JPS593960A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS593960A
JPS593960A JP57112052A JP11205282A JPS593960A JP S593960 A JPS593960 A JP S593960A JP 57112052 A JP57112052 A JP 57112052A JP 11205282 A JP11205282 A JP 11205282A JP S593960 A JPS593960 A JP S593960A
Authority
JP
Japan
Prior art keywords
leads
semiconductor element
semiconductor device
semiconductor
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57112052A
Other languages
English (en)
Japanese (ja)
Other versions
JPS634951B2 (enFirst
Inventor
Kiyoshi Usui
臼井　清
Hiroshi Yamamoto
浩 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP57112052A priority Critical patent/JPS593960A/ja
Publication of JPS593960A publication Critical patent/JPS593960A/ja
Publication of JPS634951B2 publication Critical patent/JPS634951B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP57112052A 1982-06-29 1982-06-29 半導体装置 Granted JPS593960A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57112052A JPS593960A (ja) 1982-06-29 1982-06-29 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57112052A JPS593960A (ja) 1982-06-29 1982-06-29 半導体装置

Publications (2)

Publication Number Publication Date
JPS593960A true JPS593960A (ja) 1984-01-10
JPS634951B2 JPS634951B2 (enFirst) 1988-02-01

Family

ID=14576816

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57112052A Granted JPS593960A (ja) 1982-06-29 1982-06-29 半導体装置

Country Status (1)

Country Link
JP (1) JPS593960A (enFirst)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59171152A (ja) * 1983-03-17 1984-09-27 Nec Corp 半導体装置
JPS61148854A (ja) * 1984-12-24 1986-07-07 Hitachi Ltd リ−ドフレ−ム

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5394875A (en) * 1977-01-31 1978-08-19 Nec Corp Package for semiconductor element
JPS5429973A (en) * 1977-08-10 1979-03-06 Hitachi Ltd Lead frame for semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5394875A (en) * 1977-01-31 1978-08-19 Nec Corp Package for semiconductor element
JPS5429973A (en) * 1977-08-10 1979-03-06 Hitachi Ltd Lead frame for semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59171152A (ja) * 1983-03-17 1984-09-27 Nec Corp 半導体装置
JPS61148854A (ja) * 1984-12-24 1986-07-07 Hitachi Ltd リ−ドフレ−ム

Also Published As

Publication number Publication date
JPS634951B2 (enFirst) 1988-02-01

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