JPS59232497A - セラミツク回路基板の製造法 - Google Patents

セラミツク回路基板の製造法

Info

Publication number
JPS59232497A
JPS59232497A JP10734683A JP10734683A JPS59232497A JP S59232497 A JPS59232497 A JP S59232497A JP 10734683 A JP10734683 A JP 10734683A JP 10734683 A JP10734683 A JP 10734683A JP S59232497 A JPS59232497 A JP S59232497A
Authority
JP
Japan
Prior art keywords
plate
ceramic green
green sheet
circuit board
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10734683A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6317360B2 (US20030204162A1-20031030-M00001.png
Inventor
正 河野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Priority to JP10734683A priority Critical patent/JPS59232497A/ja
Publication of JPS59232497A publication Critical patent/JPS59232497A/ja
Publication of JPS6317360B2 publication Critical patent/JPS6317360B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
JP10734683A 1983-06-15 1983-06-15 セラミツク回路基板の製造法 Granted JPS59232497A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10734683A JPS59232497A (ja) 1983-06-15 1983-06-15 セラミツク回路基板の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10734683A JPS59232497A (ja) 1983-06-15 1983-06-15 セラミツク回路基板の製造法

Publications (2)

Publication Number Publication Date
JPS59232497A true JPS59232497A (ja) 1984-12-27
JPS6317360B2 JPS6317360B2 (US20030204162A1-20031030-M00001.png) 1988-04-13

Family

ID=14456719

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10734683A Granted JPS59232497A (ja) 1983-06-15 1983-06-15 セラミツク回路基板の製造法

Country Status (1)

Country Link
JP (1) JPS59232497A (US20030204162A1-20031030-M00001.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0276003U (US20030204162A1-20031030-M00001.png) * 1988-11-30 1990-06-11

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0468242U (US20030204162A1-20031030-M00001.png) * 1990-10-25 1992-06-17

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5889974U (ja) * 1981-12-11 1983-06-17 鳴海製陶株式会社 生セラミツクシ−ト保持用カセツト

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5889974U (ja) * 1981-12-11 1983-06-17 鳴海製陶株式会社 生セラミツクシ−ト保持用カセツト

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0276003U (US20030204162A1-20031030-M00001.png) * 1988-11-30 1990-06-11

Also Published As

Publication number Publication date
JPS6317360B2 (US20030204162A1-20031030-M00001.png) 1988-04-13

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