JPH0150109B2 - - Google Patents

Info

Publication number
JPH0150109B2
JPH0150109B2 JP58025070A JP2507083A JPH0150109B2 JP H0150109 B2 JPH0150109 B2 JP H0150109B2 JP 58025070 A JP58025070 A JP 58025070A JP 2507083 A JP2507083 A JP 2507083A JP H0150109 B2 JPH0150109 B2 JP H0150109B2
Authority
JP
Japan
Prior art keywords
semiconductor device
module
external terminals
circuit board
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58025070A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59151445A (ja
Inventor
Masahiko Tsumori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP2507083A priority Critical patent/JPS59151445A/ja
Publication of JPS59151445A publication Critical patent/JPS59151445A/ja
Publication of JPH0150109B2 publication Critical patent/JPH0150109B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49541Geometry of the lead-frame
    • H01L23/49548Cross section geometry
    • H01L23/49551Cross section geometry characterised by bent parts
    • H01L23/49555Cross section geometry characterised by bent parts the bent parts being the outer leads
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3421Leaded components
    • H05K3/3426Leaded components characterised by the leads

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2507083A 1983-02-17 1983-02-17 半導体装置 Granted JPS59151445A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2507083A JPS59151445A (ja) 1983-02-17 1983-02-17 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2507083A JPS59151445A (ja) 1983-02-17 1983-02-17 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP533389A Division JPH0271551A (ja) 1989-01-12 1989-01-12 半導体装置

Publications (2)

Publication Number Publication Date
JPS59151445A JPS59151445A (ja) 1984-08-29
JPH0150109B2 true JPH0150109B2 (enrdf_load_stackoverflow) 1989-10-27

Family

ID=12155659

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2507083A Granted JPS59151445A (ja) 1983-02-17 1983-02-17 半導体装置

Country Status (1)

Country Link
JP (1) JPS59151445A (enrdf_load_stackoverflow)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59117147A (ja) * 1982-12-23 1984-07-06 Matsushita Electric Ind Co Ltd 複合電子部品

Also Published As

Publication number Publication date
JPS59151445A (ja) 1984-08-29

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