JPS59151445A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS59151445A
JPS59151445A JP2507083A JP2507083A JPS59151445A JP S59151445 A JPS59151445 A JP S59151445A JP 2507083 A JP2507083 A JP 2507083A JP 2507083 A JP2507083 A JP 2507083A JP S59151445 A JPS59151445 A JP S59151445A
Authority
JP
Japan
Prior art keywords
semiconductor device
external terminals
module
sides
modules
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2507083A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0150109B2 (enrdf_load_stackoverflow
Inventor
Masahiko Tsumori
昌彦 津守
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP2507083A priority Critical patent/JPS59151445A/ja
Publication of JPS59151445A publication Critical patent/JPS59151445A/ja
Publication of JPH0150109B2 publication Critical patent/JPH0150109B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2507083A 1983-02-17 1983-02-17 半導体装置 Granted JPS59151445A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2507083A JPS59151445A (ja) 1983-02-17 1983-02-17 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2507083A JPS59151445A (ja) 1983-02-17 1983-02-17 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP533389A Division JPH0271551A (ja) 1989-01-12 1989-01-12 半導体装置

Publications (2)

Publication Number Publication Date
JPS59151445A true JPS59151445A (ja) 1984-08-29
JPH0150109B2 JPH0150109B2 (enrdf_load_stackoverflow) 1989-10-27

Family

ID=12155659

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2507083A Granted JPS59151445A (ja) 1983-02-17 1983-02-17 半導体装置

Country Status (1)

Country Link
JP (1) JPS59151445A (enrdf_load_stackoverflow)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59117147A (ja) * 1982-12-23 1984-07-06 Matsushita Electric Ind Co Ltd 複合電子部品

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59117147A (ja) * 1982-12-23 1984-07-06 Matsushita Electric Ind Co Ltd 複合電子部品

Also Published As

Publication number Publication date
JPH0150109B2 (enrdf_load_stackoverflow) 1989-10-27

Similar Documents

Publication Publication Date Title
JP2568748B2 (ja) 半導体装置
JP3656861B2 (ja) 半導体集積回路装置及び半導体集積回路装置の製造方法
JPH05226803A (ja) 実装回路基板
JPH06111869A (ja) 表面実装用端子
JPH0239587A (ja) 高密度実装プリント板
JPS59151445A (ja) 半導体装置
JPH02134890A (ja) 回路素子実装基板
JPH02156558A (ja) 半導体装置のリードフレームおよびこれを用いた半導体装置の製造方法
JP2541532B2 (ja) 半導体モジュ―ル
JP2705468B2 (ja) 混成集積回路装置
JPH0271551A (ja) 半導体装置
JP2588956B2 (ja) ジグザグインライン型モジュ−ルおよびジグザグインライン型モジュ−ルの製造方法
JPH0458189B2 (enrdf_load_stackoverflow)
JPH01209194A (ja) 集積回路装置
JPH0587869U (ja) 電子部品
JPS5939419Y2 (ja) ジヤンパユニツト
JPH04267361A (ja) リードレスチップキャリア
JPH0528917B2 (enrdf_load_stackoverflow)
JPH02239577A (ja) 表面実装用混成集積回路
JPH0514516Y2 (enrdf_load_stackoverflow)
JPH0417279A (ja) Ｉｃカード用コネクタ
JPH11243174A (ja) 半導体装置および半導体パッケージユニット
JPH01125571U (enrdf_load_stackoverflow)
KR20010058790A (ko) 반도체 패키지
JPH10199899A (ja) 半導体装置の製造方法