JPS59227185A - 印刷配線板の製造法 - Google Patents
印刷配線板の製造法Info
- Publication number
- JPS59227185A JPS59227185A JP10127083A JP10127083A JPS59227185A JP S59227185 A JPS59227185 A JP S59227185A JP 10127083 A JP10127083 A JP 10127083A JP 10127083 A JP10127083 A JP 10127083A JP S59227185 A JPS59227185 A JP S59227185A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- copper foil
- pattern
- etching
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 33
- 239000011889 copper foil Substances 0.000 claims description 19
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 14
- 238000005530 etching Methods 0.000 claims description 14
- 238000007747 plating Methods 0.000 claims description 13
- 230000007797 corrosion Effects 0.000 claims description 4
- 238000005260 corrosion Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 240000002834 Paulownia tomentosa Species 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 241000972773 Aulopiformes Species 0.000 description 1
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241000287127 Passeridae Species 0.000 description 1
- 244000082204 Phyllostachys viridis Species 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 210000004907 gland Anatomy 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 235000019515 salmon Nutrition 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10127083A JPS59227185A (ja) | 1983-06-07 | 1983-06-07 | 印刷配線板の製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10127083A JPS59227185A (ja) | 1983-06-07 | 1983-06-07 | 印刷配線板の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59227185A true JPS59227185A (ja) | 1984-12-20 |
| JPS6337515B2 JPS6337515B2 (enrdf_load_stackoverflow) | 1988-07-26 |
Family
ID=14296190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10127083A Granted JPS59227185A (ja) | 1983-06-07 | 1983-06-07 | 印刷配線板の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59227185A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005311202A (ja) * | 2004-04-23 | 2005-11-04 | Matsushita Electric Works Ltd | 配線基板及びその製造方法 |
| US7868464B2 (en) | 2004-09-16 | 2011-01-11 | Tdk Corporation | Multilayer substrate and manufacturing method thereof |
| WO2011078031A1 (ja) * | 2009-12-22 | 2011-06-30 | 株式会社メイコー | プリント基板の製造方法及びプリント基板 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03613A (ja) * | 1989-05-17 | 1991-01-07 | Dainippon Printing Co Ltd | 電子部品搬送体作成装置 |
| JPH0462605U (enrdf_load_stackoverflow) * | 1990-10-09 | 1992-05-28 |
-
1983
- 1983-06-07 JP JP10127083A patent/JPS59227185A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005311202A (ja) * | 2004-04-23 | 2005-11-04 | Matsushita Electric Works Ltd | 配線基板及びその製造方法 |
| US7868464B2 (en) | 2004-09-16 | 2011-01-11 | Tdk Corporation | Multilayer substrate and manufacturing method thereof |
| WO2011078031A1 (ja) * | 2009-12-22 | 2011-06-30 | 株式会社メイコー | プリント基板の製造方法及びプリント基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6337515B2 (enrdf_load_stackoverflow) | 1988-07-26 |
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