JPS59195646A - 半導体素子製造用マスクの洗浄方法および洗浄装置 - Google Patents

半導体素子製造用マスクの洗浄方法および洗浄装置

Info

Publication number
JPS59195646A
JPS59195646A JP58070495A JP7049583A JPS59195646A JP S59195646 A JPS59195646 A JP S59195646A JP 58070495 A JP58070495 A JP 58070495A JP 7049583 A JP7049583 A JP 7049583A JP S59195646 A JPS59195646 A JP S59195646A
Authority
JP
Japan
Prior art keywords
mask
cleaning
back surfaces
pipes
passed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58070495A
Other languages
English (en)
Japanese (ja)
Other versions
JPS649618B2 (enrdf_load_stackoverflow
Inventor
Toshio Wada
和田　俊男
Hiromi Yamashita
裕己 山下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP58070495A priority Critical patent/JPS59195646A/ja
Priority to US06/602,519 priority patent/US4569695A/en
Publication of JPS59195646A publication Critical patent/JPS59195646A/ja
Publication of JPS649618B2 publication Critical patent/JPS649618B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP58070495A 1983-04-21 1983-04-21 半導体素子製造用マスクの洗浄方法および洗浄装置 Granted JPS59195646A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP58070495A JPS59195646A (ja) 1983-04-21 1983-04-21 半導体素子製造用マスクの洗浄方法および洗浄装置
US06/602,519 US4569695A (en) 1983-04-21 1984-04-20 Method of cleaning a photo-mask

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58070495A JPS59195646A (ja) 1983-04-21 1983-04-21 半導体素子製造用マスクの洗浄方法および洗浄装置

Publications (2)

Publication Number Publication Date
JPS59195646A true JPS59195646A (ja) 1984-11-06
JPS649618B2 JPS649618B2 (enrdf_load_stackoverflow) 1989-02-17

Family

ID=13433156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58070495A Granted JPS59195646A (ja) 1983-04-21 1983-04-21 半導体素子製造用マスクの洗浄方法および洗浄装置

Country Status (1)

Country Link
JP (1) JPS59195646A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61160932A (ja) * 1985-01-08 1986-07-21 Fuji Electric Co Ltd フオトマスクの洗浄方法
JPS63228624A (ja) * 1987-03-17 1988-09-22 Nikon Corp 洗浄方法
JPS6419724A (en) * 1987-07-15 1989-01-23 Hitachi Ltd Wet treatment equipment
JPS6419725A (en) * 1987-07-15 1989-01-23 Hitachi Ltd Wet treatment equipment
CN118651658A (zh) * 2024-08-21 2024-09-17 磊菱半导体设备(江苏)有限公司 一种半导体掩模板制造用转运装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58115044A (ja) * 1981-12-28 1983-07-08 Watanabe Shoko:Kk ガラスの洗浄方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58115044A (ja) * 1981-12-28 1983-07-08 Watanabe Shoko:Kk ガラスの洗浄方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61160932A (ja) * 1985-01-08 1986-07-21 Fuji Electric Co Ltd フオトマスクの洗浄方法
JPS63228624A (ja) * 1987-03-17 1988-09-22 Nikon Corp 洗浄方法
JPS6419724A (en) * 1987-07-15 1989-01-23 Hitachi Ltd Wet treatment equipment
JPS6419725A (en) * 1987-07-15 1989-01-23 Hitachi Ltd Wet treatment equipment
CN118651658A (zh) * 2024-08-21 2024-09-17 磊菱半导体设备(江苏)有限公司 一种半导体掩模板制造用转运装置
CN118651658B (zh) * 2024-08-21 2024-11-15 磊菱半导体设备(江苏)有限公司 一种半导体掩模板制造用转运装置

Also Published As

Publication number Publication date
JPS649618B2 (enrdf_load_stackoverflow) 1989-02-17

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