JPS60263495A - 配線板の製造法 - Google Patents

配線板の製造法

Info

Publication number
JPS60263495A
JPS60263495A JP12020484A JP12020484A JPS60263495A JP S60263495 A JPS60263495 A JP S60263495A JP 12020484 A JP12020484 A JP 12020484A JP 12020484 A JP12020484 A JP 12020484A JP S60263495 A JPS60263495 A JP S60263495A
Authority
JP
Japan
Prior art keywords
plating
circuit pattern
resist
copper
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12020484A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0158878B2 (enrdf_load_stackoverflow
Inventor
良明 坪松
直樹 福富
順雄 岩崎
木田 明成
川島 豊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP12020484A priority Critical patent/JPS60263495A/ja
Publication of JPS60263495A publication Critical patent/JPS60263495A/ja
Publication of JPH0158878B2 publication Critical patent/JPH0158878B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
JP12020484A 1984-06-12 1984-06-12 配線板の製造法 Granted JPS60263495A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12020484A JPS60263495A (ja) 1984-06-12 1984-06-12 配線板の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12020484A JPS60263495A (ja) 1984-06-12 1984-06-12 配線板の製造法

Publications (2)

Publication Number Publication Date
JPS60263495A true JPS60263495A (ja) 1985-12-26
JPH0158878B2 JPH0158878B2 (enrdf_load_stackoverflow) 1989-12-13

Family

ID=14780479

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12020484A Granted JPS60263495A (ja) 1984-06-12 1984-06-12 配線板の製造法

Country Status (1)

Country Link
JP (1) JPS60263495A (enrdf_load_stackoverflow)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2984595A (en) * 1956-06-21 1961-05-16 Sel Rex Precious Metals Inc Printed circuit manufacture
JPS5250570A (en) * 1975-10-20 1977-04-22 Seiko Instr & Electronics Method of producing circuit substrate
JPS5296360A (en) * 1976-02-09 1977-08-12 Yamamoto Mfg Embedded printed circuit substrate and method of producing same
JPS5381966A (en) * 1976-12-27 1978-07-19 Hirotoshi Nomura Method of producing electric circuit part

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2984595A (en) * 1956-06-21 1961-05-16 Sel Rex Precious Metals Inc Printed circuit manufacture
JPS5250570A (en) * 1975-10-20 1977-04-22 Seiko Instr & Electronics Method of producing circuit substrate
JPS5296360A (en) * 1976-02-09 1977-08-12 Yamamoto Mfg Embedded printed circuit substrate and method of producing same
JPS5381966A (en) * 1976-12-27 1978-07-19 Hirotoshi Nomura Method of producing electric circuit part

Also Published As

Publication number Publication date
JPH0158878B2 (enrdf_load_stackoverflow) 1989-12-13

Similar Documents

Publication Publication Date Title
US5504992A (en) Fabrication process of wiring board
US6264851B1 (en) Selective seed and plate using permanent resist
JP3402372B2 (ja) 配線板の製造法
JPH035078B2 (enrdf_load_stackoverflow)
CN115802601B (zh) 一种齐平印制电路板及其生产方法
JPS6337515B2 (enrdf_load_stackoverflow)
JPS60263495A (ja) 配線板の製造法
JPS6182497A (ja) 印刷配線板の製造法
JPH01290289A (ja) 導体パターン形成方法
JP2713037B2 (ja) プリント配線板及びその製造方法
JPS6356991A (ja) プリント配線板の製造法
JP4029005B2 (ja) 配線基板の製造方法
JP4252227B2 (ja) 両面可撓性回路基板の製造法
JPH06252529A (ja) プリント配線板の製造方法
JPS63202086A (ja) プリント回路板の製造方法
JPS5916930B2 (ja) 積層板の製造方法
JPS63283098A (ja) パタ−ン形成法
JPS62277789A (ja) 配線板の製造方法
JPS613494A (ja) プリント板製造方法
JPH0738497B2 (ja) プリント配線板の製造方法
JPS62277790A (ja) 配線板の製造方法
JPS59175797A (ja) 多層プリント板の製造方法
JPS5832798B2 (ja) 印刷配線板の製造法
JPS60263496A (ja) 配線板の製造法
JPS59228788A (ja) プリント配線板の製造方法