JPS59145549A - 電子部品 - Google Patents
電子部品Info
- Publication number
- JPS59145549A JPS59145549A JP58019981A JP1998183A JPS59145549A JP S59145549 A JPS59145549 A JP S59145549A JP 58019981 A JP58019981 A JP 58019981A JP 1998183 A JP1998183 A JP 1998183A JP S59145549 A JPS59145549 A JP S59145549A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- electronic parts
- resin
- rubber material
- supportor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
- H05K13/0426—Feeding with belts or tapes for components being oppositely extending terminal leads
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58019981A JPS59145549A (ja) | 1983-02-09 | 1983-02-09 | 電子部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58019981A JPS59145549A (ja) | 1983-02-09 | 1983-02-09 | 電子部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59145549A true JPS59145549A (ja) | 1984-08-21 |
| JPH0526339B2 JPH0526339B2 (enrdf_load_stackoverflow) | 1993-04-15 |
Family
ID=12014353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58019981A Granted JPS59145549A (ja) | 1983-02-09 | 1983-02-09 | 電子部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59145549A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH065759A (ja) * | 1992-06-23 | 1994-01-14 | Sharp Corp | 半導体デバイスの製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55103753A (en) * | 1979-02-05 | 1980-08-08 | Hitachi Ltd | Electronic component |
-
1983
- 1983-02-09 JP JP58019981A patent/JPS59145549A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55103753A (en) * | 1979-02-05 | 1980-08-08 | Hitachi Ltd | Electronic component |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH065759A (ja) * | 1992-06-23 | 1994-01-14 | Sharp Corp | 半導体デバイスの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0526339B2 (enrdf_load_stackoverflow) | 1993-04-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5105261A (en) | Semiconductor device package having particular lead structure for mounting multiple circuit boards | |
| JPS59145549A (ja) | 電子部品 | |
| JPS5923100B2 (ja) | 電子部品群の製造方法 | |
| JPH01235360A (ja) | 半導体集積回路装置 | |
| JPH02269609A (ja) | テーピング電子部品の製造方法 | |
| JPH05211280A (ja) | 混成集積回路装置 | |
| JPH04184968A (ja) | 電子部品およびその製造に用いるリードフレームならびに電子部品の実装方法 | |
| JPS5915518Y2 (ja) | 分割印刷配線板 | |
| JPH0411984Y2 (enrdf_load_stackoverflow) | ||
| JPS6219573Y2 (enrdf_load_stackoverflow) | ||
| JP2938010B1 (ja) | 半導体装置実装位置決め治具及び半導体装置の実装位置決め方法 | |
| JP2003110204A (ja) | プリアセンブルド基板 | |
| JPH02199856A (ja) | Ic用パッケージ | |
| JPS59147449A (ja) | 電子部品の製造方法 | |
| JPH0228358A (ja) | 集積回路素子の実装方法 | |
| JPH06268342A (ja) | 回路基板 | |
| JPS6223478B2 (enrdf_load_stackoverflow) | ||
| US6076680A (en) | Taped electronic components | |
| JPH0779194B2 (ja) | フレキシブル基板への電気部品の実装方法 | |
| JPS6356984A (ja) | プリント基板の製造方法 | |
| JP2000012995A (ja) | 回路基板に対する端子部品の取付け装置 | |
| JPH0548239A (ja) | 回路基板の形成方法 | |
| JPH0471286A (ja) | 集合基板 | |
| JPH0376691A (ja) | 部品実装基板 | |
| JPS5999788A (ja) | 微小電子部品の実装方法 |