JPH0158878B2 - - Google Patents

Info

Publication number
JPH0158878B2
JPH0158878B2 JP59120204A JP12020484A JPH0158878B2 JP H0158878 B2 JPH0158878 B2 JP H0158878B2 JP 59120204 A JP59120204 A JP 59120204A JP 12020484 A JP12020484 A JP 12020484A JP H0158878 B2 JPH0158878 B2 JP H0158878B2
Authority
JP
Japan
Prior art keywords
metal layer
holder
plating
copper
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59120204A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60263495A (ja
Inventor
Yoshiaki Tsubomatsu
Naoki Fukutomi
Yorio Iwasaki
Akinari Kida
Yutaka Kawashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP12020484A priority Critical patent/JPS60263495A/ja
Publication of JPS60263495A publication Critical patent/JPS60263495A/ja
Publication of JPH0158878B2 publication Critical patent/JPH0158878B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
JP12020484A 1984-06-12 1984-06-12 配線板の製造法 Granted JPS60263495A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12020484A JPS60263495A (ja) 1984-06-12 1984-06-12 配線板の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12020484A JPS60263495A (ja) 1984-06-12 1984-06-12 配線板の製造法

Publications (2)

Publication Number Publication Date
JPS60263495A JPS60263495A (ja) 1985-12-26
JPH0158878B2 true JPH0158878B2 (enrdf_load_stackoverflow) 1989-12-13

Family

ID=14780479

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12020484A Granted JPS60263495A (ja) 1984-06-12 1984-06-12 配線板の製造法

Country Status (1)

Country Link
JP (1) JPS60263495A (enrdf_load_stackoverflow)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2984595A (en) * 1956-06-21 1961-05-16 Sel Rex Precious Metals Inc Printed circuit manufacture
JPS5250570A (en) * 1975-10-20 1977-04-22 Seiko Instr & Electronics Method of producing circuit substrate
JPS5296360A (en) * 1976-02-09 1977-08-12 Yamamoto Mfg Embedded printed circuit substrate and method of producing same
JPS5381966A (en) * 1976-12-27 1978-07-19 Hirotoshi Nomura Method of producing electric circuit part

Also Published As

Publication number Publication date
JPS60263495A (ja) 1985-12-26

Similar Documents

Publication Publication Date Title
JPS59215795A (ja) プリント回路製造方法
EP0483979A1 (en) Method for producing printed circuit boards
US7169313B2 (en) Plating method for circuitized substrates
JPH04100294A (ja) プリント配線板の製造方法
KR100343389B1 (ko) 다층 배선기판의 제조방법
JP3402372B2 (ja) 配線板の製造法
JPH035078B2 (enrdf_load_stackoverflow)
JP2004512698A (ja) プリント回路板製造での、酸化プロセスに代わる、微細な線形成のための銅箔への金属処理の使用
JPS6337515B2 (enrdf_load_stackoverflow)
JPH0158878B2 (enrdf_load_stackoverflow)
JPS6182497A (ja) 印刷配線板の製造法
JPH01290289A (ja) 導体パターン形成方法
EP0239197B1 (en) Process for producing a metallic pattern
JP3599957B2 (ja) 多層配線基板の製造方法
JPH1117315A (ja) 可撓性回路基板の製造法
JP4252227B2 (ja) 両面可撓性回路基板の製造法
JPS55111142A (en) Manufacturing method of lead wire for semiconductor device
JPH06252529A (ja) プリント配線板の製造方法
JPS63283098A (ja) パタ−ン形成法
JPS62277789A (ja) 配線板の製造方法
JPH04268783A (ja) 複合回路基板
JPS6356991A (ja) プリント配線板の製造法
JPS5916930B2 (ja) 積層板の製造方法
JPH1117331A (ja) 可撓性回路基板の製造法
GB795822A (en) Improvements in or relating to the production of printed electric circuits