JPS59181631A - 半導体装置の自動ハンドラ− - Google Patents

半導体装置の自動ハンドラ−

Info

Publication number
JPS59181631A
JPS59181631A JP58056017A JP5601783A JPS59181631A JP S59181631 A JPS59181631 A JP S59181631A JP 58056017 A JP58056017 A JP 58056017A JP 5601783 A JP5601783 A JP 5601783A JP S59181631 A JPS59181631 A JP S59181631A
Authority
JP
Japan
Prior art keywords
frame
semiconductor devices
leads
contact
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58056017A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0514426B2 (enExample
Inventor
Takayoshi Saito
斉藤　嵩能
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP58056017A priority Critical patent/JPS59181631A/ja
Publication of JPS59181631A publication Critical patent/JPS59181631A/ja
Publication of JPH0514426B2 publication Critical patent/JPH0514426B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP58056017A 1983-03-31 1983-03-31 半導体装置の自動ハンドラ− Granted JPS59181631A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58056017A JPS59181631A (ja) 1983-03-31 1983-03-31 半導体装置の自動ハンドラ−

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58056017A JPS59181631A (ja) 1983-03-31 1983-03-31 半導体装置の自動ハンドラ−

Publications (2)

Publication Number Publication Date
JPS59181631A true JPS59181631A (ja) 1984-10-16
JPH0514426B2 JPH0514426B2 (enExample) 1993-02-25

Family

ID=13015288

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58056017A Granted JPS59181631A (ja) 1983-03-31 1983-03-31 半導体装置の自動ハンドラ−

Country Status (1)

Country Link
JP (1) JPS59181631A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61169774A (ja) * 1985-01-22 1986-07-31 Hitachi Electronics Eng Co Ltd Ｉｃ測定ソケツトの支承構造
JPS63101777A (ja) * 1986-10-20 1988-05-06 Matsushita Electronics Corp 半導体素子の測定装置
JP2010190737A (ja) * 2009-02-18 2010-09-02 Seiko Instruments Inc 半導体検査装置
JP2013219354A (ja) * 2012-04-02 2013-10-24 Samsung Electronics Co Ltd 基板製造装置及び基板製造方法
CN105004888A (zh) * 2014-11-10 2015-10-28 成都振芯科技股份有限公司 一种可调集成电路测试治具

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS555700A (en) * 1978-06-29 1980-01-16 Medholding Oy Womb inside contraceptive appliance and its preparation
JPS5764947A (en) * 1980-10-09 1982-04-20 Hitachi Ltd Inspecting apparatus for electric characteristics of electronic parts
JPS5966141A (ja) * 1982-10-08 1984-04-14 Hitachi Ltd ハンドラ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS555700A (en) * 1978-06-29 1980-01-16 Medholding Oy Womb inside contraceptive appliance and its preparation
JPS5764947A (en) * 1980-10-09 1982-04-20 Hitachi Ltd Inspecting apparatus for electric characteristics of electronic parts
JPS5966141A (ja) * 1982-10-08 1984-04-14 Hitachi Ltd ハンドラ

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61169774A (ja) * 1985-01-22 1986-07-31 Hitachi Electronics Eng Co Ltd Ｉｃ測定ソケツトの支承構造
JPS63101777A (ja) * 1986-10-20 1988-05-06 Matsushita Electronics Corp 半導体素子の測定装置
JP2010190737A (ja) * 2009-02-18 2010-09-02 Seiko Instruments Inc 半導体検査装置
JP2013219354A (ja) * 2012-04-02 2013-10-24 Samsung Electronics Co Ltd 基板製造装置及び基板製造方法
US9995787B2 (en) 2012-04-02 2018-06-12 Samsung Electronics Co., Ltd. Apparatus and method for manufacturing substrates
US10823779B2 (en) 2012-04-02 2020-11-03 Samsung Electronics Co., Ltd. Apparatus and method for manufacturing substrates
CN105004888A (zh) * 2014-11-10 2015-10-28 成都振芯科技股份有限公司 一种可调集成电路测试治具
CN105004888B (zh) * 2014-11-10 2017-11-24 成都振芯科技股份有限公司 一种可调集成电路测试治具

Also Published As

Publication number Publication date
JPH0514426B2 (enExample) 1993-02-25

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