JPS59171195A - セラミツク多層配線基板の製造法 - Google Patents

セラミツク多層配線基板の製造法

Info

Publication number
JPS59171195A
JPS59171195A JP4427683A JP4427683A JPS59171195A JP S59171195 A JPS59171195 A JP S59171195A JP 4427683 A JP4427683 A JP 4427683A JP 4427683 A JP4427683 A JP 4427683A JP S59171195 A JPS59171195 A JP S59171195A
Authority
JP
Japan
Prior art keywords
layer
ceramic
conductor
metal
conductor layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4427683A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6346595B2 (enExample
Inventor
矢野　晃朗
水野　福三
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Priority to JP4427683A priority Critical patent/JPS59171195A/ja
Publication of JPS59171195A publication Critical patent/JPS59171195A/ja
Publication of JPS6346595B2 publication Critical patent/JPS6346595B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP4427683A 1983-03-18 1983-03-18 セラミツク多層配線基板の製造法 Granted JPS59171195A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4427683A JPS59171195A (ja) 1983-03-18 1983-03-18 セラミツク多層配線基板の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4427683A JPS59171195A (ja) 1983-03-18 1983-03-18 セラミツク多層配線基板の製造法

Publications (2)

Publication Number Publication Date
JPS59171195A true JPS59171195A (ja) 1984-09-27
JPS6346595B2 JPS6346595B2 (enExample) 1988-09-16

Family

ID=12686981

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4427683A Granted JPS59171195A (ja) 1983-03-18 1983-03-18 セラミツク多層配線基板の製造法

Country Status (1)

Country Link
JP (1) JPS59171195A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02252290A (ja) * 1989-03-27 1990-10-11 Ngk Insulators Ltd 多層配線基板の製造方法
JPH02292896A (ja) * 1989-05-01 1990-12-04 Ngk Insulators Ltd セラミック多層配線基板
JPH0327590A (ja) * 1989-06-23 1991-02-05 Ngk Insulators Ltd セラミック回路基板
JPH03218693A (ja) * 1988-12-23 1991-09-26 Narumi China Corp セラミック多層配線基板およびその製造方法
JP2022093965A (ja) * 2020-12-14 2022-06-24 株式会社ノリタケカンパニーリミテド 金属材料および該金属材料と基材とを備えた接合体

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4954859A (enExample) * 1972-09-27 1974-05-28
JPS5053863A (enExample) * 1973-09-12 1975-05-13
JPS51133766A (en) * 1975-05-14 1976-11-19 Ngk Spark Plug Co Method of forming thick film circuit components on ceramic substrate
JPS5651899A (en) * 1979-10-05 1981-05-09 Nippon Electric Co Method of manufacturing high density multilayer circuit board
JPS56130992A (en) * 1980-03-18 1981-10-14 Hitachi Ltd Method of producing thick film board
JPS5712600A (en) * 1980-06-27 1982-01-22 Hitachi Ltd Method of producing thick film multilayer circuit board
JPS5830194A (ja) * 1981-08-14 1983-02-22 日本碍子株式会社 セラミック多層配線基板の製造法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4954859A (enExample) * 1972-09-27 1974-05-28
JPS5053863A (enExample) * 1973-09-12 1975-05-13
JPS51133766A (en) * 1975-05-14 1976-11-19 Ngk Spark Plug Co Method of forming thick film circuit components on ceramic substrate
JPS5651899A (en) * 1979-10-05 1981-05-09 Nippon Electric Co Method of manufacturing high density multilayer circuit board
JPS56130992A (en) * 1980-03-18 1981-10-14 Hitachi Ltd Method of producing thick film board
JPS5712600A (en) * 1980-06-27 1982-01-22 Hitachi Ltd Method of producing thick film multilayer circuit board
JPS5830194A (ja) * 1981-08-14 1983-02-22 日本碍子株式会社 セラミック多層配線基板の製造法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03218693A (ja) * 1988-12-23 1991-09-26 Narumi China Corp セラミック多層配線基板およびその製造方法
JPH02252290A (ja) * 1989-03-27 1990-10-11 Ngk Insulators Ltd 多層配線基板の製造方法
JPH02292896A (ja) * 1989-05-01 1990-12-04 Ngk Insulators Ltd セラミック多層配線基板
JPH0327590A (ja) * 1989-06-23 1991-02-05 Ngk Insulators Ltd セラミック回路基板
JP2022093965A (ja) * 2020-12-14 2022-06-24 株式会社ノリタケカンパニーリミテド 金属材料および該金属材料と基材とを備えた接合体

Also Published As

Publication number Publication date
JPS6346595B2 (enExample) 1988-09-16

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