigy Ag Lens mold
WO2008102674A1 (ja) * 2007-02-22 2008-08-28 Sanden Corporation インバータ一体型電動圧縮機
WO2008102676A1 (ja) * 2007-02-22 2008-08-28 Sanden Corporation インバータ一体型電動圧縮機
WO2008102675A1 (ja) * 2007-02-22 2008-08-28 Sanden Corporation インバータ一体型電動圧縮機
CN104425391A (zh) * 2013-09-06 2015-03-18 富士电机株式会社 半导体装置及其制造方法

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0635347A1 (en) * 1993-07-21 1995-01-25 Ciba-Geigy Ag Lens mold
WO2008102674A1 (ja) * 2007-02-22 2008-08-28 Sanden Corporation インバータ一体型電動圧縮機
WO2008102676A1 (ja) * 2007-02-22 2008-08-28 Sanden Corporation インバータ一体型電動圧縮機
WO2008102675A1 (ja) * 2007-02-22 2008-08-28 Sanden Corporation インバータ一体型電動圧縮機
JP2008202565A (ja) * 2007-02-22 2008-09-04 Sanden Corp インバータ一体型電動圧縮機
JP2008202566A (ja) * 2007-02-22 2008-09-04 Sanden Corp インバータ一体型電動圧縮機
JP2008202564A (ja) * 2007-02-22 2008-09-04 Sanden Corp インバータ一体型電動圧縮機
CN101622449B (zh) 2007-02-22 2012-03-07 三电有限公司 逆变器一体型的电动压缩机
CN101617121B (zh) 2007-02-22 2012-05-23 三电有限公司 逆变器一体型的电动压缩机
US8398377B2 (en) 2007-02-22 2013-03-19 Sanden Corporation Electric compressor with integral inverter
DE112008000495B4 (de) * 2007-02-22 2016-10-20 Sanden Corp. Elektrischer Kompressor mit Integralinverter
CN104425391A (zh) * 2013-09-06 2015-03-18 富士电机株式会社 半导体装置及其制造方法

Also Published As

Publication number Publication date
JPS6258655B2 (enrdf_load_stackoverflow) 1987-12-07

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