JPS59168705A - 積層型電圧制御圧電発振器 - Google Patents
積層型電圧制御圧電発振器Info
- Publication number
- JPS59168705A JPS59168705A JP58042576A JP4257683A JPS59168705A JP S59168705 A JPS59168705 A JP S59168705A JP 58042576 A JP58042576 A JP 58042576A JP 4257683 A JP4257683 A JP 4257683A JP S59168705 A JPS59168705 A JP S59168705A
- Authority
- JP
- Japan
- Prior art keywords
- capacitors
- piezoelectric oscillator
- oscillator
- laminated
- diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/495—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates
- C04B35/497—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates based on solid solutions with lead oxides
- C04B35/499—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates based on solid solutions with lead oxides containing also titanates
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
- H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
- H03B5/36—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator active element in amplifier being semiconductor device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58042576A JPS59168705A (ja) | 1983-03-15 | 1983-03-15 | 積層型電圧制御圧電発振器 |
| EP83112593A EP0111890B1 (en) | 1982-12-15 | 1983-12-14 | Monolithic multicomponents ceramic substrate with at least one dielectric layer of a composition having a perovskite structure |
| DE8383112593T DE3382208D1 (de) | 1982-12-15 | 1983-12-14 | Monolithisches vielschichtkeramiksubstrat mit mindestens einer dielektrischen schicht aus einem material mit perovskit-struktur. |
| US06/561,506 US4574255A (en) | 1982-12-15 | 1983-12-15 | MMC Substrate including capacitors having perovskite structure dielectric and electrical devices including MMC substrate |
| AU22427/83A AU563467B2 (en) | 1982-12-15 | 1983-12-15 | Ceramic substrate for piezoelectric element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58042576A JPS59168705A (ja) | 1983-03-15 | 1983-03-15 | 積層型電圧制御圧電発振器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59168705A true JPS59168705A (ja) | 1984-09-22 |
| JPH0468804B2 JPH0468804B2 (https=) | 1992-11-04 |
Family
ID=12639887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58042576A Granted JPS59168705A (ja) | 1982-12-15 | 1983-03-15 | 積層型電圧制御圧電発振器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59168705A (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6416670U (https=) * | 1987-07-21 | 1989-01-27 | ||
| JPH0290515U (https=) * | 1988-12-28 | 1990-07-18 |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5176062A (ja) * | 1974-12-26 | 1976-07-01 | Suwa Seikosha Kk | Denshidokei |
| JPS51106050A (en) * | 1975-03-14 | 1976-09-20 | Citizen Watch Co Ltd | Denshidokeiniokeru denshikairososhi |
| JPS5239871U (https=) * | 1975-09-11 | 1977-03-22 | ||
| JPS5240664U (https=) * | 1975-09-17 | 1977-03-23 | ||
| JPS5479468A (en) * | 1977-12-08 | 1979-06-25 | Fujitsu Ltd | Method of producing ceramic multiicircuit layer board |
| JPS5521665A (en) * | 1978-08-04 | 1980-02-15 | Mitsubishi Electric Corp | Constituent of multi-layer transmission line |
| JPS56107606A (en) * | 1980-01-31 | 1981-08-26 | Nec Corp | Voltage control type piezoelectric oscillator |
| JPS56154805A (en) * | 1980-04-30 | 1981-11-30 | Mitsubishi Electric Corp | Multilayer uniting method for triplet strip line |
| JPS5816595A (ja) * | 1981-07-23 | 1983-01-31 | ティーディーケイ株式会社 | 混成集積回路 |
-
1983
- 1983-03-15 JP JP58042576A patent/JPS59168705A/ja active Granted
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5176062A (ja) * | 1974-12-26 | 1976-07-01 | Suwa Seikosha Kk | Denshidokei |
| JPS51106050A (en) * | 1975-03-14 | 1976-09-20 | Citizen Watch Co Ltd | Denshidokeiniokeru denshikairososhi |
| JPS5239871U (https=) * | 1975-09-11 | 1977-03-22 | ||
| JPS5240664U (https=) * | 1975-09-17 | 1977-03-23 | ||
| JPS5479468A (en) * | 1977-12-08 | 1979-06-25 | Fujitsu Ltd | Method of producing ceramic multiicircuit layer board |
| JPS5521665A (en) * | 1978-08-04 | 1980-02-15 | Mitsubishi Electric Corp | Constituent of multi-layer transmission line |
| JPS56107606A (en) * | 1980-01-31 | 1981-08-26 | Nec Corp | Voltage control type piezoelectric oscillator |
| JPS56154805A (en) * | 1980-04-30 | 1981-11-30 | Mitsubishi Electric Corp | Multilayer uniting method for triplet strip line |
| JPS5816595A (ja) * | 1981-07-23 | 1983-01-31 | ティーディーケイ株式会社 | 混成集積回路 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6416670U (https=) * | 1987-07-21 | 1989-01-27 | ||
| JPH0290515U (https=) * | 1988-12-28 | 1990-07-18 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0468804B2 (https=) | 1992-11-04 |
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