JPS59151445A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS59151445A
JPS59151445A JP58025070A JP2507083A JPS59151445A JP S59151445 A JPS59151445 A JP S59151445A JP 58025070 A JP58025070 A JP 58025070A JP 2507083 A JP2507083 A JP 2507083A JP S59151445 A JPS59151445 A JP S59151445A
Authority
JP
Japan
Prior art keywords
semiconductor device
external terminals
module
sides
modules
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58025070A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0150109B2 (enExample
Inventor
Masahiko Tsumori
昌彦 津守
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP58025070A priority Critical patent/JPS59151445A/ja
Publication of JPS59151445A publication Critical patent/JPS59151445A/ja
Publication of JPH0150109B2 publication Critical patent/JPH0150109B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40Leadframes
    • H10W70/421Shapes or dispositions
    • H10W70/424Cross-sectional shapes
    • H10W70/427Bent parts
    • H10W70/429Bent parts being the outer leads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3421Leaded components
    • H05K3/3426Leaded components characterised by the leads

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP58025070A 1983-02-17 1983-02-17 半導体装置 Granted JPS59151445A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58025070A JPS59151445A (ja) 1983-02-17 1983-02-17 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58025070A JPS59151445A (ja) 1983-02-17 1983-02-17 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP1005333A Division JPH0271551A (ja) 1989-01-12 1989-01-12 半導体装置

Publications (2)

Publication Number Publication Date
JPS59151445A true JPS59151445A (ja) 1984-08-29
JPH0150109B2 JPH0150109B2 (enExample) 1989-10-27

Family

ID=12155659

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58025070A Granted JPS59151445A (ja) 1983-02-17 1983-02-17 半導体装置

Country Status (1)

Country Link
JP (1) JPS59151445A (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59117147A (ja) * 1982-12-23 1984-07-06 Matsushita Electric Ind Co Ltd 複合電子部品

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59117147A (ja) * 1982-12-23 1984-07-06 Matsushita Electric Ind Co Ltd 複合電子部品

Also Published As

Publication number Publication date
JPH0150109B2 (enExample) 1989-10-27

Similar Documents

Publication Publication Date Title
US5410450A (en) Internal wiring structure of a semiconductor device
JP2568748B2 (ja) 半導体装置
JP3656861B2 (ja) 半導体集積回路装置及び半導体集積回路装置の製造方法
JPH05226803A (ja) 実装回路基板
JPH06111869A (ja) 表面実装用端子
JPH0239587A (ja) 高密度実装プリント板
JPS59151445A (ja) 半導体装置
JP2541532B2 (ja) 半導体モジュ―ル
JP2705468B2 (ja) 混成集積回路装置
JPH0271551A (ja) 半導体装置
JP2588956B2 (ja) ジグザグインライン型モジュ−ルおよびジグザグインライン型モジュ−ルの製造方法
JPH0458189B2 (enExample)
JPS598370Y2 (ja) 電気回路ユニツト
JPH01209194A (ja) 集積回路装置
JPH0587869U (ja) 電子部品
JPH07122701A (ja) 半導体装置およびその製造方法ならびにpga用リードフレーム
JPS5939419Y2 (ja) ジヤンパユニツト
JPH0528917B2 (enExample)
JPH02239577A (ja) 表面実装用混成集積回路
JPH0514516Y2 (enExample)
JPH0417279A (ja) Icカード用コネクタ
JPH11243174A (ja) 半導体装置および半導体パッケージユニット
JPH01125571U (enExample)
KR20010058790A (ko) 반도체 패키지
JPH0250464A (ja) 格子配列形半導体素子パッケージ