JPS5932191A - プリント配線基板とその製造方法 - Google Patents
プリント配線基板とその製造方法Info
- Publication number
- JPS5932191A JPS5932191A JP14280082A JP14280082A JPS5932191A JP S5932191 A JPS5932191 A JP S5932191A JP 14280082 A JP14280082 A JP 14280082A JP 14280082 A JP14280082 A JP 14280082A JP S5932191 A JPS5932191 A JP S5932191A
- Authority
- JP
- Japan
- Prior art keywords
- board
- printed wiring
- hole
- wiring board
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 238000007747 plating Methods 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 description 8
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- -1 3...'tIT Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 235000011962 puddings Nutrition 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14280082A JPS5932191A (ja) | 1982-08-18 | 1982-08-18 | プリント配線基板とその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14280082A JPS5932191A (ja) | 1982-08-18 | 1982-08-18 | プリント配線基板とその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5932191A true JPS5932191A (ja) | 1984-02-21 |
| JPH0155591B2 JPH0155591B2 (enrdf_load_stackoverflow) | 1989-11-27 |
Family
ID=15323919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14280082A Granted JPS5932191A (ja) | 1982-08-18 | 1982-08-18 | プリント配線基板とその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5932191A (enrdf_load_stackoverflow) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60160564U (ja) * | 1984-03-31 | 1985-10-25 | イビデン株式会社 | プラグインパツケ−ジ基板 |
| JPS60190053U (ja) * | 1984-05-28 | 1985-12-16 | 新日本無線株式会社 | 混成集積回路装置 |
| JPS63111691A (ja) * | 1986-10-30 | 1988-05-16 | オ−ケ−プリント配線株式会社 | 電子部品取付板 |
| JPS6424489A (en) * | 1987-07-21 | 1989-01-26 | Mitsubishi Gas Chemical Co | Multilayered board for mounting ic chip |
| JPH03152986A (ja) * | 1989-11-09 | 1991-06-28 | Ibiden Co Ltd | 電子部品搭載用基板 |
| US5124884A (en) * | 1989-11-09 | 1992-06-23 | Ibiden Co., Ltd. | Electronic part mounting board and method of manufacturing the same |
| JP2017059812A (ja) * | 2015-09-16 | 2017-03-23 | 旭徳科技股▲ふん▼有限公司 | パッケージキャリアおよびその製造方法 |
| CN107105570A (zh) * | 2016-02-22 | 2017-08-29 | 太阳诱电株式会社 | 电路板及其制造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5688398A (en) * | 1979-12-20 | 1981-07-17 | Sony Corp | Method of manufacturing hybrid integrated circuit |
-
1982
- 1982-08-18 JP JP14280082A patent/JPS5932191A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5688398A (en) * | 1979-12-20 | 1981-07-17 | Sony Corp | Method of manufacturing hybrid integrated circuit |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60160564U (ja) * | 1984-03-31 | 1985-10-25 | イビデン株式会社 | プラグインパツケ−ジ基板 |
| JPS60190053U (ja) * | 1984-05-28 | 1985-12-16 | 新日本無線株式会社 | 混成集積回路装置 |
| JPS63111691A (ja) * | 1986-10-30 | 1988-05-16 | オ−ケ−プリント配線株式会社 | 電子部品取付板 |
| JPS6424489A (en) * | 1987-07-21 | 1989-01-26 | Mitsubishi Gas Chemical Co | Multilayered board for mounting ic chip |
| JPH03152986A (ja) * | 1989-11-09 | 1991-06-28 | Ibiden Co Ltd | 電子部品搭載用基板 |
| US5124884A (en) * | 1989-11-09 | 1992-06-23 | Ibiden Co., Ltd. | Electronic part mounting board and method of manufacturing the same |
| JP2017059812A (ja) * | 2015-09-16 | 2017-03-23 | 旭徳科技股▲ふん▼有限公司 | パッケージキャリアおよびその製造方法 |
| CN107105570A (zh) * | 2016-02-22 | 2017-08-29 | 太阳诱电株式会社 | 电路板及其制造方法 |
| JP2017152692A (ja) * | 2016-02-22 | 2017-08-31 | 太陽誘電株式会社 | 回路基板及びその製造方法 |
| JP2017201732A (ja) * | 2016-02-22 | 2017-11-09 | 太陽誘電株式会社 | 回路基板及びその製造方法 |
| JP2018046297A (ja) * | 2016-02-22 | 2018-03-22 | 太陽誘電株式会社 | 回路基板 |
| CN107105570B (zh) * | 2016-02-22 | 2019-07-23 | 太阳诱电株式会社 | 电路板及其制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0155591B2 (enrdf_load_stackoverflow) | 1989-11-27 |
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