JPS59222901A - セラミツク電子部品の製造方法 - Google Patents
セラミツク電子部品の製造方法Info
- Publication number
- JPS59222901A JPS59222901A JP58098552A JP9855283A JPS59222901A JP S59222901 A JPS59222901 A JP S59222901A JP 58098552 A JP58098552 A JP 58098552A JP 9855283 A JP9855283 A JP 9855283A JP S59222901 A JPS59222901 A JP S59222901A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- ceramic electronic
- electronic part
- plating film
- producing ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims description 14
- 238000000034 method Methods 0.000 title description 5
- 229910000679 solder Inorganic materials 0.000 claims description 19
- 238000007747 plating Methods 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 7
- 238000007772 electroless plating Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000005498 polishing Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000003082 abrasive agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910005855 NiOx Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Thermistors And Varistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58098552A JPS59222901A (ja) | 1983-06-01 | 1983-06-01 | セラミツク電子部品の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58098552A JPS59222901A (ja) | 1983-06-01 | 1983-06-01 | セラミツク電子部品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59222901A true JPS59222901A (ja) | 1984-12-14 |
| JPH0145961B2 JPH0145961B2 (enExample) | 1989-10-05 |
Family
ID=14222847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58098552A Granted JPS59222901A (ja) | 1983-06-01 | 1983-06-01 | セラミツク電子部品の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59222901A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62205615A (ja) * | 1986-03-05 | 1987-09-10 | 株式会社村田製作所 | セラミツクスの金属化方法 |
-
1983
- 1983-06-01 JP JP58098552A patent/JPS59222901A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62205615A (ja) * | 1986-03-05 | 1987-09-10 | 株式会社村田製作所 | セラミツクスの金属化方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0145961B2 (enExample) | 1989-10-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS59222901A (ja) | セラミツク電子部品の製造方法 | |
| JPS6350010A (ja) | 充填層構成素子 | |
| US3137586A (en) | Low electrical resistance metal to metal oxide bonding composition | |
| JPH0290529A (ja) | 半導体装置の製造方法 | |
| JPH0547444Y2 (enExample) | ||
| JPH04258131A (ja) | 半田バンプ形成方法及び半田ボール | |
| JPH04307944A (ja) | 半導体素子の接続材料および半導体装置 | |
| JPH04237590A (ja) | クリーム半田とその製造方法及び半田付け材料 | |
| JPH0217603A (ja) | チップ部品及びその製造方法 | |
| JPH01230213A (ja) | 電子部品 | |
| JPS5952827A (ja) | 積層セラミツクコンデンサの電極形成方法 | |
| JPS6019124B2 (ja) | 電子部品の外部電極形成方法 | |
| JPS59220901A (ja) | セラミツク電子部品の電極形成方法 | |
| JPS5969906A (ja) | 積層セラミツクコンデンサの端子電極形成方法 | |
| JPS63124507A (ja) | チツプ型電子部品 | |
| JPH06349316A (ja) | 導電ペースト | |
| JPS5858717A (ja) | 電子部品 | |
| JPH08124706A (ja) | チップ状電子部品およびその製造方法 | |
| JPS6199319A (ja) | セラミツク電子部品 | |
| JPS59193016A (ja) | 積層コンデンサの製造方法 | |
| JPH06188101A (ja) | 電子部品 | |
| JPS6314848B2 (enExample) | ||
| JPS61180402A (ja) | 電圧非直線抵抗素子の製造方法 | |
| JPS58141506A (ja) | チツプ型サ−ミスタ | |
| JPS63308301A (ja) | セラミック電子部品などの電極形成方法 |