JPS59171152A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS59171152A
JPS59171152A JP58044733A JP4473383A JPS59171152A JP S59171152 A JPS59171152 A JP S59171152A JP 58044733 A JP58044733 A JP 58044733A JP 4473383 A JP4473383 A JP 4473383A JP S59171152 A JPS59171152 A JP S59171152A
Authority
JP
Japan
Prior art keywords
terminals
internal terminal
internal
branched
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58044733A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0234458B2 (en, 2012
Inventor
Soichi Ito
伊藤　荘一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP58044733A priority Critical patent/JPS59171152A/ja
Publication of JPS59171152A publication Critical patent/JPS59171152A/ja
Publication of JPH0234458B2 publication Critical patent/JPH0234458B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP58044733A 1983-03-17 1983-03-17 半導体装置 Granted JPS59171152A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58044733A JPS59171152A (ja) 1983-03-17 1983-03-17 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58044733A JPS59171152A (ja) 1983-03-17 1983-03-17 半導体装置

Publications (2)

Publication Number Publication Date
JPS59171152A true JPS59171152A (ja) 1984-09-27
JPH0234458B2 JPH0234458B2 (en, 2012) 1990-08-03

Family

ID=12699642

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58044733A Granted JPS59171152A (ja) 1983-03-17 1983-03-17 半導体装置

Country Status (1)

Country Link
JP (1) JPS59171152A (en, 2012)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51138179A (en) * 1975-05-23 1976-11-29 Seiko Instr & Electronics Ltd Semi-conductor device
JPS54154970A (en) * 1978-05-26 1979-12-06 Kyushu Nippon Electric Semiconductor device
JPS5571030A (en) * 1978-11-24 1980-05-28 Hitachi Ltd Mounting system for semiconductor device
JPS56103458A (en) * 1980-01-21 1981-08-18 Nec Corp Hybrid ic device
JPS572535A (en) * 1980-06-06 1982-01-07 Hitachi Ltd Lead structure
JPS57208184A (en) * 1981-06-17 1982-12-21 Hitachi Ltd Semiconductor device
JPS5878448A (ja) * 1982-10-18 1983-05-12 Hitachi Ltd 集積回路
JPS593960A (ja) * 1982-06-29 1984-01-10 Toshiba Corp 半導体装置
JPS5910240A (ja) * 1982-07-09 1984-01-19 Nec Corp 半導体装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51138179A (en) * 1975-05-23 1976-11-29 Seiko Instr & Electronics Ltd Semi-conductor device
JPS54154970A (en) * 1978-05-26 1979-12-06 Kyushu Nippon Electric Semiconductor device
JPS5571030A (en) * 1978-11-24 1980-05-28 Hitachi Ltd Mounting system for semiconductor device
JPS56103458A (en) * 1980-01-21 1981-08-18 Nec Corp Hybrid ic device
JPS572535A (en) * 1980-06-06 1982-01-07 Hitachi Ltd Lead structure
JPS57208184A (en) * 1981-06-17 1982-12-21 Hitachi Ltd Semiconductor device
JPS593960A (ja) * 1982-06-29 1984-01-10 Toshiba Corp 半導体装置
JPS5910240A (ja) * 1982-07-09 1984-01-19 Nec Corp 半導体装置
JPS5878448A (ja) * 1982-10-18 1983-05-12 Hitachi Ltd 集積回路

Also Published As

Publication number Publication date
JPH0234458B2 (en, 2012) 1990-08-03

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