JPS63168273A - Automatic soldering device - Google Patents

Abstract

PURPOSE:To remove the moisture having been bedewed on a work surface with its drying and to start the heating of the work by a preheater from its certain temp. by raising the temp. of the work at least to a flux temp. by a work heater. CONSTITUTION:An automatic soldering unit 11 is arranged with a foaming type fluxer 13 for fluxing a work, preheater 14 to pre-heat, jet type solder tank 15 performing a soldering and cooling fan 16. A work heater 31 is arranged via a work carry-in unit 21 at the carryin side of the fluxer 13. This heater 31 is to raise the temp. of the work to the flux temp. of the fluxer 13 by heating the work and arranged separately from the preheater 14. The bedewed moisture is thus removed by raising the temp. of the work of a printed circuit board to an optimum temp. and the work heating by the preheater 14 is started from a certain temp., so the preheater efficiency can be raised.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to an automatic soldering device having a workpiece warmer.

(Prior art) The automatic soldering apparatus disclosed in Japanese Patent Publication No. 61-2470 includes a fluxer that applies flux to the workpieces and a preheater for preheating the workpieces along an inclined conveyor for conveying the workpieces to be soldered. A preheater for soldering the workpiece, a soldering bath for soldering the workpiece, and a cooling fan for cooling the workpiece are arranged.

Conventionally, after mounting components on a printed circuit board as a workpiece, the workpiece is directly supplied to the conveyor of the automatic soldering apparatus as described above.

The workpieces to be soldered in the soldering bath of this automatic soldering machine are preheated to a high temperature by the preheater immediately beforehand, but the reality is that the temperature of the workpieces supplied to the fluxer is not controlled at all. be.

(Problem to be Solved by the Invention) For this reason, for example, if a printed wiring board that has been stored at a low temperature during the winter is brought into a warm room where an automatic soldering machine is installed, the printed wiring board will be exposed to the low temperature. There are problems such as dew condensation appearing on the board surface.

In this way, conventionally, even if moisture is attached to the surface of the workpiece to be soldered, the workpiece is supplied to a fluxer or the like without removing the moisture, which is undesirable.

In addition, when preheating a workpiece with a preheater, if the initial temperature of the workpiece is a temperature that fluctuates depending on the outside air temperature, especially at a low temperature, the child heating by the preheater cannot be performed efficiently, and the preheating temperature required for good soldering will be lower. Sometimes you can't get it.

SUMMARY OF THE INVENTION An object of the present invention is to provide an automatic soldering device that removes moisture adhering to a workpiece before it is supplied to a fluxer, and also has the function of assisting the function of a preheater after the fluxer.

[Structure of the invention]

(Means for Solving the Problems) The present invention provides a fluxer 13 for applying flux to the workpieces, a preheater 14 for preheating the workpieces, and a soldering process for the workpieces, which are installed along the conveyor 12 for conveying the workpieces to be soldered. In an automatic soldering apparatus comprising at least an array of solder tanks 15 for performing soldering, the fluxer 13
A workpiece warmer 31 for raising the workpiece temperature to at least a substantially constant flux temperature is arranged on the carry-in side of the workpiece, separately from the preheater 14.

(Function) The present invention heats the workpiece to at least the flux temperature using the workpiece warmer 31, thereby drying and removing moisture condensed on the surface of the low-temperature workpiece, and heating the low-temperature workpiece to a substantially constant flux temperature. By increasing the temperature, heating of the workpiece by the pre-heater 14 is started from that constant temperature.

(Examples) Hereinafter, the present invention will be described in detail with reference to examples shown in the drawings.

The automatic soldering unit 11 shown in FIG. 1 includes a foam fluxer 13 that fluxes the workpieces along an inclined conveyor 12 that conveys the workpieces to be soldered (printed wiring boards and their mounted components), and a foam fluxer 13 that applies flux to the workpieces. A preheater 14 for preheating the workpiece, a jet solder bath 15 for soldering the workpiece, and a cooling fan 16 for cooling the workpiece are sequentially arranged. The flux in the fluxer 13 is always controlled at about 20° C. throughout the year by a heater inside the fluxer.

A workpiece warmer 31 is arranged on the importing side of the fluxer 13 of the automatic soldering unit 11 via the workpiece importing unit 21.

The workpiece carry-in unit 21 lowers and tilts the workpiece on an extension of the carry-in side of the conveyor 12 when carrying the workpiece to the soldering conveyor 12 .

Further, the workpiece warmer 31 heats the workpiece to at least the flux temperature of the flux+J13 (approximately 20° C.
= This temperature is controlled to approximately this value throughout the year).
be placed separately from the

As shown in FIG. 2, the workpiece warmer 31 is provided with a conveyor 33 for conveying the workpiece on the upper part of the frame 32, and a hot air blower 34 with a built-in heater installed below the conveyor 33. A panel heater 36 is provided on the main body of the heat sink 134 with a plate 35 interposed therebetween.

The hot air ES34 is provided with a blower 42 on one side of the main body 41, a hot air nozzle 43 on the other side of the main body 41, and blows the hot air upward from the blower 42 through a built-in heater. A wind direction guide plate 44 is provided at the upper end opening of the hot air nozzle 43 .

As shown in FIG. 3, the conveyor 33 includes a movable frame 52 that is disposed with respect to a fixed frame 51 so that the interval can be adjusted freely along a guide rod (not shown), and a handle 53.
The movable frame 52 is moved toward or away from the fixed frame 51 in parallel to the fixed frame 51 by the partial ball screw 54 rotated by the ball screw 54 and the other ball screw 56 rotated via the interlocking gear by the endless chain 55. .

An endless belt 57 for conveying a workpiece is provided along both frames 51 and 52. Parts of the belts 57 on both sides are pulled downward by rollers as shown in FIG. 2, and receive rotational power from the drive shaft 59 of the motor 58. In FIG. 2, 60 is a shielding plate for protecting the belt 57 from hot air.

Then, the movable frame 52 is moved by the handle 53.
Adjust the distance between the belts 57 on both sides to correspond to the size of the workpiece, and attach the printed wiring board (equipped with electronic part suspension) as a workpiece so that it is hung over the belts 57 on both sides. ) is transferred to the right side of the belts 51 on both sides.

This workpiece is moved to the left on a belt 51 that is simultaneously driven by a motor 58, and is moved toward the hot air nozzle 4.
Receives hot air blown out from 3. Moisture condensed on the surface of the printed circuit board is blown away directly by this hot air, or is dried by the heating action of this hot air and the radiant heat from the panel heater 36, and is deposited on the bottom and top surfaces of the board. Water is completely removed. Then, the temperature of the workpiece is raised to at least about 20° C. (flux temperature).

This work is transferred to the work carrying unit 2 shown in FIG.
1, the automatic is lowered and tilted to the extended position of the inclined conveyor 12 of the lυ fixing unit 11, the workpieces are inserted into said conveyor 12 from this loading unit 21, and are fluxed by the fluxer 13.

This fluxed work is transferred to the pre-heater 14.
The workpiece warmer 31 is preheated to a high temperature by
Since the temperature has been raised to about 20℃ in advance by
Workpiece heating by the pre-heater 14 starts efficiently from about 20°C.

Both or one of the hot air blower 34 and the panel heater 36 may be selectively used depending on the season or the like.

Note that when the automatic soldering unit 11 transports the work horizontally, the work carrying unit 21 is not necessary.

〔Effect of the invention〕

According to the present invention, a workpiece warmer that raises the workpiece temperature to at least a substantially constant flux temperature is arranged on the inlet side of the fluxer, separately from the preheater. By raising the temperature, moisture condensed on the surface of the low-temperature workpiece can be removed, and workpiece heating by the pre-heater can be started from a constant temperature, making it possible to increase the pre-heater efficiency.

[Brief explanation of the drawing]

FIG. 1 is a front view showing an embodiment of an automatic soldering apparatus of the present invention, FIG. 2 is a front view of a workpiece warmer thereof, and FIG. 3 is a plan view thereof. 12...conveyor, 13...fluxer, 14...bri-heater, 15...solder bath, 31...work warmer.

Claims (1)

[Claims] (1) Automatic soldering in which at least a fluxer that applies flux to the workpiece, a preheater that preheats the workpiece, and a solder bath that performs soldering to the workpiece are arranged along a conveyor that conveys the workpiece to be soldered. An automatic soldering apparatus characterized in that a workpiece warmer for raising the workpiece temperature to at least a substantially constant flux temperature is arranged on the input side of the fluxer, separately from the preheater.