JPS59200443A - 半導体封止用エポキシ樹脂組成物 - Google Patents

半導体封止用エポキシ樹脂組成物

Info

Publication number
JPS59200443A
JPS59200443A JP58075600A JP7560083A JPS59200443A JP S59200443 A JPS59200443 A JP S59200443A JP 58075600 A JP58075600 A JP 58075600A JP 7560083 A JP7560083 A JP 7560083A JP S59200443 A JPS59200443 A JP S59200443A
Authority
JP
Japan
Prior art keywords
resin
epoxy resin
resol type
type phenol
phenol group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58075600A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0556018B2 (enExample
Inventor
Takashi Urano
浦野　孝志
Etsuji Kubo
久保　悦司
Shinsuke Hagiwara
伸介 萩原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP58075600A priority Critical patent/JPS59200443A/ja
Publication of JPS59200443A publication Critical patent/JPS59200443A/ja
Publication of JPH0556018B2 publication Critical patent/JPH0556018B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP58075600A 1983-04-27 1983-04-27 半導体封止用エポキシ樹脂組成物 Granted JPS59200443A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58075600A JPS59200443A (ja) 1983-04-27 1983-04-27 半導体封止用エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58075600A JPS59200443A (ja) 1983-04-27 1983-04-27 半導体封止用エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS59200443A true JPS59200443A (ja) 1984-11-13
JPH0556018B2 JPH0556018B2 (enExample) 1993-08-18

Family

ID=13580853

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58075600A Granted JPS59200443A (ja) 1983-04-27 1983-04-27 半導体封止用エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS59200443A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61152725A (ja) * 1984-12-26 1986-07-11 Sumitomo Bakelite Co Ltd フエノ−ル樹脂成形材料
JPH01101658A (ja) * 1987-10-15 1989-04-19 Nitto Denko Corp 半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61152725A (ja) * 1984-12-26 1986-07-11 Sumitomo Bakelite Co Ltd フエノ−ル樹脂成形材料
JPH01101658A (ja) * 1987-10-15 1989-04-19 Nitto Denko Corp 半導体装置

Also Published As

Publication number Publication date
JPH0556018B2 (enExample) 1993-08-18

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