JPS6337515B2 - - Google Patents

Info

Publication number

JPS6337515B2

JPS6337515B2 JP10127083A JP10127083A JPS6337515B2 JP S6337515 B2 JPS6337515 B2 JP S6337515B2 JP 10127083 A JP10127083 A JP 10127083A JP 10127083 A JP10127083 A JP 10127083A JP S6337515 B2 JPS6337515 B2 JP S6337515B2

Authority

JP

Japan

Prior art keywords

copper

copper foil

etching

plating

resist

Prior art date

1983-06-07

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
• Discuss

• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 49
• 239000011889 copper foil Substances 0.000 claims description 28
• 238000005530 etching Methods 0.000 claims description 22
• 229910052802 copper Inorganic materials 0.000 claims description 21
• 239000010949 copper Substances 0.000 claims description 21
• 238000007747 plating Methods 0.000 claims description 21
• 238000000034 method Methods 0.000 claims description 14
• 230000007797 corrosion Effects 0.000 claims description 9
• 238000005260 corrosion Methods 0.000 claims description 9
• 239000002184 metal Substances 0.000 claims description 9
• 229910052751 metal Inorganic materials 0.000 claims description 9
• 238000004519 manufacturing process Methods 0.000 claims description 6
• 239000011810 insulating material Substances 0.000 claims description 5
• 239000011888 foil Substances 0.000 claims 1
• 239000000654 additive Substances 0.000 description 4
• 239000004020 conductor Substances 0.000 description 4
• PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
• 229910052737 gold Inorganic materials 0.000 description 4
• 239000010931 gold Substances 0.000 description 4
• 239000010410 layer Substances 0.000 description 4
• 229920002120 photoresistant polymer Polymers 0.000 description 4
• 239000000758 substrate Substances 0.000 description 4
• 229910001220 stainless steel Inorganic materials 0.000 description 3
• 239000010935 stainless steel Substances 0.000 description 3
• PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
• 230000000996 additive effect Effects 0.000 description 2
• 239000000853 adhesive Substances 0.000 description 2
• 230000001070 adhesive effect Effects 0.000 description 2
• BGTFCAQCKWKTRL-YDEUACAXSA-N chembl1095986 Chemical compound C1[C@@H](N)[C@@H](O)[C@H](C)O[C@H]1O[C@@H]([C@H]1C(N[C@H](C2=CC(O)=CC(O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O)=C2C=2C(O)=CC=C(C=2)[C@@H](NC(=O)[C@@H]2NC(=O)[C@@H]3C=4C=C(C(=C(O)C=4)C)OC=4C(O)=CC=C(C=4)[C@@H](N)C(=O)N[C@@H](C(=O)N3)[C@H](O)C=3C=CC(O4)=CC=3)C(=O)N1)C(O)=O)=O)C(C=C1)=CC=C1OC1=C(O[C@@H]3[C@H]([C@H](O)[C@@H](O)[C@H](CO[C@@H]5[C@H]([C@@H](O)[C@H](O)[C@@H](C)O5)O)O3)O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O[C@@H]3[C@H]([C@H](O)[C@@H](CO)O3)O)C4=CC2=C1 BGTFCAQCKWKTRL-YDEUACAXSA-N 0.000 description 2
• 229910000365 copper sulfate Inorganic materials 0.000 description 2
• ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
• 230000007547 defect Effects 0.000 description 2
• 238000005553 drilling Methods 0.000 description 2
• 238000007772 electroless plating Methods 0.000 description 2
• 229910000679 solder Inorganic materials 0.000 description 2
• 238000005476 soldering Methods 0.000 description 2
• 239000002344 surface layer Substances 0.000 description 2
• QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 238000009713 electroplating Methods 0.000 description 1
• 239000003292 glue Substances 0.000 description 1
• 238000007689 inspection Methods 0.000 description 1
• 239000011229 interlayer Substances 0.000 description 1
• 230000001678 irradiating effect Effects 0.000 description 1
• 238000010030 laminating Methods 0.000 description 1
• 238000003475 lamination Methods 0.000 description 1
• 239000000463 material Substances 0.000 description 1
• 239000000203 mixture Substances 0.000 description 1
• 229910052759 nickel Inorganic materials 0.000 description 1
• 238000005498 polishing Methods 0.000 description 1
• 239000002244 precipitate Substances 0.000 description 1

Cited By (2)