JPS59145549A - 電子部品 - Google Patents

電子部品

Info

Publication number
JPS59145549A
JPS59145549A JP1998183A JP1998183A JPS59145549A JP S59145549 A JPS59145549 A JP S59145549A JP 1998183 A JP1998183 A JP 1998183A JP 1998183 A JP1998183 A JP 1998183A JP S59145549 A JPS59145549 A JP S59145549A
Authority
JP
Japan
Prior art keywords
lead
electronic parts
resin
rubber material
supportor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1998183A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0526339B2 (enrdf_load_stackoverflow
Inventor
Tomoharu Tanaka
田中　伴治
Kiyoshi Sawairi
澤入　精
Ryosuke Hosobane
細羽　良弼
Akira Shinohara
篠原　彰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP1998183A priority Critical patent/JPS59145549A/ja
Publication of JPS59145549A publication Critical patent/JPS59145549A/ja
Publication of JPH0526339B2 publication Critical patent/JPH0526339B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H05K13/0426—Feeding with belts or tapes for components being oppositely extending terminal leads

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1998183A 1983-02-09 1983-02-09 電子部品 Granted JPS59145549A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1998183A JPS59145549A (ja) 1983-02-09 1983-02-09 電子部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1998183A JPS59145549A (ja) 1983-02-09 1983-02-09 電子部品

Publications (2)

Publication Number Publication Date
JPS59145549A true JPS59145549A (ja) 1984-08-21
JPH0526339B2 JPH0526339B2 (enrdf_load_stackoverflow) 1993-04-15

Family

ID=12014353

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1998183A Granted JPS59145549A (ja) 1983-02-09 1983-02-09 電子部品

Country Status (1)

Country Link
JP (1) JPS59145549A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH065759A (ja) * 1992-06-23 1994-01-14 Sharp Corp 半導体デバイスの製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55103753A (en) * 1979-02-05 1980-08-08 Hitachi Ltd Electronic component

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55103753A (en) * 1979-02-05 1980-08-08 Hitachi Ltd Electronic component

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH065759A (ja) * 1992-06-23 1994-01-14 Sharp Corp 半導体デバイスの製造方法

Also Published As

Publication number Publication date
JPH0526339B2 (enrdf_load_stackoverflow) 1993-04-15

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