JPS5931223B2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5931223B2
JPS5931223B2 JP47110300A JP11030072A JPS5931223B2 JP S5931223 B2 JPS5931223 B2 JP S5931223B2 JP 47110300 A JP47110300 A JP 47110300A JP 11030072 A JP11030072 A JP 11030072A JP S5931223 B2 JPS5931223 B2 JP S5931223B2
Authority
JP
Japan
Prior art keywords
bonding pad
source
semiconductor substrate
resistance
input
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP47110300A
Other languages
English (en)
Japanese (ja)
Other versions
JPS4968664A (enrdf_load_stackoverflow
Inventor
健明 岡部
鹿之 越智
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP47110300A priority Critical patent/JPS5931223B2/ja
Publication of JPS4968664A publication Critical patent/JPS4968664A/ja
Publication of JPS5931223B2 publication Critical patent/JPS5931223B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
    • H01L2224/10122—Auxiliary members for bump connectors, e.g. spacers being formed on the semiconductor or solid-state body to be connected
    • H01L2224/10125—Reinforcing structures
    • H01L2224/10126—Bump collar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP47110300A 1972-11-06 1972-11-06 半導体装置 Expired JPS5931223B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP47110300A JPS5931223B2 (ja) 1972-11-06 1972-11-06 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47110300A JPS5931223B2 (ja) 1972-11-06 1972-11-06 半導体装置

Publications (2)

Publication Number Publication Date
JPS4968664A JPS4968664A (enrdf_load_stackoverflow) 1974-07-03
JPS5931223B2 true JPS5931223B2 (ja) 1984-07-31

Family

ID=14532190

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47110300A Expired JPS5931223B2 (ja) 1972-11-06 1972-11-06 半導体装置

Country Status (1)

Country Link
JP (1) JPS5931223B2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02111005A (ja) * 1988-10-20 1990-04-24 Matsushita Electric Ind Co Ltd チップ型電子部品

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5529160A (en) * 1978-08-23 1980-03-01 Seiko Epson Corp Semiconductor integrated device
JPS5534471A (en) * 1978-09-04 1980-03-11 Hitachi Ltd Mis-type semiconductor device
JPS60137050A (ja) * 1983-12-26 1985-07-20 Toshiba Corp 半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS538942B2 (enrdf_load_stackoverflow) * 1971-09-08 1978-04-01

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02111005A (ja) * 1988-10-20 1990-04-24 Matsushita Electric Ind Co Ltd チップ型電子部品

Also Published As

Publication number Publication date
JPS4968664A (enrdf_load_stackoverflow) 1974-07-03

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