JPS59222947A - 半導体装置およびその製造方法 - Google Patents

半導体装置およびその製造方法

Info

Publication number
JPS59222947A
JPS59222947A JP58098351A JP9835183A JPS59222947A JP S59222947 A JPS59222947 A JP S59222947A JP 58098351 A JP58098351 A JP 58098351A JP 9835183 A JP9835183 A JP 9835183A JP S59222947 A JPS59222947 A JP S59222947A
Authority
JP
Japan
Prior art keywords
frame
electrode terminal
semiconductor device
semiconductor element
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58098351A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0437585B2 (cs
Inventor
Hiroshi Takahashi
弘 高橋
Isamu Kitahiro
北広　勇
Kenzo Hatada
畑田　賢造
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP58098351A priority Critical patent/JPS59222947A/ja
Publication of JPS59222947A publication Critical patent/JPS59222947A/ja
Publication of JPH0437585B2 publication Critical patent/JPH0437585B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
JP58098351A 1983-06-02 1983-06-02 半導体装置およびその製造方法 Granted JPS59222947A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58098351A JPS59222947A (ja) 1983-06-02 1983-06-02 半導体装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58098351A JPS59222947A (ja) 1983-06-02 1983-06-02 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JPS59222947A true JPS59222947A (ja) 1984-12-14
JPH0437585B2 JPH0437585B2 (cs) 1992-06-19

Family

ID=14217469

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58098351A Granted JPS59222947A (ja) 1983-06-02 1983-06-02 半導体装置およびその製造方法

Country Status (1)

Country Link
JP (1) JPS59222947A (cs)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62226636A (ja) * 1986-03-28 1987-10-05 Matsushita Electric Ind Co Ltd プラスチツクチツプキヤリア
JPH01173742A (ja) * 1987-12-28 1989-07-10 Hitachi Ltd 半導体装置及びその製造方法
JPH01309362A (ja) * 1988-06-08 1989-12-13 Hitachi Ltd マルチチツプ半導体装置
JPH02134859A (ja) * 1988-11-16 1990-05-23 Hitachi Ltd マルチチップ半導体装置とその製造方法
JPH02192745A (ja) * 1989-01-20 1990-07-30 Omron Tateisi Electron Co Ｉｃモジュールおよびその製造方法
US5587341A (en) * 1987-06-24 1996-12-24 Hitachi, Ltd. Process for manufacturing a stacked integrated circuit package
WO1998022980A1 (fr) * 1996-11-21 1998-05-28 Hitachi, Ltd. Dispositif a semi-conducteur et son procede de fabrication
EP0798780A3 (en) * 1996-03-27 2000-09-13 Oki Electric Industry Co., Ltd. Semiconductor device, manufacturing method thereof and aggregate type semiconductor device
US6984885B1 (en) 2000-02-10 2006-01-10 Renesas Technology Corp. Semiconductor device having densely stacked semiconductor chips

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57122559A (en) * 1980-12-08 1982-07-30 Gao Ges Automation Org Integrated circuit module support

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57122559A (en) * 1980-12-08 1982-07-30 Gao Ges Automation Org Integrated circuit module support

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62226636A (ja) * 1986-03-28 1987-10-05 Matsushita Electric Ind Co Ltd プラスチツクチツプキヤリア
US6424030B2 (en) 1987-06-24 2002-07-23 Hitachi, Ltd. Semiconductor memory module having double-sided stacked memory chip layout
US5587341A (en) * 1987-06-24 1996-12-24 Hitachi, Ltd. Process for manufacturing a stacked integrated circuit package
US5708298A (en) * 1987-06-24 1998-01-13 Hitachi Ltd. Semiconductor memory module having double-sided stacked memory chip layout
US6693346B2 (en) 1987-06-24 2004-02-17 Hitachi, Ltd. Semiconductor memory module having double-sided stacked memory chip layout
US5910685A (en) * 1987-06-24 1999-06-08 Hitachi Ltd. Semiconductor memory module having double-sided stacked memory chip layout
US6521993B2 (en) 1987-06-24 2003-02-18 Hitachi, Ltd. Semiconductor memory module having double-sided stacked memory chip layout
US6262488B1 (en) 1987-06-24 2001-07-17 Hitachi Ltd. Semiconductor memory module having double-sided memory chip layout
JPH01173742A (ja) * 1987-12-28 1989-07-10 Hitachi Ltd 半導体装置及びその製造方法
JPH01309362A (ja) * 1988-06-08 1989-12-13 Hitachi Ltd マルチチツプ半導体装置
JPH02134859A (ja) * 1988-11-16 1990-05-23 Hitachi Ltd マルチチップ半導体装置とその製造方法
JPH02192745A (ja) * 1989-01-20 1990-07-30 Omron Tateisi Electron Co Ｉｃモジュールおよびその製造方法
US6208021B1 (en) 1996-03-27 2001-03-27 Oki Electric Industry Co., Ltd. Semiconductor device, manufacturing method thereof and aggregate type semiconductor device
US6403398B2 (en) 1996-03-27 2002-06-11 Oki Electric Industry Co, Ltd. Semiconductor device, manufacturing method thereof and aggregate type semiconductor device
EP0798780A3 (en) * 1996-03-27 2000-09-13 Oki Electric Industry Co., Ltd. Semiconductor device, manufacturing method thereof and aggregate type semiconductor device
US6664616B2 (en) 1996-11-21 2003-12-16 Hitachi, Ltd. Semiconductor device and manufacturing method thereof
WO1998022980A1 (fr) * 1996-11-21 1998-05-28 Hitachi, Ltd. Dispositif a semi-conducteur et son procede de fabrication
US6759272B2 (en) 1996-11-21 2004-07-06 Renesas Technology Corp. Semiconductor device and manufacturing method thereof
KR100447313B1 (ko) * 1996-11-21 2004-09-07 가부시키가이샤 히타치세이사쿠쇼 반도체 장치 및 그 제조방법
US6984885B1 (en) 2000-02-10 2006-01-10 Renesas Technology Corp. Semiconductor device having densely stacked semiconductor chips

Also Published As

Publication number Publication date
JPH0437585B2 (cs) 1992-06-19

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