JPS59228743A - Ｉｃカ−ド用ｉｃモジユ−ル - Google Patents

Ｉｃカ−ド用ｉｃモジユ−ル

Info

Publication number
JPS59228743A
JPS59228743A JP58102906A JP10290683A JPS59228743A JP S59228743 A JPS59228743 A JP S59228743A JP 58102906 A JP58102906 A JP 58102906A JP 10290683 A JP10290683 A JP 10290683A JP S59228743 A JPS59228743 A JP S59228743A
Authority
JP
Japan
Prior art keywords
card
module
conductive layer
terminal
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58102906A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0334658B2 (enrdf_load_stackoverflow
Inventor
Yoshihiko Nakahara
中原　義彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyodo Printing Co Ltd
Original Assignee
Kyodo Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyodo Printing Co Ltd filed Critical Kyodo Printing Co Ltd
Priority to JP58102906A priority Critical patent/JPS59228743A/ja
Publication of JPS59228743A publication Critical patent/JPS59228743A/ja
Publication of JPH0334658B2 publication Critical patent/JPH0334658B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Credit Cards Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP58102906A 1983-06-10 1983-06-10 Ｉｃカ−ド用ｉｃモジユ−ル Granted JPS59228743A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58102906A JPS59228743A (ja) 1983-06-10 1983-06-10 Ｉｃカ−ド用ｉｃモジユ−ル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58102906A JPS59228743A (ja) 1983-06-10 1983-06-10 Ｉｃカ−ド用ｉｃモジユ−ル

Publications (2)

Publication Number Publication Date
JPS59228743A true JPS59228743A (ja) 1984-12-22
JPH0334658B2 JPH0334658B2 (enrdf_load_stackoverflow) 1991-05-23

Family

ID=14339902

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58102906A Granted JPS59228743A (ja) 1983-06-10 1983-06-10 Ｉｃカ−ド用ｉｃモジユ−ル

Country Status (1)

Country Link
JP (1) JPS59228743A (enrdf_load_stackoverflow)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6339580U (enrdf_load_stackoverflow) * 1986-09-02 1988-03-14
US4849617A (en) * 1986-03-17 1989-07-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor card which can be folded
US5122860A (en) * 1987-08-26 1992-06-16 Matsushita Electric Industrial Co., Ltd. Integrated circuit device and manufacturing method thereof
DE4126874C1 (enrdf_load_stackoverflow) * 1991-08-14 1992-08-13 Orga Kartensysteme Gmbh, 6072 Dreieich, De
US5278580A (en) * 1991-02-06 1994-01-11 Rohm Co., Ltd. Thermal head
JPH06183189A (ja) * 1992-12-21 1994-07-05 Toppan Printing Co Ltd Ｉｃカード用ｉｃモジュール
US5526233A (en) * 1991-12-19 1996-06-11 Casio Computer Co., Ltd. Adapter for integrated circuit device, and data transmission system using the same
US5544014A (en) * 1992-08-12 1996-08-06 Oki Electric Industry Co., Ltd. IC card having a built-in semiconductor integrated circuit device
US5559370A (en) * 1993-10-08 1996-09-24 Gay Freres Vente Et Exportation S.A. Electronic label and carriers therefor
US5637858A (en) * 1993-12-23 1997-06-10 Giesecke & Devrient Gmbh Method for producing identity cards
JP2003526216A (ja) * 2000-03-10 2003-09-02 シュラムバーガー システムズ 補強された集積回路
US11829826B2 (en) 2016-07-27 2023-11-28 Composecure, Llc RFID device
US12086669B2 (en) 2017-10-18 2024-09-10 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
US12093772B2 (en) 2018-01-30 2024-09-17 Composecure, Llc DI capacitive embedded metal card
US12254367B2 (en) 2017-09-07 2025-03-18 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5660098A (en) * 1979-10-23 1981-05-23 Hokushin Electric Works Method of electrostatically shielding electronic circuit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5660098A (en) * 1979-10-23 1981-05-23 Hokushin Electric Works Method of electrostatically shielding electronic circuit

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4849617A (en) * 1986-03-17 1989-07-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor card which can be folded
JPS6339580U (enrdf_load_stackoverflow) * 1986-09-02 1988-03-14
US5122860A (en) * 1987-08-26 1992-06-16 Matsushita Electric Industrial Co., Ltd. Integrated circuit device and manufacturing method thereof
US5278580A (en) * 1991-02-06 1994-01-11 Rohm Co., Ltd. Thermal head
DE4126874C1 (enrdf_load_stackoverflow) * 1991-08-14 1992-08-13 Orga Kartensysteme Gmbh, 6072 Dreieich, De
US5526233A (en) * 1991-12-19 1996-06-11 Casio Computer Co., Ltd. Adapter for integrated circuit device, and data transmission system using the same
US5544014A (en) * 1992-08-12 1996-08-06 Oki Electric Industry Co., Ltd. IC card having a built-in semiconductor integrated circuit device
JPH06183189A (ja) * 1992-12-21 1994-07-05 Toppan Printing Co Ltd Ｉｃカード用ｉｃモジュール
US5559370A (en) * 1993-10-08 1996-09-24 Gay Freres Vente Et Exportation S.A. Electronic label and carriers therefor
US5637858A (en) * 1993-12-23 1997-06-10 Giesecke & Devrient Gmbh Method for producing identity cards
JP2003526216A (ja) * 2000-03-10 2003-09-02 シュラムバーガー システムズ 補強された集積回路
US11829826B2 (en) 2016-07-27 2023-11-28 Composecure, Llc RFID device
US12079681B2 (en) 2016-07-27 2024-09-03 Composecure, Llc RFID device
US12254367B2 (en) 2017-09-07 2025-03-18 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
US12086669B2 (en) 2017-10-18 2024-09-10 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
US12093772B2 (en) 2018-01-30 2024-09-17 Composecure, Llc DI capacitive embedded metal card

Also Published As

Publication number Publication date
JPH0334658B2 (enrdf_load_stackoverflow) 1991-05-23

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