JPS59224144A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法Info
- Publication number
- JPS59224144A JPS59224144A JP9796583A JP9796583A JPS59224144A JP S59224144 A JPS59224144 A JP S59224144A JP 9796583 A JP9796583 A JP 9796583A JP 9796583 A JP9796583 A JP 9796583A JP S59224144 A JPS59224144 A JP S59224144A
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- conductive material
- sections
- irregularities
- sputtering method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000004065 semiconductor Substances 0.000 title claims description 8
- 239000004020 conductor Substances 0.000 claims abstract description 24
- 238000004544 sputter deposition Methods 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 10
- 238000005530 etching Methods 0.000 claims abstract description 7
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 5
- 239000010703 silicon Substances 0.000 claims abstract description 5
- 238000000151 deposition Methods 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 10
- 230000008021 deposition Effects 0.000 claims description 8
- 239000011810 insulating material Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract 3
- 238000000576 coating method Methods 0.000 abstract 3
- 230000001788 irregular Effects 0.000 abstract 2
- 230000008569 process Effects 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000005566 electron beam evaporation Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 241000272525 Anas platyrhynchos Species 0.000 description 1
- 240000000220 Panda oleosa Species 0.000 description 1
- 235000016496 Panda oleosa Nutrition 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000008570 general process Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
Landscapes
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9796583A JPS59224144A (ja) | 1983-06-03 | 1983-06-03 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9796583A JPS59224144A (ja) | 1983-06-03 | 1983-06-03 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59224144A true JPS59224144A (ja) | 1984-12-17 |
| JPH0126176B2 JPH0126176B2 (enExample) | 1989-05-22 |
Family
ID=14206378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9796583A Granted JPS59224144A (ja) | 1983-06-03 | 1983-06-03 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59224144A (enExample) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5513915A (en) * | 1978-07-17 | 1980-01-31 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Semiconductor integrated circuit |
-
1983
- 1983-06-03 JP JP9796583A patent/JPS59224144A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5513915A (en) * | 1978-07-17 | 1980-01-31 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Semiconductor integrated circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0126176B2 (enExample) | 1989-05-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4430365A (en) | Method for forming conductive lines and vias | |
| CN1173734A (zh) | 用于制造半导体器件的接触掩模 | |
| JPS6343895B2 (enExample) | ||
| JPH0580140B2 (enExample) | ||
| US5045917A (en) | Multi-level semiconductor structure and process of fabricating thereof | |
| JPS59224144A (ja) | 半導体装置の製造方法 | |
| JPS58184741A (ja) | 半導体装置の製造方法 | |
| US6777772B1 (en) | Semiconductor device having improved trench structure | |
| JPH01303742A (ja) | 半導体装置 | |
| JPH0228923A (ja) | 半導体装置の製造方法 | |
| KR100190079B1 (ko) | 반도체 소자의 금속 배선 및 그 형성방법 | |
| JPH0496254A (ja) | 薄膜多層回路基板とその製造方法 | |
| JPS6239823B2 (enExample) | ||
| KR900000046B1 (ko) | 마그네틱 버블 메모리칩을 제조하는 방법 | |
| JPH07122632A (ja) | 半導体装置 | |
| JPH0338832A (ja) | 半導体装置の配線構造 | |
| JPS62286230A (ja) | 薄膜の選択食刻方法 | |
| JPS59163838A (ja) | 半導体装置の製造方法 | |
| JPS63207153A (ja) | 半導体装置の製造方法 | |
| JPS6130053A (ja) | 段差の被覆方法 | |
| JPH0682610B2 (ja) | 半導体装置の製造法 | |
| JPS5961144A (ja) | 半導体装置の製造方法 | |
| JPS61191054A (ja) | 半導体集積回路及びその製造方法 | |
| JPS6381833A (ja) | 半導体装置の製造方法 | |
| JPS61152038A (ja) | 多層配線 |