JPS59209474A - 自動半田付装置 - Google Patents

自動半田付装置

Info

Publication number
JPS59209474A
JPS59209474A JP59076096A JP7609684A JPS59209474A JP S59209474 A JPS59209474 A JP S59209474A JP 59076096 A JP59076096 A JP 59076096A JP 7609684 A JP7609684 A JP 7609684A JP S59209474 A JPS59209474 A JP S59209474A
Authority
JP
Japan
Prior art keywords
flux
printed wiring
wiring board
automatic soldering
heating means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59076096A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6254582B2 (enFirst
Inventor
Kiyoshi Shirakawa
白川　清
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP59076096A priority Critical patent/JPS59209474A/ja
Publication of JPS59209474A publication Critical patent/JPS59209474A/ja
Publication of JPS6254582B2 publication Critical patent/JPS6254582B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/082—Flux dispensers; Apparatus for applying flux
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3468—Application of molten solder, e.g. dip soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
JP59076096A 1984-04-16 1984-04-16 自動半田付装置 Granted JPS59209474A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59076096A JPS59209474A (ja) 1984-04-16 1984-04-16 自動半田付装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59076096A JPS59209474A (ja) 1984-04-16 1984-04-16 自動半田付装置

Publications (2)

Publication Number Publication Date
JPS59209474A true JPS59209474A (ja) 1984-11-28
JPS6254582B2 JPS6254582B2 (enFirst) 1987-11-16

Family

ID=13595318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59076096A Granted JPS59209474A (ja) 1984-04-16 1984-04-16 自動半田付装置

Country Status (1)

Country Link
JP (1) JPS59209474A (enFirst)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63168273A (ja) * 1986-12-29 1988-07-12 Tamura Seisakusho Co Ltd 自動はんだ付け装置
JPS63242467A (ja) * 1987-03-30 1988-10-07 Tamura Seisakusho Co Ltd 噴流式はんだ付け装置
US6257480B1 (en) 1998-07-07 2001-07-10 Denso Corporation Jet soldering method and apparatus
JP2009285719A (ja) * 2008-05-30 2009-12-10 Nippon Dennetsu Co Ltd フラックス塗布装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63168273A (ja) * 1986-12-29 1988-07-12 Tamura Seisakusho Co Ltd 自動はんだ付け装置
JPS63242467A (ja) * 1987-03-30 1988-10-07 Tamura Seisakusho Co Ltd 噴流式はんだ付け装置
US6257480B1 (en) 1998-07-07 2001-07-10 Denso Corporation Jet soldering method and apparatus
JP2009285719A (ja) * 2008-05-30 2009-12-10 Nippon Dennetsu Co Ltd フラックス塗布装置

Also Published As

Publication number Publication date
JPS6254582B2 (enFirst) 1987-11-16

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