JPS59209474A - Automatic soldering device - Google Patents

Automatic soldering device

Info

Publication number
JPS59209474A
JPS59209474A JP7609684A JP7609684A JPS59209474A JP S59209474 A JPS59209474 A JP S59209474A JP 7609684 A JP7609684 A JP 7609684A JP 7609684 A JP7609684 A JP 7609684A JP S59209474 A JPS59209474 A JP S59209474A
Authority
JP
Japan
Prior art keywords
flux
board
printed wiring
wiring board
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7609684A
Other languages
Japanese (ja)
Other versions
JPS6254582B2 (en
Inventor
Kiyoshi Shirakawa
白川　清
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP7609684A priority Critical patent/JPS59209474A/en
Publication of JPS59209474A publication Critical patent/JPS59209474A/en
Publication of JPS6254582B2 publication Critical patent/JPS6254582B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/082—Flux dispensers; Apparatus for applying flux
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To coat uniformly a flux on a printed wiring board and to perform surely the succeeding soldering with high reliability in the stage of soldering electronic parts, etc. to said board by coating the solder flux thereon after preheating the board. CONSTITUTION:A printed wiring board 6 is preheated by the hot wind from a hood port 10 of a preheating hood 9 of a hot wind generator constituted of a heater 7 and a fan 8 and is then moved to above a flux vessel 1 in the stage of soldering the board 6. Air is fed through a pipe 3 to the inside of the flux 4 in the vessel 1 and is foamed by a foaming pipe 2 so that the flux is stuck on the rear surface of the board 6. Since the board 6 is preheated, the excess flux flows down and the flux is stuck on the rear surface to a uniform thickness. The board is further heated by the above-described hot wind and is fed to a soldering stage. The temp. of the solder 4 is measured with a thermometer and the value thereof is inputted to a temp. control device 12 which controls the operation of the heater 7 and the fan 8 to maintain the specified temp. of the flux 4.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は印刷配線板に電子部品等を半田付け＋る際に使
用する自動半田付装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an automatic soldering device used for soldering electronic components to printed wiring boards.

従来例の構成とその問題点 一般に、印刷配線板に電子部品を半田付けする際に使用
する自動半田付装置は、印刷配線板にフラックスを塗布
するフラックス塗布装置と、フラックスが塗布された印
刷配線板を予め予熱する予備加熱装置と、予備加熱され
た印刷配線板を浸漬半田付法によって半田付けする半田
付装置によって構成でれている。ところで、従来より使
用σれでいるこの種の自動半田付装置において、フラッ
クス塗布装置や予備加熱装置は第１図に示すように構成
されることが多い。すなわち、第１図において、１（げ
フラックス塗布装置を構成するフラックス容器でロシ、
このフランクス容器１内ＶｃＵノズル５及び発泡管２が
設けられており、発泡管２にパイプ３を介して空気を送
り込むことによりフラックス容器１内のフラックス４を
発泡σせ、印刷配線板６の下面にフラックスを塗布する
ように構成されている。そして、７は予備加熱装置を構
成するヒータであり、ファン８によって熱風を送り込む
ことにより印刷配線板６Ｖｃ塗布σれたフラックスを乾
燥させ活性化てせるようにしている。Conventional configurations and their problems In general, automatic soldering equipment used to solder electronic components to printed wiring boards consists of a flux applicator that applies flux to the printed wiring board, and a soldering device that applies flux to the printed wiring board. It consists of a preheating device that preheats the board, and a soldering device that solders the preheated printed wiring board by immersion soldering. Incidentally, in this type of automatic soldering apparatus, which has not been used in the past, the flux coating device and the preheating device are often constructed as shown in FIG. That is, in FIG.
A VcU nozzle 5 and a foaming tube 2 are provided in this Franks container 1, and by sending air into the foaming tube 2 through a pipe 3, the flux 4 in the flux container 1 is foamed, and the lower surface of the printed wiring board 6 is It is configured to apply flux to. Reference numeral 7 denotes a heater constituting a preheating device, and a fan 8 blows hot air to dry and activate the flux applied to the printed wiring board 6Vc.

ところで、この種の自動半田付装置において、印刷配線
板６に塗布σれるフラックスの量は発泡管２の材質や発
泡管２に送り込１れる空気圧、フラックスの濃度等によ
って大きく影響を受ける。今、仮に均一な泡が得られな
かっ／ヒとすると、印刷配、線板へのフラックスの塗布
状態に大きなムシが生じることになり、フラックスが付
き過ぎた部分でＨ次の予備加熱の段階でフラックスの零
がヒータ了の−ＩＪ’ｃ落下し、発火したり、悪臭を出
すことになり、きわめて危険であるという問題がある。By the way, in this type of automatic soldering apparatus, the amount of flux applied to the printed wiring board 6 is greatly influenced by the material of the foaming tube 2, the air pressure fed into the foaming tube 2, the concentration of flux, etc. Now, if uniform bubbles are not obtained/heated, large blemishes will occur in the state of flux application to the printing wiring and wiring board, and in the areas where too much flux is applied, during the next preheating stage. There is a problem in that the zero flux falls onto the heater, causing a fire or emitting a bad odor, which is extremely dangerous.

１だ、印刷配線板に塗布きれたフラックスの量が多過ぎ
ると次の予備加熱の段階で、上記フラックスが充分に乾
燥されず、活性化されない捷捷で更に次の半田何工程に
至ることになり、半田側自体が著しく悪い状態になると
いう問題かめる。1. If too much flux is applied to the printed wiring board, the flux will not be dried sufficiently during the next preheating stage, and the flux will not be activated, leading to the next soldering process. This poses a problem in that the solder side itself becomes extremely bad.

発明の目的 本発明は以上のような従来の欠点を除去するものでるり
、簡単な構成で信頼性の高い確実な半田付けの可能な優
れた自動半田付装置を提供することを目的とするもので
ある。OBJECTS OF THE INVENTION The purpose of the present invention is to eliminate the above-mentioned conventional drawbacks, and to provide an excellent automatic soldering device that has a simple configuration and is capable of highly reliable and reliable soldering. It is.

発明の構成 上記の目的を達成するため、本発明の゛自動半田付装置
は、フラックス塗布に先立って印刷配線板を予備加熱す
ることを特長としており、印刷配線板を予備加熱する第
１の加熱手段と、この第１の加熱手段によって予備加熱
された印刷配線板にフラックスを塗布するフラックス塗
布装置と、このフラックス塗布装置によってフラックス
が塗布きれた印刷配線板を更に加熱する第２の加熱手段
と、この第２の加熱手段によって加熱埒れた印刷配線板
に半田を付着させる浸漬半田付装置を備えたものである
。Structure of the Invention In order to achieve the above object, the automatic soldering apparatus of the present invention is characterized by preheating a printed wiring board prior to flux application, and the first heating for preheating the printed wiring board. a flux coating device that applies flux to the printed wiring board preheated by the first heating device; and a second heating device that further heats the printed wiring board that has been completely coated with flux by the flux coating device. , is equipped with an immersion soldering device for attaching solder to the printed wiring board heated and soldered by the second heating means.

実施例の説明 以下、本発明の自動半田付装置について一実施例の図面
とともに説明する。第２図は本発明の自動半田付装置に
おける一実施例の要部断面図であり、図中、１〜８は第
１図に示すものと同様のものを示している。第２図にお
いて、９Ｆｉ予備加熱装置を構成するフードであり、そ
の一部はフラックス塗布装置の前工程まで延長きれてい
る。そして、延長てれたフード９の先端にフード口１０
を設け、ここからファン８によって送り込まれた熱風が
噴出する」＝うに構成きれている。才だ、フード９はフ
ラックス塗布装置を構成するフラックス容器１に接する
ように設けられており、フード９内の熱風によって同時
にフラックス容器１内のフラックス４が加熱されるよう
に構成沁れている０１１はフラックス容器１内に設けら
れたフラックス４の温度を検出する検出片であり、その
出力は温度制御器１２に印加され温度制御器１２によっ
て自動的にヒータ７、ファン８等を制御し、フラックス
４の温度を一定に保つように構成している。DESCRIPTION OF EMBODIMENTS The automatic soldering apparatus of the present invention will be described below with reference to drawings of one embodiment. FIG. 2 is a sectional view of essential parts of an embodiment of the automatic soldering apparatus of the present invention, and in the figure, numerals 1 to 8 indicate the same parts as shown in FIG. 1. In FIG. 2, there is shown a hood that constitutes a 9Fi preheating device, and a portion of the hood has been extended to the pre-process of the flux coating device. Then, a hood opening 10 is placed at the tip of the extended hood 9.
The hot air sent by the fan 8 is blown out from here. The hood 9 is provided in contact with the flux container 1 constituting the flux application device, and is configured so that the hot air in the hood 9 simultaneously heats the flux 4 in the flux container 1. is a detection piece that detects the temperature of the flux 4 provided in the flux container 1, and its output is applied to the temperature controller 12, which automatically controls the heater 7, fan 8, etc. 4 is configured to keep the temperature constant.

尚、実施例で示すようにフラックスの温度を検出し、こ
れによってヒータやファンを制御するように構成した場
合にはフラックスの温度を常に適温に保つことができ、
より確実な半田付けが可能になるという利点を有する。In addition, if the temperature of the flux is detected and the heater and fan are controlled based on the temperature as shown in the example, the temperature of the flux can always be kept at an appropriate temperature.
This has the advantage that more reliable soldering is possible.

発明の効果 以上のように本発明の自動半田付装置は、フラックス塗
布装置の前段に印刷配線板を予備加熱する第１の予備加
熱手段を設け、この加熱手段によって予備加熱された印
刷配線板にフラックスを塗布し、再び予備加熱して半田
付装置に送り込むように構成したものであり、フラック
ス塗布装置の前段に予備加熱手段を設けたため、フラッ
クス塗布装置によって余分に７ラツクスが塗布σれた場
合でも、その場で余分なフラックスが飛ひ散ることにな
り、常に均一にフラックスが塗布σれることになる。し
たがって、本発明によれば、フラックス塗布装置の後段
に設けた予備加熱手段によってフラックスが常に充分に
活性化きれることになり、次の半田付工程でも常に正確
かつ確実な半田付けが行なわれるという利点を有する。Effects of the Invention As described above, the automatic soldering apparatus of the present invention is provided with a first preheating means for preheating a printed wiring board upstream of the flux coating device, and the printed wiring board preheated by this heating means is heated. The structure is such that flux is applied, preheated again, and then sent to the soldering device.As a preheating means was provided before the flux applicator, an extra 7 lux was applied by the flux applicator. However, the excess flux will scatter on the spot, and the flux will always be applied evenly. Therefore, according to the present invention, the flux can always be sufficiently activated by the preheating means provided at the latter stage of the flux applicator, and the advantage is that accurate and reliable soldering is always performed in the next soldering process. has.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の自動半田付装置の要部断面図、第２図は
本発明の自動半田付装置における一実施例の要部断面図
である。 １・・・・・フラックス容器、２・・・・・発泡管、３
・・パイプ、４・・・・フラックス、５・・・ノズル、
６・・・・・印刷配線板、７・　　ヒータ、８　・・フ
ァン、９・・・　ツー１−１１０　　・・フード口、１
１　・・温度検出片、１２・・・・温度制御器。FIG. 1 is a sectional view of a main part of a conventional automatic soldering apparatus, and FIG. 2 is a sectional view of a main part of an embodiment of the automatic soldering apparatus of the present invention. 1... Flux container, 2... Foaming tube, 3
...Pipe, 4...Flux, 5...Nozzle,
6... Printed wiring board, 7. Heater, 8... Fan, 9... Two 1-110... Hood opening, 1
1...Temperature detection piece, 12...Temperature controller.

Claims (3)

【特許請求の範囲】[Claims] （１）印刷配線板を予備加熱する第１の加熱手段と、こ
の第１の加熱手段によって予備加熱きれた印刷配線板に
フラックスを塗布するフラックス塗布装置とこのフラッ
クス塗布装置によってフラックスが塗布された印刷配線
板を更に加熱する第２の加熱手段と、この第２の加熱手
段によって加熱された印刷配線板に半田を利殖坏せる浸
漬半田付装置を備えて成る自動半田付装置。(1) A first heating means for preheating a printed wiring board, a flux coating device for applying flux to the printed wiring board preheated by the first heating means, and a flux coating device for applying flux. An automatic soldering device comprising a second heating means for further heating a printed wiring board, and an immersion soldering device for applying solder to the printed wiring board heated by the second heating means. （２）　　第１．第２の加熱手段の熱源を共通にしたこ
とを特徴とする特許請求の範囲第１項記載の自動半田付
装置。(2) First. 2. The automatic soldering apparatus according to claim 1, wherein the second heating means share a common heat source. （３）　　フラックス塗布装置として、フラックスの液
温を自動制御できるものを用いたことを特徴とする特許
請求の範囲第１項記載の自動半田付装置。(3) The automatic soldering device according to claim 1, wherein the flux coating device is one that can automatically control the liquid temperature of the flux.
JP7609684A 1984-04-16 1984-04-16 Automatic soldering device Granted JPS59209474A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7609684A JPS59209474A (en) 1984-04-16 1984-04-16 Automatic soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7609684A JPS59209474A (en) 1984-04-16 1984-04-16 Automatic soldering device

Publications (2)

Publication Number Publication Date
JPS59209474A true JPS59209474A (en) 1984-11-28
JPS6254582B2 JPS6254582B2 (en) 1987-11-16

Family

ID=13595318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7609684A Granted JPS59209474A (en) 1984-04-16 1984-04-16 Automatic soldering device

Country Status (1)

Country Link
JP (1) JPS59209474A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63168273A (en) * 1986-12-29 1988-07-12 Tamura Seisakusho Co Ltd Automatic soldering device
JPS63242467A (en) * 1987-03-30 1988-10-07 Tamura Seisakusho Co Ltd Jet type soldering device
US6257480B1 (en) 1998-07-07 2001-07-10 Denso Corporation Jet soldering method and apparatus
JP2009285719A (en) * 2008-05-30 2009-12-10 Nippon Dennetsu Co Ltd Flux applicator

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63168273A (en) * 1986-12-29 1988-07-12 Tamura Seisakusho Co Ltd Automatic soldering device
JPS63242467A (en) * 1987-03-30 1988-10-07 Tamura Seisakusho Co Ltd Jet type soldering device
US6257480B1 (en) 1998-07-07 2001-07-10 Denso Corporation Jet soldering method and apparatus
JP2009285719A (en) * 2008-05-30 2009-12-10 Nippon Dennetsu Co Ltd Flux applicator

Also Published As

Publication number Publication date
JPS6254582B2 (en) 1987-11-16

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