JPH0213934B2 - - Google Patents

Info

Publication number
JPH0213934B2
JPH0213934B2 JP6164083A JP6164083A JPH0213934B2 JP H0213934 B2 JPH0213934 B2 JP H0213934B2 JP 6164083 A JP6164083 A JP 6164083A JP 6164083 A JP6164083 A JP 6164083A JP H0213934 B2 JPH0213934 B2 JP H0213934B2
Authority
JP
Japan
Prior art keywords
pellet
bonding
positioning table
arm
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP6164083A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59186334A (ja
Inventor
Noryuki Inagaki
Yutaka Makino
Takeichi Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP6164083A priority Critical patent/JPS59186334A/ja
Publication of JPS59186334A publication Critical patent/JPS59186334A/ja
Publication of JPH0213934B2 publication Critical patent/JPH0213934B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
JP6164083A 1983-04-07 1983-04-07 ボンデイング装置 Granted JPS59186334A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6164083A JPS59186334A (ja) 1983-04-07 1983-04-07 ボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6164083A JPS59186334A (ja) 1983-04-07 1983-04-07 ボンデイング装置

Publications (2)

Publication Number Publication Date
JPS59186334A JPS59186334A (ja) 1984-10-23
JPH0213934B2 true JPH0213934B2 (enrdf_load_stackoverflow) 1990-04-05

Family

ID=13177005

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6164083A Granted JPS59186334A (ja) 1983-04-07 1983-04-07 ボンデイング装置

Country Status (1)

Country Link
JP (1) JPS59186334A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04297736A (ja) * 1991-03-06 1992-10-21 Mitsubishi Electric Corp レンジフードファン

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62292328A (ja) * 1986-06-12 1987-12-19 Matsushita Electric Ind Co Ltd 部品装着方法
JP2582829B2 (ja) * 1988-01-19 1997-02-19 株式会社東芝 電子部品の成形装置
JP2725702B2 (ja) * 1988-08-22 1998-03-11 松下電器産業株式会社 電子部品実装方法
JP2725701B2 (ja) * 1988-08-22 1998-03-11 松下電器産業株式会社 電子部品実装装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04297736A (ja) * 1991-03-06 1992-10-21 Mitsubishi Electric Corp レンジフードファン

Also Published As

Publication number Publication date
JPS59186334A (ja) 1984-10-23

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