JPS59227185A - Method of producing printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides a method for easily obtaining a fine pattern by using a mark M that can be moved in and out.
Regarding #heredity of the distribution board/)0 The line width and line spacing of the paulownia wiring board have become narrower and narrower with the increasing integration of LSIs. Therefore, in the conventional manufacturing method, For example, etching a pattern on a copper-clad laminate
00μm is the processing limit, and if the gland width is less than this.

Disconnection or short circuits are more likely to occur.

This is caused by dents and scratches on the copper foil surface that occur during the manufacturing process of copper-clad laminates. 1, width, line spacing is 5
When the thickness becomes about 0 μm, the carpet thickness becomes a problem due to minute irregularities and waviness on the surface of the copper-clad laminate.

In addition, since copper foil is usually thick at 18 to 65 μm, 100 μ-
Etching the bottom will be very difficult. If used for 5-9 μm Q copper foil, etching for inner layer circuits becomes easier.
Since the surface layer S is plated in the through holes, the total copper thickness is 60 to 40 μm, which is 100 μm.
The following etching is a very needy princess. For these reasons, the etching method is difficult to form fine patterns, and the additive method, in which circuits are formed by plating on the necessary areas, is difficult to form a fine pattern, but the roughness of the second surface is large in the case of blocky patterns, and it is difficult to form unnecessary patterns. There is a copper-free phenomenon in which plating precipitates even in areas where there is no material available, and it is not possible to form a finer pattern than the subtract method.Therefore, it is necessary to use a copper-clad laminate using 5-9 μm copper foil Y by plating the base. The semi-additive method of quick etching the wide copper foil on the base is suitable for fine turns (however, even with this method, the above-mentioned copper clad laminate itself Q) is free from defects and ruled by characteristics.

It is difficult to form a fine pattern of 80 μm or less. The present invention was developed in view of these points. Plating, copper machining @electronic process, circuit pattern formation, plating resist removed, glyph-leg coating in the circuit pattern direction, set the blade edge heated and pressurized 1 hole 1
Copper plating of the internal wall must contain at least an electrically conductive surface pattern, and the etching resist corresponding to the surface pattern must be applied to the copper foil after electroforming the steel foil. In other words, the present invention uses copper foil as the base material for forming the circuit pattern, since the copper clad laminate used in the prior art has been used in the past due to its own properties and defects. there was. The copper foil to be used may be plated to make it removable, such as stainless steel, or it may be #I76 that has been peeled off with a knife or rolled. On the 7th floor, photoresist was laminated on one side of the copper foil 1.

A resist pattern is formed by two electrodes by baking, developing, etc. Next, gold is coated with a corrosion-resistant copper etching solution such as sparrow, nickel, or nickel by electroplating or by electroplating.

Copper plating 4'9th now. Resist 2 [Shun peeled off.

Contact treatment of the T444 surface is carried out.

Next, as shown in Fig. 2, the circuit pattern 5 formed in this way is placed on the copper foil 1, coated with 1~, and placed on the inside of the pattern along with the circuit board 6. After that, I used Gripreg 6 and connected it to the turret layer. In addition, I will drill holes and through holes. Next, the Daido pad section, the surface pattern t tenting with copper foil, and the surface pattern t with copper foil.

By setting the stock early, the copper seedlings are busy etching, making sure to leave the necessary front openings such as Nokurad around the large ones.
The copper foil that served as the base has been etched away.
The first formed circuit is embedded in the substrate and exposed in the form of a circuit.

Figure 6 shows the printed wiring board υ~'l
7 is through-hole plated, 8 is the inner layer circuit, 4 is a square/shime type Jllll, and the broken circuit is plated with gold stripes that are corrosion resistant to copper etching solution. t
91 is the copper foil that remained without being etched./80 Example: After polishing the stainless steel (SUS4.5O-BA) surface with Scotchprite 7448, 50 μm thick copper plating was performed in all cases. Next, photoresist (Liston T-
121s) 'c Roll 2 0 positive mask '9c was irradiated with ultraviolet light '9c. A 30 μm bamboo strip was applied to the T/C RR steel plating. After applying a resist stripping solution and stripping the resist, the copper foil treated with black oxide was peeled off from the stainless steel plate. It was set in a multi-layered mold that could be positioned using an inner plate prepared by the method, a gripper leg, and a positioning bottle, and pressurized at 60 kg/an' at 170°C for 2 hours. In this way, the m-layered board was coated with dust that was removed by an NC drill, and through-holes were formed by electroless plating. I laminated it, printed it to form a pad around the area, and then developed it. 71. The desired multi-layer printed scarlet plate is then fabricated by etching the outer surface of the plate until the gold plate is exposed. Next Riteru or achievement.

(υ Since the pattern is formed on the copper w1 piece with no scratches on the surface, in the movie, it is possible to easily handle fine patterns of less than 100 μm each. (2) Since the laminated plate/b is formed with a fine pattern χ in advance, it can be inspected before lamination to reduce the yield or the same as above. This conductor is embedded in grease and has no side etch, so there is no side etch.
A-width, high precision sieve.

(4) As shown in FIG. 4, a circuit consisting of salmon-resistant gold 1j45 and a conductor embedded in copper 4, or as shown in 10, 7C copper foil 1Q; 9-
A good circuit, as shown in Figure 11, is a conductor for both of them.
It is possible to easily manufacture printed wiring boards according to the physical properties of the board.

[Brief explanation of drawings]

Figures 1 to 4 show the method of the present invention.
For one reason. Code clarity 1 Quantity 2 Resist pattern 3 Corrosion resistant metal 4 Copper 5ti21wlI zone 6 Zuri preg 7 Through hole plating 8 Inner layer circuit

Claims (1)

[Claims] 1. Apply a plating resist between pieces of copper foil, apply a copper etching solution to the entire area with corrosion resistance, form a circuit pattern by plating the mausoleum, remove the plating resist, and apply a pregreg to the circuit pattern surface. 18 After heating and pressurizing, assembling the inner wall of the drilled hole and coating it, and etching the copper foil after forming an etching resist that corresponds to the surface pattern of the copper foil that is included at least in the butt part. A method for manufacturing an Indo paulownia wiring board based on the '9C pattern.