JPS62277789A - Manufacture of wiring board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] V. Detailed description of the invention (Industrial application field) The present invention relates to a method of manufacturing a wiring board.

(Prior Art) The line width and line spacing of wiring boards are rapidly becoming finer as industrial LSIs become increasingly integrated. As a method for forming fine patterns to cope with this increase in density, instead of the method of forming circuit patterns by etching unnecessary parts of button-covered laminates or films with copper foil (f-cutting method), A method of forming circuits on the necessary areas by electroless copper plating (additive method), or using a copper-clad laminate using 5-9 μm copper foil or a film with copper foil as a base, plating the necessary areas and then using a thin paste. There is a method (semi-additive method) of quickly etching copper foil.

(Problems to be Solved by the Invention) In the additive method, the roughness of the surface of the insulating base material is currently large (and the roughness of the surface of the insulating base material is large, and the roughness of the surface of the insulating base material is large (and the roughness of the non-copper plating solution is large). There is a δ11 copper hanging phenomenon, which makes it difficult to form finer patterns than the subtract method.Also, even in the semi-additive method, Nj4
Due to dents and scratches in the copper foil that occur during the manufacturing process of stretched laminates and foil-covered films, wire breaks or short circuits are likely to occur. Further, in the method of Example n as well, in the process of etching or plating resist pattern formation, the burn-in caused by defects in the photomask or the contamination of dust during exposure has a serious yp during failure. Moreover, the resist pattern shape every time! I feel safe doing E<.

(Means for Solving the Problems) The present invention is a method for manufacturing a distribution board according to the following steps: (1) forming an insulating resist pattern on a conductive holder surface;

(2) An adhesive film that can be heat-pressed to obtain quadrielectricity only in the thickness direction is heat-pressed onto the entire surface on which the resist pattern is formed.

(3) A four-electrode pattern corresponding to a portion other than the resist pattern is formed on the adhesive film by electroplating.

(4) Fold the insulating base materials together facing the adhesive film and heat-press them to embed the four-layer pattern into the entire insulating base material.

(5) Peeling the insulating base material from the adhesive film surface.

Next, embodiment 9IJ of the present invention will be explained with reference to the drawings.

A stainless steel plate 1't- with a thickness of j m+t+ is prepared. After polishing the surface with sand vapor, photoresist (
Liston T-1206) is laminated using a roll laminator. Next, after applying a photomask and irradiating with ultraviolet rays, a resist pattern 2 is formed in the desired area by development, and then ferric chloride (FeC15) is dissolved at 0°C.
(28-42 Sadaso%) was used to etch the portions other than the resist pattern to form recesses 3, and then the nj resist pattern 2 was peeled off using methylene chloride. The depth of the recess 3 can be adjusted to 30 to 70 μm by 5T. In addition,
When etching at a depth of 50 to 70 μm (1) d,
Because of the influence of side etching, it is better to set the resist line width to be about 108°C wider than the actual resist line width when designing the photomask.

Next, the resin 4 shown in Table 1 was optically filled into the recess 5, and then pressure-bonded at 150 DEG C. and 40 kg/- for 30 minutes, and again polished with a sand vapor. At this time, the light-filled Tsukuda resin 4 may be heat-pressed in the form of a sheet, and may be polyurethane, polyester, silicone, fluorine [(gh), polyethylene, or vinyl chloride resin. The exposed surface 5 of the stainless steel plate 1 is polished so as not to be deeper than the recess 3, and this stainless steel plate t-master substrate 6 is prepared.This master substrate 1 is simply the stainless steel plate 1.
In addition to the desired areas above, for example, a resist pattern with a thickness of 1 to 3 μm is formed using a liquid resist, or a resist pattern is formed using a film resist with a thickness of 18 to 50 μm. Pattern plating with a speed equal to the thickness of the resist may also be used. Next, Anisorum 7 (Anisorum 1)
052 (manufactured by Nikju Kasei Co., Ltd.) for 1 minute at 150°C and 10 kg/CMI, and this 7"L is used as the master board 118.Furthermore, 1.6A/U"'c #L is plated,
A circuit pattern 9 with a conductor thickness of 10 μm was obtained. Next, after forming a copper oxide film 10 on the entire surface of the circuit pattern 9, the adhesive prepreg 11 was applied for 20 minutes at 170° C. and 40 kg/af.
It was crimped. After lamination, the insulating base material 11 was peeled off from the anisotropic thin film 7 to obtain a desired distribution board. This arrangement? f
The M board has a circuit pattern with a line width and line spacing of 80 μm. Also, the master board 16 can be reused 500 times, and the master base number 118 can be reused 100 times.

Further, instead of the stainless steel used for the stainless steel plate 1, other metal plates can be used.

For example, electroplating on a stainless steel machine to a thickness of 50 to 80
With a copper plating layer of about μm, or with a thickness of jm
Aluminum strength of about +n (engineering strength and processing strength is superior) can also be used.

Table 1 (Effects of the Invention) Since the master substrate in the wiring board manufacturing method of the present invention can be made of red, the process can be shortened.

The manufacturing method of the present invention can sufficiently cope with increasing the MJ density of wiring boards.

[Brief explanation of drawings]

Figures 1 (ta) to (f) are cross-sectional views for explaining the present invention. 1... Stainless steel-like, 2... Resist pattern for etching, 3... Etching e (Concave), 4...Concave light filler (Finger, 5...--)
Stainless steel plate surface, 6... Master board 1, 7
...Anisotropic film, 8...Master, lu, 9...i6J pattern, 10.
...Copper coating, 11...Disconnected circuit board.

Claims (1)

[Claims] 1. A method for manufacturing a wiring board comprising the following steps. (A) A first step of forming an insulating resist pattern on the conductive holder surface. (B) A second step of heat-pressing an adhesive film that can obtain conductivity only in the thickness direction by heat-pressing onto the entire surface on which the resist pattern is formed. (C) A third step of forming a conductive pattern on a portion of the adhesive film other than the resist pattern by electroplating. (D) A fourth step of stacking an insulating base material facing the adhesive film and heat-pressing it to embed the conductive pattern in the insulating base material. (E) A fifth step of peeling off the insulating base material from the adhesive film surface.