JPS59134852A - 集積回路パツケ−ジ - Google Patents

集積回路パツケ−ジ

Info

Publication number
JPS59134852A
JPS59134852A JP58007306A JP730683A JPS59134852A JP S59134852 A JPS59134852 A JP S59134852A JP 58007306 A JP58007306 A JP 58007306A JP 730683 A JP730683 A JP 730683A JP S59134852 A JPS59134852 A JP S59134852A
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit package
insulating substrate
thermal expansion
cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58007306A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0117258B2 (cg-RX-API-DMAC10.html
Inventor
Satoru Ogiwara
荻原　覚
Hironori Kodama
弘則 児玉
Katsuhiro Sonobe
薗部　勝弘
Hiroaki Doi
土居　博昭
Fumiyuki Kobayashi
小林　二三幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58007306A priority Critical patent/JPS59134852A/ja
Priority to GB08401603A priority patent/GB2135513B/en
Priority to DE19843401984 priority patent/DE3401984A1/de
Publication of JPS59134852A publication Critical patent/JPS59134852A/ja
Publication of JPH0117258B2 publication Critical patent/JPH0117258B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W76/18—
    • H10W70/692—
    • H10W76/157—
    • H10W76/60—
    • H10W70/682—
    • H10W72/884—
    • H10W76/63—
    • H10W90/756—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP58007306A 1983-01-21 1983-01-21 集積回路パツケ−ジ Granted JPS59134852A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP58007306A JPS59134852A (ja) 1983-01-21 1983-01-21 集積回路パツケ−ジ
GB08401603A GB2135513B (en) 1983-01-21 1984-01-20 Packaged integrated circuit device
DE19843401984 DE3401984A1 (de) 1983-01-21 1984-01-20 Verkapselte integrierte schaltung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58007306A JPS59134852A (ja) 1983-01-21 1983-01-21 集積回路パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS59134852A true JPS59134852A (ja) 1984-08-02
JPH0117258B2 JPH0117258B2 (cg-RX-API-DMAC10.html) 1989-03-29

Family

ID=11662323

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58007306A Granted JPS59134852A (ja) 1983-01-21 1983-01-21 集積回路パツケ−ジ

Country Status (3)

Country Link
JP (1) JPS59134852A (cg-RX-API-DMAC10.html)
DE (1) DE3401984A1 (cg-RX-API-DMAC10.html)
GB (1) GB2135513B (cg-RX-API-DMAC10.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6247153A (ja) * 1985-08-27 1987-02-28 Ibiden Co Ltd 半導体装置
JPH03194952A (ja) * 1989-12-22 1991-08-26 Nec Corp セラミックパッケージ
JP2018207004A (ja) * 2017-06-07 2018-12-27 京セラ株式会社 セラミック板、半導体装置および半導体モジュール

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3603912A1 (de) * 1985-02-09 1986-08-14 Alps Electric Co., Ltd., Tokio/Tokyo Elektronischer netzwerk-baustein und verfahren zur herstellung desselben
US4729010A (en) * 1985-08-05 1988-03-01 Hitachi, Ltd. Integrated circuit package with low-thermal expansion lead pieces
GB2197540B (en) * 1986-11-12 1991-04-17 Murata Manufacturing Co A circuit structure.
JP2572823B2 (ja) * 1988-09-22 1997-01-16 日本碍子株式会社 セラミック接合体
JPH04322452A (ja) * 1991-04-23 1992-11-12 Mitsubishi Electric Corp 半導体装置、半導体素子収納容器および半導体装置の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4954418A (cg-RX-API-DMAC10.html) * 1972-09-27 1974-05-27
JPS5389664A (en) * 1977-01-19 1978-08-07 Hitachi Ltd Package structure of semiconductor device
JPS55143042A (en) * 1979-04-25 1980-11-08 Hitachi Ltd Semiconductor device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3646405A (en) * 1969-01-08 1972-02-29 Mallory & Co Inc P R Hermetic seal
JPS52116074A (en) * 1976-03-26 1977-09-29 Hitachi Ltd Electronic part
US4161743A (en) * 1977-03-28 1979-07-17 Tokyo Shibaura Electric Co., Ltd. Semiconductor device with silicon carbide-glass-silicon carbide passivating overcoat
EP0028802B1 (en) * 1979-11-05 1983-08-17 Hitachi, Ltd. Electrically insulating substrate and a method of making such a substrate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4954418A (cg-RX-API-DMAC10.html) * 1972-09-27 1974-05-27
JPS5389664A (en) * 1977-01-19 1978-08-07 Hitachi Ltd Package structure of semiconductor device
JPS55143042A (en) * 1979-04-25 1980-11-08 Hitachi Ltd Semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6247153A (ja) * 1985-08-27 1987-02-28 Ibiden Co Ltd 半導体装置
JPH03194952A (ja) * 1989-12-22 1991-08-26 Nec Corp セラミックパッケージ
JP2018207004A (ja) * 2017-06-07 2018-12-27 京セラ株式会社 セラミック板、半導体装置および半導体モジュール

Also Published As

Publication number Publication date
GB2135513B (en) 1987-08-19
JPH0117258B2 (cg-RX-API-DMAC10.html) 1989-03-29
DE3401984A1 (de) 1984-07-26
GB2135513A (en) 1984-08-30
GB8401603D0 (en) 1984-02-22

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