JPS59186334A - ボンデイング装置 - Google Patents

ボンデイング装置

Info

Publication number
JPS59186334A
JPS59186334A JP58061640A JP6164083A JPS59186334A JP S59186334 A JPS59186334 A JP S59186334A JP 58061640 A JP58061640 A JP 58061640A JP 6164083 A JP6164083 A JP 6164083A JP S59186334 A JPS59186334 A JP S59186334A
Authority
JP
Japan
Prior art keywords
pellet
substrate
bonding
positioning table
arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58061640A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0213934B2 (enrdf_load_stackoverflow
Inventor
Noriyuki Inagaki
典之 稲垣
Yutaka Makino
豊 牧野
Takeichi Yoshida
吉田　竹一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP58061640A priority Critical patent/JPS59186334A/ja
Publication of JPS59186334A publication Critical patent/JPS59186334A/ja
Publication of JPH0213934B2 publication Critical patent/JPH0213934B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
JP58061640A 1983-04-07 1983-04-07 ボンデイング装置 Granted JPS59186334A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58061640A JPS59186334A (ja) 1983-04-07 1983-04-07 ボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58061640A JPS59186334A (ja) 1983-04-07 1983-04-07 ボンデイング装置

Publications (2)

Publication Number Publication Date
JPS59186334A true JPS59186334A (ja) 1984-10-23
JPH0213934B2 JPH0213934B2 (enrdf_load_stackoverflow) 1990-04-05

Family

ID=13177005

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58061640A Granted JPS59186334A (ja) 1983-04-07 1983-04-07 ボンデイング装置

Country Status (1)

Country Link
JP (1) JPS59186334A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62292328A (ja) * 1986-06-12 1987-12-19 Matsushita Electric Ind Co Ltd 部品装着方法
JPH01183829A (ja) * 1988-01-19 1989-07-21 Toshiba Corp 電子部品の成形装置
JPH0256945A (ja) * 1988-08-22 1990-02-26 Matsushita Electric Ind Co Ltd 電子部品実装装置
JPH0256946A (ja) * 1988-08-22 1990-02-26 Matsushita Electric Ind Co Ltd 電子部品実装装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04297736A (ja) * 1991-03-06 1992-10-21 Mitsubishi Electric Corp レンジフードファン

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62292328A (ja) * 1986-06-12 1987-12-19 Matsushita Electric Ind Co Ltd 部品装着方法
JPH01183829A (ja) * 1988-01-19 1989-07-21 Toshiba Corp 電子部品の成形装置
JPH0256945A (ja) * 1988-08-22 1990-02-26 Matsushita Electric Ind Co Ltd 電子部品実装装置
JPH0256946A (ja) * 1988-08-22 1990-02-26 Matsushita Electric Ind Co Ltd 電子部品実装装置

Also Published As

Publication number Publication date
JPH0213934B2 (enrdf_load_stackoverflow) 1990-04-05

Similar Documents

Publication Publication Date Title
JPH0150101B2 (enrdf_load_stackoverflow)
KR100303960B1 (ko) 다이-본딩 머신
JPS59186334A (ja) ボンデイング装置
JP3497078B2 (ja) ダイボンダ
JP5104127B2 (ja) ウェハ移載装置と、これを有する半導体製造装置
JP4780858B2 (ja) 半導体装置の製造方法
JP3747054B2 (ja) ボンディング装置及びボンディング方法
JPH06268050A (ja) ダイスボンディング装置
JPH0213933B2 (enrdf_load_stackoverflow)
JPH09232407A (ja) ワーク搬送装置およびそれを用いた半導体製造装置
JPS6245146A (ja) 治具およびこの治具を有する整列供給装置
JP2757037B2 (ja) ボンディング装置
JPS5935177B2 (ja) ダイボンデイング装置
JP2955272B1 (ja) Ｌｅｄチップのダイボンド方法およびダイボンド装置
JP3617483B2 (ja) 電子部品実装方法
JPS6249986B2 (enrdf_load_stackoverflow)
JP2004179517A (ja) ボンディング装置、ボンディング方法及びボンディングプログラム
JP3440801B2 (ja) 電子部品の接合装置
JPH08148529A (ja) Ｉｃチップ実装装置及び実装方法
JPH03129844A (ja) インナーリードボンデイング装置
JPH0131694B2 (enrdf_load_stackoverflow)
JPS61289638A (ja) ボンデイング装置
TW202449957A (zh) 工具滑件、晶片滑件及安裝裝置
JPS63229723A (ja) ダイボンデイング装置
JPH0810188Y2 (ja) ボンディング装置