JPS5513915A - Semiconductor integrated circuit - Google Patents

Semiconductor integrated circuit

Info

Publication number
JPS5513915A
JPS5513915A JP8618178A JP8618178A JPS5513915A JP S5513915 A JPS5513915 A JP S5513915A JP 8618178 A JP8618178 A JP 8618178A JP 8618178 A JP8618178 A JP 8618178A JP S5513915 A JPS5513915 A JP S5513915A
Authority
JP
Japan
Prior art keywords
wiring
face
stepped
convex portion
width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8618178A
Other languages
Japanese (ja)
Inventor
Kunimitsu Fujiki
Akitomo Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHIYOU LSI GIJUTSU KENKYU KUMIAI
CHO LSI GIJUTSU KENKYU KUMIAI
Original Assignee
CHIYOU LSI GIJUTSU KENKYU KUMIAI
CHO LSI GIJUTSU KENKYU KUMIAI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHIYOU LSI GIJUTSU KENKYU KUMIAI, CHO LSI GIJUTSU KENKYU KUMIAI filed Critical CHIYOU LSI GIJUTSU KENKYU KUMIAI
Priority to JP8618178A priority Critical patent/JPS5513915A/en
Publication of JPS5513915A publication Critical patent/JPS5513915A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To reduce a wiring area by conncting on the intermediate slope a wiring on the convex portion to a wiring on the bottom portion, which are provided on a silicon substrate as to make a contact with each other in the vertical side face.
CONSTITUTION: A slot 22 with the width w" and length w' is provided in the silicon substrate 21 and is covered with an oxide film 24 having the thickness a. In this case, the slot width w=w"-2a. When Al 26 and 25 with the thickness of a<h are vapor-attached, the stepped division is performed from the vertical side face 27, and the area consisting of n pieces of wirings, with the width w can be materialized with a minimun area S=nwL. Connecting of two stepped wirings can be materialized by making a window 34 at the top end of the convex portion 32 after covering it with SiO233. Joining between the surfaces 35 of the slot bottom 40 and convex portion 32 can be achieved with the slope face 37 of a pentagon having an angle of 55°, used as one face of a quadrangular pyramid. Under such a condition, when the full face is covered with SiO2 and Al vapor-attachment is performed, the stepped wiring 26 and 25 can be connected preferably.
COPYRIGHT: (C)1980,JPO&Japio
JP8618178A 1978-07-17 1978-07-17 Semiconductor integrated circuit Pending JPS5513915A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8618178A JPS5513915A (en) 1978-07-17 1978-07-17 Semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8618178A JPS5513915A (en) 1978-07-17 1978-07-17 Semiconductor integrated circuit

Publications (1)

Publication Number Publication Date
JPS5513915A true JPS5513915A (en) 1980-01-31

Family

ID=13879584

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8618178A Pending JPS5513915A (en) 1978-07-17 1978-07-17 Semiconductor integrated circuit

Country Status (1)

Country Link
JP (1) JPS5513915A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59224144A (en) * 1983-06-03 1984-12-17 Agency Of Ind Science & Technol Semiconductor device and manufacture thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59224144A (en) * 1983-06-03 1984-12-17 Agency Of Ind Science & Technol Semiconductor device and manufacture thereof
JPH0126176B2 (en) * 1983-06-03 1989-05-22 Kogyo Gijutsuin

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